UC C200T--GL L Hardw warre Des D sign n UMTS S/HSPA+ + Module e Series Rev. UC200T--GL_Hard dware_De esign_V1 1.0 4 Date: 2019-10-14 Status: Releassed www.quectel.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Our aim is to prov vide custo omers witth timely and comprehensiv ve service e. For any y assistanc ce, please contact our o compa any headquarters: W S Solutions C Ltd. Co., Quectel Wireless Building 5, Shanghai Business Park P Phase e III (Area B), No.1016 Tianlin R Road, Minha ang Districtt, Shanghai, China C 20023 33 Tel: +86 21 5108 6236 Email:info@ @quectel.com m Or our loc cal office. For more informatiion, please e visit: http://www.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Abou ut the e Doc cument History y Revision Date A Author Des scription 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Contents s About the Document D .................................................................................................................................... 2 Contents ......................................................................................................................................................... 3 Table Index x .......................................................................................................
HSPA+ Mod dule Series s UMTS/H UC200T T-GLHardw ware Design n 3.15. 3.16. 3.17. STATUS .................................................................................................................................. 52 2 Behaviors of o the MAIN_RI....................................................................................................... 53 FORCE_USB_BOOT Interface I ...............................................................................................
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Table Index TABLE 1: UC C200T-GL-E EM FREQUENCY BANDS S............................................................................................. 14 4 TABLE 2: UC C200T-GL-G GL FREQUEN NCY BANDS S ............................................................................................. 14 4 TABLE 3: KE EY FEATURES OF UC20 00T-GL MOD DULE ......................................................................................
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n TABLE 41: EDGE E MODU ULATION AN ND CODING SCHEMES ............................................................................
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Figure In ndex FIGURE 1: FUNCTIONA F AL DIAGRAM M ................................................................................................................. 17 7 FIGURE 2: PIN P ASSIGN NMENT (TOP P VIEW) ...................................................................................................... 20 0 FIGURE 3: SLEEP S MOD DE APPLICAT ATION VIA UA ART ...............................................................................
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n FIGURE 39:: RECOMME ENDED FOO OTPRINT (TO OP VIEW) ............................................................................... 75 5 FIGURE 40:: TOP VIEW OF THE MO ODULE ........................................................................................................ 76 6 FIGURE 41:: BOTTOM VIEW V OF THE MODULE .................... . ...........................................................................
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 1 In ntrod ductio on This docum ment defines UC200T-GL L module an nd describes s its air interface and ha ardware inte erface which h are connectted with customers’ app plications. This docum ment helps customers quickly understand module m interrface speciffications, electrical and d mechanical details, ass well as other o relate ed informatiion of UC2 200T-GL mo odule.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n ❒ GSM19 900: <9.360d dBi ❒ WCDM MA B2: <8.00 00dBi ❒ WCDM MA B5: <9.41 16dBi 5. This mo odule must not n transmit simultaneou s usly with any y other anten nna or transsmitter 6. The host end producct must include a user manual m that clearly c define es operating g requirements and d to ensure compliance c with currentt FCC RF exxposure guid delines.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n The final host / modu ule combinattion may alsso need to be e evaluated against the FCC Part 15B 1 criteria entional radia ators in orde er to be prop perly authoriized for operation as a P Part 15 digittal device.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 1.1. Safe ety Inform mation The followin ng safety pre ecautions must m be obse erved during g all phases of operation, such as usage, u serviice module. Ma or repair of any cellularr terminal or mobile inco orporating UC200T-GL U anufacturers of the cellular terminal sho ould send th he following g safety info ormation to users and operating o pe ersonnel, an nd incorpora ate these guide elines into all manualss supplied with the prroduct.