EC200T-AU Series Mini PCIe Hardware Design LTE Standard Module Series Version: 1.
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LTE Standard Module Series EC200T Series Mini PCIe Hardware Design About the Document Revision History Version Date Author Description 1.0 2020-02-27 Jaye SANG/ Niko WU Initial 1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Contents About the Document ................................................................................................................................ 3 Contents .................................................................................................................................................... 4 Table Index .................................................................................................................
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. Power Supply Requirements ................................................................................................. 40 I/O Requirements .................................................................................................................. 41 RF Characteristics ................................................................................................................
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Table Index Table 1: Description of EC200T Series Mini PCIe ................................................................................... 14 Table 2: Key Features of EC200T Series Mini PCIe ................................................................................ 14 Table 3: I/O Parameters Definition...........................................................................................................
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Figure Index Figure 1: Functional Diagram .................................................................................................................. 17 Figure 2: Pin Assignment ........................................................................................................................ 18 Figure 3: Reference Circuit of Power Supply ..........................................................................................
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 1 Introduction This document defines EC200T Series Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers’ applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design ❒ WCDMA Band II/LTE Band2/ LTE Band 7 :≤8.000dBi ❒ WCDMA Band IV/ LTE Band 4 / LTE Band 66:≤5.000dBi ❒ WCDMA Band V / LTE Band 5:≤9.541dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC200T Series Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EC200T_Series_Mini_PCIe_Hardware_Design 12 / 54
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC200T Series Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission for customers’ applications.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2.2. Description of Module Series EC200T Series Mini PCIe series contains 3 variants, and are listed in the following table.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Power Supply Supply voltage: 3.0–3.6 V Typical supply voltage: 3.3 V Transmitting Power Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to 3GPP R8 non-CA Cat 4 FDD and TDD Support 1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Audio Features Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support short frame synchronization Support master and slave modes USB Interface Compliant with USB 2.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2.4. Functional Diagram The following figure shows the block diagram of EC200T Series Mini PCIe.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC200T Series Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC200T Series Mini PCIe. Power supply (U)SIM interface USB interface UART interface PCM and I2C interfaces Control and indication pins 3.1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC200T Series Mini PCIe. Table 3: I/O Parameters Definition Type Description DI Digital Input DO Digital Output IO Bidirectional OC Open Collector OD Open drain PI Power Input PO Power Output Table 4: Pin Description Mini PCI Express Standard Name EC200T Series Mini PCIe Pin Name Pin No.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design UIM_DATA USIM_DATA 10 IO (U)SIM card data REFCLK- UART_RX 11 DI receive UIM_CLK USIM_CLK 12 DO (U)SIM card clock REFCLK+ UART_TX 13 DO transmit UIM_RESET USIM_RST 14 DO (U)SIM card reset GND GND 15 Mini card ground UIM_VPP RESERVED 16 Reserved RESERVED RI 17 GND GND 18 Mini card ground RESERVED RESERVED 19 Reserved W_DISABLE# W_DISABLE# 20 GND GND 21 DO DI Connect to DTE’s TX.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design PETn0 DTR 31 DI SMB_DATA I2C_SDA 32 PETp0 RESERVED 33 Reserved GND GND 34 Mini card ground GND GND 35 Mini card ground USB_D- USB_DM 36 GND GND 37 OD Data terminal ready IO I2C serial data USB differential data (-) Require differential impedance of 90Ω. Mini card ground USB_D+ USB_DP 38 IO USB differential data (+) 3.3Vaux VCC_3V3 39 PI Power supply for the module GND GND 40 3.