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n In locations with potentially explosive atmosph heres, obey all posted signs s to turn n o wireless devices such as your phone or other off o cellula ar terminals. Areas with h p potentially e explosive atm mospheres include fuelling areas, below deck ks on boatss, f fuel or chemical transsfer or storrage facilitie es, areas w where the air containss c chemicals orr particles su uch as grain n, dust or me etal powderss, etc.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 2 P Produ uct Co oncept 2.1. Gen neral Des scription L is a WCDM MA/GSM wirreless comm munication module. m Itsge eneralfeaturresarelistedb below： UC200T-GL Supporrt HSDPA, HSUPA, H HSP PA+, WCDM MA, EDGE, GSM G and GP PRS covera age. Provide e audio supp port for custo omers’ speccific applicattions. UC200T-GL Lis available e in two varriants:UC200 0T-GL-EM and a UC200T T-GL-GL.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 2.2. Key y Feature es The followin ng table describes the detailedfeatu ures of UC20 00T-GL mod dule. ey Features s of UC200T T-GL Module Table 3: Ke Feature Details s Power Sup pply Supplyy voltage: 3.4V~4.5V Typica al supply volttage: 3.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Audio Feattures Suppo ort one digita al audio interrface: PCM interface GSM: HR/FR/EFR R/AMR/AMR R-WB WCDM MA: AMR/AM MR-WB Suppo ort echo canccellation and d noise supp pression PCM Interfface Used for f audio fun nction with an a external codec c chip Suppo ort 16-bit line ear data form mat Suppo ort short fram me synchron nization Suppo ort master an nd slave modes USB Interfface UART Inte erface Complliant with US SB 2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n NOTES 1. 2. 1) Within n the operation temperature range, the module is 3GPP compliant. Within n the extend ded tempera ature range, the module remains the e ability to e establish and maintain a voice, SMS, S data transmission n, emergenccy call, etc. There is no o unrecovera able malfun nction. There e are also o no effects on o radio spe ectrum and no n harm to ra adio network.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 2.4. Evaluation Board B In order to help custom mers to devvelop appliccations with UC200T-G GL, Quectel provides an n evaluation n board (EVB B), USB to RS-232 R convverter cable, earphone, antenna a and d other perip pherals to co ontrol or tesst the module.. For more details, d pleasse refer to document d [4 4].
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3 A Applic cation n Inte erface es 3.1. Gen neral Des scription UC200T-GL L is equippe ed with 80 LCC pins and a 64 LGA A pins, which can be embedded into cellular application platforms. The T following g sections provide detailed descriptions of pins//interfaces liisted below.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.2. Pin Assignm ment The followin ng figure sho ows the pin assignment of UC200T--GL module.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 4. The fun nction of the e SD card intterface is un nder develop pment. 3.3. Pin Descripttion The followin ng tables sho ow the pin definition d of UC200T-GL L module.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 85~112 2 Power Supply Outpu ut Pin Name VDD_EXT T Pin No o. 7 I/O Descriptio on DC Charac cteristics Comment Power supp ply for external GP PIO’s pull up p circuits. If unused, keep k it open n. PO Provide 1.8V for external circuit Vnorm=1.8 8V IOmax=50m mA Power on//off Pin Name Pin No. N I/O Descriptio on DC Characteristics Commen nt RESET_N 20 DI Reset the module Active Low w. VILmax=0.5V If unused, keep it open.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n USB_VBU US 71 AI USB connection detection Vmax=5.25V Vmin=3.0V V Vnorm=5.0 0V Typical: 5.0V 5 If unused, keep it open. I/O Descriptio on DC Characteristics Commen nt (U)SIM Intterface Pin Name USIM_GND USIM_DET T Pin No. N 10 13 A GND piin used to connect (U)SIM card connector. Dedicated ground for (U)SIM M DI (U)SIM card detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2 2V VIHmax=2.0V 1.8V pow wer domain. If unused, keep it open.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2..55V Main UAR RT Interface e Pin Name MAIN_RI MAIN_DCD D MAIN_CTS S MAIN_RTS S Pin No. N 62 63 64 65 I/O Descriptio on DC Characteristics Commen nt DO Ring indica ation VOLmax=0.45V VOHmin=1..35V 1.8V pow wer domain. If unused, keep it open. DO Data carrie er detection VOLmax=0.45V VOHmin=1..35V 1.8V pow wer domain. If unused, keep it open. Clear to se end VOLmax=0.45V VOHmin=1..35V 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n ADC Interrfaces Pin Name ADC1 ADC0 Pin No. N 44 45 I/O Descriptio on DC Characteristics Commen nt AI General-pu urpose analog to digital d converter Voltage ran nge: 0V to VBA AT_BB If unused, keep it open. AI General-pu urpose analog to digital d converter Voltage ran nge: 0V to VBA AT_BB If unused, keep it open. I/O Descriptio on DC Characteristics Commen nt PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2 2V VIHmax=2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n capacitor close to the e pin. I2C_SDA 42 OD I2C serial data for external co odec I/O Descriptio on An extern nal 1.8V pull-up re esistor is required. If unused, keep it open. SD Card In nterface* Pin Name SD_DET SD_SDIO_ _ DATA3 SD_SDIO_ _ DATA2 SD_SDIO_ _ DATA1 SD_SDIO_ _ DATA0 SD_SDIO_ _ CLK Pin No. N 23 28 29 30 31 32 DI IO IO IO IO DO DC Characteristics Commen nt SD card de etect 1.8V/2.8V V power domain.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n If unused, keep it open. RF Interfa ace Pin Name Pin No. N I/O Descriptio on DC Characteristics Commen nt ANT_MAIN N 49 IO Main anten nna I/O Descriptio on DC Characteristics Commen nt DI Wake up the module VILmin=-0.3V VILmax=0.6V VIHmin=1.2 2V VIHmax=2.0V 1.8V pow wer domain. If unused, keep it open. DI Application n processor sleep state detecction VILmin=-0.3V VILmax=0.6V VIHmin=1.2 2V VIHmax=2.0V 1.8V pow wer domain.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n “*” means th he function of o SD card interface is under u develo opment. 3.4. Ope erating Modes M The followin ng table brie efly outlines the t operatin ng modes to be mentioned in the folllowing sectiions. verview of Operating O M Modes Table 6: Ov Mode Normal Operation De etails Idle e Software is active. S a The module hassregistered o on the netwo ork, and it iss r ready to sen nd and receiv ve data.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n LK=1 to ena able sleep mode. m Execute AT+QSCL M t a high levvel. to Drive MAIN_DTR The followin ng figure sho ows the connection betw ween the mo odule and th he host. Host Module MAIN_R RXD TX XD MAIN_T TXD R XD MAIN_ _RI EINT MAIN_D DTR GPIO AP_READY GPIO GND G GND Figurre 3: Sleep Mode Application via UART Driving MAIN_DTR R to a low levvel by host will w wake up p the module e.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Host Module USB_VBUS VD DD B_DP USB US SB_DP USB_ _DM US SB_DM AP_READY GP PIO G GND GN ND Fig gure 4: Slee ep Mode Ap pplication with w USB Re emote Wake eup Sending data to UC C200T-GL th hrough USB B will wake up u the module. When UC200T-GL U has a URC to report, th he module will w send rem mote wakeup p signals via USB bus so o as to wake w up the host. h 3.5.1.3.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Sending data to UC C200T-GL th hrough USB B will wake up u the module. When UC200T-GL U has a URC to report, th he URC will trigger the behavior b of M MAIN_RI pin n. 3.5.1.4. US SB Applicattion without USB Susp pend Functtion If the host does d not su upport USB Suspend fu unction, plea ase disconn nect USB_V VBUS with an a additiona al control circu uit to let the module ente er sleep mode. LK=1comma and to enablle the sleep mode.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Software: = proviides the cho oice of the fu unctionality level l through h setting into 0, 1 or 4. AT+CFUN= UN=0: Minim mum functionality mode; both (U)SIM and RF fu unctions are e disabled. AT+CFU mode (by default). AT+CFU UN=1: Full functionality f d AT+CFU UN=4: Airpla ane mode. RF R function is disabled. 3.6. Pow wer Supp ply 3.6.1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.6.2. Dec crease Voltage Drop p The power supply s range of the module is from m 3.4V to 4.5 5V. Please make m sure th hat the inputt voltage willl never drop below 3.4V V. The follow wing figure shows the voltage dro op during bu urst transmiission in 2G G network. Th he voltage drrop will be le ess in 3G ne etworks. Burst Trransmission Burst Transmission VBAT Ripple Drop Min.3.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.6.3. Refference De esign for Power P Supply Power desig gn for the module m is verry important, as the perfformance off the module e largely dep pends on the e power sourcce. The pow wer supply should s be able a to proviide sufficien nt current up p to 2.0A at least to the e module. If the t voltage drop betwe een the inpu ut and outpu ut is not too o high, it is ssuggested that t an LDO O should be used u to sup pply power for f the module.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n PWRKEY Y ≥ 500ms 4.7 7K 10nF Turn n-on pulse 4 47K Figure 10:: Reference e Circuit of Turing T on the t Module Using Driv ving Circuit The other way w to contro ol the PWRK KEY is using g a button directly. d Whe en pressing the key, an electrostaticc strike may generate g fro om the finge er. Therefore e, a TVS co omponent is indispensab ble to be pla aced nearbyy the button fo or ESD prottection.
HSPA+ Mod dule Series s UMTS/H UC200T T-GLHardw ware Design n The timing of o turning on n the module e is illustrate ed in the following figure e. N NOTE 1 VBAT ≥ ≥500ms PWRKEY VIL≤0.5V About 5ms VDD_EXT ≥100 0ms. After this time, the pin can c be set high le evel by an extternal circuit. FORCE_USB_BOOT About 22m ms RESET_N ≥10s STATUS (OD) ≥10s UART I nactive Active ≥10s USB Inactive Active Figurre 12: Timin ng of Turnin ng on the Module M NOTES 1. 2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.7.2.1. Tu urn off the Module M Usin ng the PWR RKEY Pin Driving the PWRKEY pin p to a low--level voltage for at leas st 650ms, th he module w will execute power-down n procedure after a the PW WRKEY is released. The timing of turrning off the module is illustrated intthe following g figure. VBA T ≥650ms ≥2s Y PWRKEY STATUS S (OD) Module Status RUNNIING Pow wer-down proc cedure OFF Figurre 13: Timin ng of Turnin ng off the Module M 3.7.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.7.3. Res set the Mo odule The RESET T_N pin can be used to o reset the module. m The module can n be reset b by pulling the RESET_N N pin low for at a least 300m ms and then n releasing it. i The RESET_N signa al is sensitive e to interfere ence, so it iss recommend ded that the traces betw ween the RE ESET_N pin n and custom mers’ device e should be e as short ass possible and d must be encircled e by ground trace es.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Figure 15: 1 Referen nce Circuit of o Resetting g the Modu ule by Using g Button The timing of o resetting module is illlustrated inth he following figure. VB BAT ≥300ms RE ESET_N VIL ≤0.5V Mo odule Sta atus Running Ba aseband resettiing Base eband restart Fig gure 16: Tim ming of Res setting Mod dule NOTES 1. 2. 3.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n USIM_VDD D 14 PO Power supp ply for (U)SIM card USIM_DAT TA 15 IO (U)SIM data a USIM_CLK K 16 DO (U)SIM clocck USIM_RST T 17 DO (U)SIM rese et Either 1.8V V or 3.0V (U U)SIM card iss supported and can be b identified d automatica ally by the module. m UC200T-GL L supports (U)SIM card hot-plug via a the USIM_ _DET pin. The T function n supports lo ow-level and d high-level detections.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n USIM_V VDD 15K 1 100nF USIM_GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA A (U)SIM Card Connector C VCC RST CLK 0R GND VPP IO 0R 0R 33pF 3 33pF 33pF GND GND Figu ure 18: Refe erence Circ cuit of (U)SIIM Interface e with a 6-p pin (U)SIM C Card Conne ector In order to enhance the e reliability and availab bility of the (U)SIM ( card d in custome ers’ applicattions, please e follow the crriteria below w in (U)SIM circuit c design:
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Table 11: Pin P Descripttion of USB B Interface Pin Name Pin No o. I/O Desc cription Commentt USB_DP 69 IO USB differential data d (+) 90Ω differential impedance e USB_DM 70 IO USB differential data d (-) 90Ω differential impedance e USB_VBU US 71 AI USB connection detection Typical 5.0 0V GND 72 Ground For more de etails about the USB 2.0 0 specificatio ons, please visithttp://ww ww.usb.org//home.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n of USB B differential trace is 90Ω Ω. Do not route signa al traces under crystalss, oscillators s, magnetic devices and d RF signal traces. It iss importa ant to route the t USB diffferential tracces in inner--layer of the e PCB, and ssurround the e traces with h ground on that laye er and groun nd planes ab bove and be elow. Please pay attentiion to the selection s of the ESD component c o the USB on B data line.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Table 13: Pin P Definitio on of the De ebug UART T Interface Pin Name Pin No. N I/O O De escription Commen nt DBG_RXD D 11 DI De ebug receive e data DBG_TXD D 12 DO O De ebug transm mit data 1.8V pow wer domain. The logic levels are desscribed in the following table. t Table 14:Lo ogic Levels s of Digital I/O I Parameterr Min n. Max. Unit VIL -0.3 3 0.6 V VIH 1.2 2 2.0 V VOL 0 0.45 V VOH 1.3 35 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n F Figure 20: Reference R C Circuit with a Level Tra anslator Chip Please visit http://www.ti.comfor mo ore informattion. Another exa ample with trransistor translation circcuit is shown n below. For the design of circuits in n dottedliness, please referr to that of th he circuits in n solid lines, but please pay attentio on to the dire ection of con nnection. VDD_EXT MCU/A ARM 4.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n UC200T-GL L supports 16-bit 1 linearr data format. The follo owing figure e shows the eprimary mode’s timing g relationship with 8kHz PCM_SYNC P C and 2048kkHz PCM_CLK. 12 25us P CM _CLK 1 2 255 256 P CM _S YNC MS B LS B MS B MS B LS B MS B P CM _DOUT P CM _DIN Figure 22: Primary Mo ode Timing g ng table sho ows the pin definition of o PCM and I2C interfacces which ccan be applied on audio o The followin codec desig gn.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n the pin. I2C_SCL I2C_SDA 41 42 OD I2C serial clock forr an externa al codec An extern nal 1.8V pulll-up resistor is require ed. If unused d, it is recom mmended to mount a 3 33pF capacitor close to the pin. OD I2C serial data for an external codec An extern nal 1.8V pulll-up resistor is require ed. If unused d, keep it ope en.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.12. SD D Card Interface* UC200T-GL L provides an SD card in nterface, wh hich complies with SD 3.0 specificattion. The followin ng table shows the pin definition d of the t SD card d interface. P Definitio on of SD Ca ard Interface e Table 16: Pin Pin Name Pin No. I/O Description n Comment SD_DET 23 DI S card dettect SD 1.8V//2.8V powerr domain. If unu used, keep it open. SD_SDIO_ _DATA3 28 IO S card SD SD DIO data bit 3 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n The followin ng figure sho ows a refere ence design of the SD card interface e.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n NOTE “*” means th he function of o the SD ca ard interface e is under de evelopment. 3.13. AD DC Interfa aces e provides tw wo analog-to o-digital con nverter (ADC C) interfacess. AT+QADC C=0can be used u to read d The module the voltage value on ADC0 pin. AT T+QADC=1 can be use ed to read the voltage vvalue on AD DC1 pin. For mands, pleasse refer to th he documen nt [2].
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 3.14. Network Sttatus Ind dication The network indication pins can be e used to drive network k status indiication LEDss. The module providess two pins wh hich are NE ET_MODE and a NET_ST TATUS for network n stattus indicatio on. The follo owing tabless describe pin n definition and a logic levvel changes in different network stattus. Table 19: Pin P Definitio on of Netwo ork Connection Status/Activity Indication Pin Name Pin No.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n A reference e circuit is sh hown in the following f figure. M Module VB BAT 2.2K K Network Indicator 4.7K K 47K Figure 25: Refference Circ cuit of the Network N Sta atus Indication 3.15. STA TATUS The STATUS pin is an open o drain output o for the e module’s operation o sttatus indication. It can be connected d to a GPIO of o DTE with a pulled-up resistor, or as an LED indication ciircuit as belo ow.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n The followin ng figure sh hows different circuit de esigns of ST TATUS, and d customers can choose either one e according to o the applica ation deman nds. Mod dule Mod dule VDD_MCU VBAT 10K K 2.2K ST TATUS MCU_ _GPIO ST TATUS Figu ure 26: Refe erence Circ cuits of STA ATUS NOTE The status pin p cannot be b used as an a indication n of module shutdown sttatus when V VBAT is rem moved. 3.16.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n In addition, the MAIN_R RI behavior can c be conffigured flexib bly. The defa ault behavior of the MAIN_RI is shown below w. Table 22: Behaviors B o the MAIN_ of _RI State R Response Idle M MAIN_RI ke eeps at a hig gh level URC M MAIN_RI ou utputs 120ms low pulse when a new w URC is retturned The MAIN_RI behaviorr can be cha anged via AT T+QCFG="u urc/ri/ring" *. Please re efer to docu ument [2] for details.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n The followin ng figure sho ows a refere ence circuit of o FORCE_U USB_BOOT T interface. Module VDD_EXT Test points FORCE_ _USB_BOOT 4.7K p Close to test points TV VS Figure 27: Refference Circ cuit of FOR RCE_USB_B BOOT Interfface E1 NOTE VBAT PWRK KEY VDD_E EXT FORCE_ USB_B BOOT ms ≥500m VIL≤0 0.5V Approx. 5ms FOR RCE_USB_BO OOT can be pulled p up to 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n force th he module to o enter down nload mode.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 4 A Anten nna In nterfa ace UC200T-GL L provides one o main anttenna interfa ace with an impedance of 50Ω. 4.1. Main n Antenn na Interfa ace 4.1.1. Pin n Definition n The pin defiinition of the e main anten nna interface e is shown below. b P Definitio on of the RF F Antenna Table 24: Pin Pin Name Piin No. I/O Descriptio on Commentt ANT_MAIN N 49 9 IO Main anten nna 50Ωimped dance 4.1.2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Table 25: UC200T-GLU -GL Module e Operating g Frequencies 3GPPBand Transmit Receive e Unit U GSM850 824~850 869~894 4 MHz M EGSM900 880~915 925~960 0 MHz M DCS1800 1710~1785 1805~18 880 MHz M PCS1900 185 50~1910 1930~19 990 MHz M WCDMA B1 B 1920~1980 2110~21 170 MHz M WCDMA B2 B 185 52~1908 1932~19 988 MHz M WCDMA B5 B 826 6~847 871~892 2 MHz M WCDMA B6 B 832~838 877~883 3 MHz M WCDMA B8 B 880~915 925~960 0
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 4.1.4. Refference De esign of RF R Layout For user’s PCB, the characteristtic impedan nce of all RF R traces should s be ccontrolled to o 50Ω. The e impedance of the RF tra aces is usua ally determin ned by the trrace width (W W), the mate erials’ dielec ctric constan nt, height from the referencce ground to o the signal layer (H), an nd the spaciing between n RF traces and a groundss (S).
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Figure e 32: Coplanar Waveguide Design n on a 4-lay yer PCB (La ayer 3 as Re eference Grround) Figure e 33: Coplanar Waveguide Design n on a 4-lay yer PCB (La ayer 4 as Re eference Grround) In order to ensure e RF performance p e and reliabiility, the follo owing principles should be complie ed with in RF F layout desig gn: Use an n impedance e simulation tool to accurately conttrol the charracteristic im mpedanceof RF tracesto o 50
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 4.2. Ante enna Ins stallation n 4.2.1. Anttenna Req quirement The followin ng table shows the requirements on n the main antenna. A Req quirements s Table 26: Antenna Type Requirem ments GSM/WCD DMA VSWR:≤2 Efficiency: >30% Max inputt power: 50W W Input impe edance: 50Ω Ω Cable inse ertion loss: <1dB < (GSM850//EGSM900, WCDMA B5/B6/B8) Cable inse ertion loss <1.5dB < (DCS1800 0/PCS1900, WCDMA B1/B2) 4.2.2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n U.FL-LP serial connecto ors listed in the following figure can n be used to match the U U.FL-R-SMT T. Figure 35: Mechan nicals of U.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n The followin ng figure desscribes the space s factorr of mated connectors. F Figure 36: Space S Facto or of Mated Connectorrs (Unit: mm m) For more de etails, please visithttp://h hirose.com.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 5 Electrrical, Relia E ability y and d Rad dioCharactteristtics 5.1. Abs solute Ma aximum Ratings Absolute maximum ratings for pow wer supply and a voltage e on digital and a analog pins of the module are e listed in the following ta able. Table 27: Absolute A Ma aximum Ratings Parameterr Min n. M Max. Un nit VBAT_RF//VBAT_BB -0.3 3 6 6.0 V USB_VBU US -0.3 3 5 5.5 V Peak Curre ent of VBAT T_BB 0 0 0.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 5.2. Pow wer Supp ply Rating gs Table 28: The T Module Power Sup pply Ratings Parameterr Description Conditiions Min. Ty yp. Max x. Unit VBAT_ _BB and VBAT_ _RF The acttual input vo oltages must be e kept betwe een the minimum and maximum values. 3.4 3.8 8 4.5 V Voltage e drop during g burst trransmission Maximu um power co ontrol level on GSM M850/EGSM M900.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n operating temperatture levels, the t module will w meet 3G GPP specificcations again n. 5.4. Currrent Con nsumptio on Table 30: UC200T-GLU -EM Curren nt Consump ption Parameterr IVBAT Descripttion Condition n Typical Unit Power offf Module po ower off 14 uA AT+CFUN N=0 (USB diisconnected) 0 1.00 mA EGSM900 0 @DRX=2 (USB discconnected) 2.78 8 mA EGSM900 0 @DRX=5 (USB discconnected) 1.80 0 mA EGSM900 0 @DRX=5 (USB suspend) 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n EGSM900 0 @DRX=5 (USB connected) 33.1 16 mA WCDMA @PF=64 @ (USB discconnected) 34.8 82 mA WCDMA @PF=64 @ (USB connected) 34.9 95 mA EGSM900 0 4DL/1UL @32.58dBm @ m 262.3 mA EGSM900 0 3DL/2UL @32.28dBm @ m 432.5 mA EGSM900 0 2DL/3UL @30.8dBm @ 520.9 mA EGSM900 0 1DL/4UL @28.78dBm @ m 543.5 mA DCS1800 0 4DL/1UL @29.28dBm @ 208.5 mA DCS1800 0 3DL/2UL @29.1dBm @ 320.8 mA DCS1800 0 2DL/3UL @27.51dBm @ 380.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n EGSM900 0 PCL=19 @5.34dBm @ 96.7 7 mA DCS1800 0 PCL=0 @2 29.33dBm 199.3 mA DCS1800 0 PCL=7 @16.11dBm 112..9 mA DCS1800 0 PCL=15 @1.34dBm @ 94.0 0 mA WCDMA B1 B @23.24d dBm 492.9 mA WCDMA B8 B @22.93d dBm 438.3 mA WCDMA A voice call Table 31: UC200T-GLU -GL Current Consump ption Parameterr Descripttion Condition Typica al Unit Power offf Module pow wer off 17 uA AT+CFUN= =0 (USB dis sconnected) 1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Idle mod de GPRS da ata transfer EDGE da ata transfer WCDMA A data transfer WCDMA @ PF=512 (USB disco onnected) 1.75 mA GSM @DR RX=5 (USB disco onnected) 31.67 mA GSM @DR RX=5 (USB conn nected) 28.71 mA WCDMA @PF=64 @ (USB disco onnected) 33.89 mA WCDMA @PF=64 @ (USB conn nected) 30.95 mA EGSM900 4DL/1UL @32.97dBm @ 272.6 mA EGSM900 3DL/2UL @32.7dBm @ 451.1 mA EGSM900 2DL/3UL @31.19dBm @ 536.0 mA EGSM900 1DL/4UL @28.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n WCDMA B2 HSUPA @22.18dBm @ 483.5 mA WCDMA B5 HSDPA @22.82dBm @ 454.1 mA WCDMA B5 HSUPA @21.81dBm @ 442.6 mA WCDMA B6 HSDPA @22.96dBm @ 458.9 mA WCDMA B6 HSUPA @22.62dBm @ 465.3 mA WCDMA B8 HSDPA @22.96dBm @ 474.4 mA WCDMA B8 HSUPA @22.04dBm @ 463.3 mA EGSM900P PCL=5 @32 2.92dBm 266.5 mA EGSM900P PCL=12 @1 19.54dBm 124.6 mA EGSM900P PCL=19 @5 5.27dBm 94.4 mA DCS1800 PCL=0 P @29 9.9dBm 199.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 5.5. RF Output O P Power The followin ng table shows the RF output o power of UC200T T-GL module e. R Output Power P Table 32: RF Frequency y Max. Min.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Table 34：U UC200T-GL L-GL Condu ucted RF Re eceiving Se ensitivity Receive sensitivity Frequency y Primary Dive ersity SIMO 3 3GPP（SIMO O） GSM850 -109.5dBm m NA NA -1 102.4dBm EGSM900 -109.5dBm m NA NA -1 102.4dBm DCS1800 -108.5dBm m NA NA -1 102.4dBm PCS1900 -108dBm NA NA -1 102.4dBm WCDMA B1 B -109.5dBm m NA NA -1 106.7dBm WCDMA B2 B -109.5dBm m NA NA -1 104.7dBm WCDMA B5 B -110dBm NA NA -1 104.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 6 M Mecha anica al Dim mensiions This chapte er describess the mech hanical dime ensions of the module e.All dimenssions are measured m in n millimeter (m mm), and the dimension nal tolerance es are ±0.05 5mm unless otherwise sspecified. 6.1.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Figure 38: Module Bo ottom Dime ensions (Bo ottom View) UC200T-GL L_Hardware e_Design74 4 / 84
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 6.2. Rec commend ded Foottprint Figure 39: Recommended Fo ootprint (To op View) NOTES 1. 2. Pins73~84 and1 117~140 includedinth he keepo out area should not be usedwhen n designiingschematiicsand PCB layout. For easy maintena ance of the e module, please p keep p about 3mm between the module e and other compon nents in the host PCB.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 6.3. Topa and Botttom View wofUC200T-GL F Figure 40: Top T View off the Module Fig gure 41: Bo ottom View of the Module NOTE These are renderings r o UC200T-G of GL module. For authenttic appearan nce, please refer to the module tha at you receive from Quecttel.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 7 Storag S ge, Manuf M facturring and a Packagin ng 7.1. Storrage UC200T-GL Lis stored in n a vacuum-sealed bag.. It is rated at a MSL 3, and its storag ge restrictions are listed d below . 1. Shelf life e in a vacuu um-sealed bag: 12 montths at <40ºC C/90%RH. 2.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 7.2. Man nufacturing and Soldering S g Push the sq queegee to apply the solder s paste e on the surface of ste encil, thus m making the paste p fill the e stencil openings and then penetrrate to the PCB. The force on the t squeege ee should be adjusted d properlyso as a to producce a clean sttencil surfacce on a single pass. To ensure e the m module solde ering qualityy, thethickness of stencil for f the module is recom mmended to be 0.18mm m~0.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n Reflow tim me (D: over 220°C) 2 40 sec ~ 60 0 sec Max tempe erature 238°C ~ 24 45°C Cooling do own slope 1°C/sec ~ 4°C/sec 4 Reflow Cy ycle Max reflow w cycle 1 NOTES 1. During manufacturiing and sold dering, or any other pro ocesses tha at may contact the mod dule directlyy, NEVER R wipe the module’s sh hielding can n with organic solventss, such as acetone, etthyl alcohol, isopropyyl alcohol, trrichloroethylene, etc.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n e p a t r e v o C 48.5 13 100 d e e f f o n o i t c e r i D .20 44.5+0. -0.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 8 A Appen ndix A Refferen nces Table 37: Re elated Docu uments SN Do ocument Na ame Remark [1] Qu uectel_Modu ule_Seconda ary_SMT_User_Guide Module Se econdary SM MT User Guide [2] Qu uectel_UC20 00T-GL_AT_ _Commandss_Manual UC200T-G GL AT Comm mandsManua al [3] Qu uectel_RF_L Layout_Application_Note e RF Layoutt Application n Note [4] Qu uectel_UMTS S<E_EVB B_User_Guiide UMTS< TE EVB use er guide forrUMTS<E E modules Tabl
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n ESD Electro ostatic Disch harge ESR Equiva alent Series Resistance e FDD Freque ency Divisio on Duplex FR Full Ra ate FTP File Trransfer Proto ocol FTPS FTP-o over-SSL GMSK Gausssian Minimum Shift Keyiing GSM Global System forr Mobile Com mmunication ns HR Half Rate R HSPA High Speed S Packe et Access HSDPA High Speed S Down nlink Packet Access HSUPA High Speed S Uplink Packet Ac ccess HTTP Hyperrtext Transfe er Protocol
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n PPP Point-tto-Point Pro otocol PSK Phase e Shift Keyin ng QAM Quadrrature Amplitude Modula ation QPSK Quadrrature Phase e Shift Keyin ng RF Radio Frequency SMS Short Message Se ervice SMTP Simple e Mail Transsfer Protocol SSL Secure e Sockets Layer L TCP Transm mission Con ntrol Protoco ol TDD Time Division D Dup plexing UART Univerrsal Asynchronous Rece eiver &Transmitter UDP User Datagram D Protocol UL Uplinkk UMTS U
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n VOLmax Maxim mum Output Low Level Voltage V Valu ue VOLmin Minimum Output Low L Level Voltage V Value VSWR Voltag ge Standing Wave Ratio o WCDMA Wideb band Code Division D Multtiple Accesss WLAN Wirele ess Local Are ea Network UC200T-GL L_Hardware e_Design84 4 / 84
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 9 A Appen ndix B GP PRS Codin C ng Scheme es D of Different Coding Sc chemes Table 39: Description Scheme C CS-1 CS-2 CS--3 CS-4 Code Rate e 1//2 2/3 3/4 1 USF 3 3 3 3 Pre-coded d USF 3 6 6 12 Radio Blo ock excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bitts 456 588 676 456 Punctured d Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 6 21.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 10 0 Apppendixx C GPRS G S Multti-slot Clas sses Twenty-nine e classes of o GPRS mu ulti-slot mod des are deffined for MS S in GPRS specificatio on. Multi-slo ot classes are product dep pendent, and determine e the maximu um achievab ble data rate es in both th he uplink and d downlink dirrections.
UMTS/H HSPA+ Mod dule Series s UC200T T-GLHardw ware Design n 14 4 4 N NA 15 5 5 N NA 16 6 6 N NA 17 7 7 N NA 18 8 8 N NA 19 6 2 N NA 20 6 3 N NA 21 6 4 N NA 22 6 4 N NA 23 6 6 N NA 24 8 2 N NA 25 8 3 N NA 26 8 4 N NA 27 8 4 N NA 28 8 6 N NA 29 8 8 N NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 UC200T-GL L_Hardware e_Design87 7 / 84
UMTS/H HSPA(+) Mo odule Sires s UC200T-GL--EM Hardw U ware Design n 11 Apppendixx D EDGE E E Mod dulationan nd Cod ding Schem S mes E Modu ulation and Coding Sch hemes Table 41: EDGE Coding Sc cheme Mo odulation Coding g Family 1 Timeslott 2 Tim meslot 4 Timeslott CS-1: GM MSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GM MSK / 13.4kbps 26.8 8kbps 53.6kbps CS-3: GM MSK / 15.6kbps 31.2 2kbps 62.4kbps CS-4: GM MSK / 21.4kbps 42.8 8kbps 85.6kbps MCS-1 GM MSK C 8.80kbps 17.