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design RESERVED PCM_SYNC 51 IO PCM data frame sync 3.3Vaux VCC_3V3 52 PI Power supply for the module NOTE Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. 3.5. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 6: Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0 V–3.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design MIC29302WU U1 VCC_3V3 LDO_IN ADJ R2 82K 1% 5 470 μF 100 nF 51K GND TVS C2 3 C1 1 R1 D1 OUT 4 EN 2 IN R3 R5 4.7K MCU_POWER _ON/OFF R4 C3 470R 470 μF 100 nF C4 C5 C6 33 pF 10 pF 47K 1% R6 47K Figure 3: Reference Circuit of Power Supply 3.6. (U)SIM Interface EC200T Series Mini PCIe’s (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design USIM_VDD Module 100 nF 15K (U)SIM Card Connector GND USIM_VDD USIM_RST USIM_CLK VCC RST 0R 0R GND VPP IO CLK USIM_DET USIM_DATA 0R GND 33 pF 33 pF 33 pF GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Test Points Minimize these stubs Module R3 NM_0R R4 NM_0R L1 USB_DM USB_DM USB_DP USB_DP GND MCU ESD Array Close to Module GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The following table shows the pin definition of the main UART interface. Table 9: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX 11 DI 3.3 V receive UART_TX 13 DO 3.3 V transmit UART_CTS 23 DI 3.3 V clear to send UART_RTS 25 DO 3.3 V request to send The signal level of main UART interface is 3.3 V.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Power Domain Description PCM_CLK 45 IO 1.8 V PCM clock signal PCM_DOUT 47 DO 1.8 V PCM data output PCM_DIN 49 DI 1.8 V PCM data input PCM_SYNC 51 IO 1.8 V PCM data frame sync I2C_SCL 30 OD 1.8 V I2C serial clock. Require external pull-up to 1.8 V. I2C_SDA 32 OD 1.8 V I2C serial data. Require external pull-up to 1.8 V.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. The following figure shows a reference design of PCM interface with an external codec IC. Figure 9: Reference Circuit of PCM Application with Audio Codec NOTE It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM signal lines, especially for PCM_CLK.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design status of the module; Active low. WAKE# 1 OC Wake up the module. 3.10.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". Figure 10: RI Behaviors 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Software method can be controlled by AT+CFUN, and the details are as follows. Table 13: Airplane Mode Controlled by Software Method AT+CFUN=? RF Function Status Module Operation Mode 0 RF and (U)SIM disabled Minimum functionality mode 1 RF enabled Normal mode 4 RF disabled Airplane mode 3.10.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of EC200T Series Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design AT+CFUN=0, AT+CFUN=4 3.10.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 4 Antenna Connection 4.1. Antenna Connectors EC200T Series Mini PCIe is mounted with two antenna connectors for external antenna connection: a main antenna connector and an Rx-diversity antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50Ω. 4.1.1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE-TDD B41 2555–2655 2555–2655 MHz Table 17: EC200T-EU Mini PCIe Operating Frequencies 3GPP Band Transmit Receive Unit EGSM900 880–915 925–960 MHz DCS1800 1710–1785 1805–1880 MHz WCDMA B1 1920–1980 2110–2170 MHz WCDMA B8 880–915 925–960 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–915 925–960 MHz LTE-FDD B201) 832–862 79
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B2 1850–1910 1930–1990 MHz WCDMA B4 1710–1755 2110–2155 MHz WCDMA B5 824–849 869–894 MHz WCDMA B8 880–915 925–960 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B2 1850–1910 1930–1990 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B4 1710–1755 2110–2155 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–915 925–960 MHz LTE-FDD B28 703–748 758–803 MHz LTE
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design (LTE-FDD B7, LTE-TDD B38/B40/B41) 4.3. Recommended Mating Plugs for Antenna Connection EC200T Series Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 14: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. Figure 15: Mechanicals of U.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5 Reliability, Radio and Electrical Characteristics 5.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC200T Series Mini PCIe: Power supply requirements I/O requirements RF characteristics ESD characteristics 5.2. Power Supply Requirements The input voltage of EC200T Series Mini PCIe is 3.0V–3.6V, as specified by PCI Express Mini CEM Specifications 1.2.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5.3. I/O Requirements The following table shows the I/O requirements of EC200T Series Mini PCIe. Table 21: I/O Requirements Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3 - 0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V NOTES 1. 2. The PCM and I2C interfaces belong to 1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE-FDD B1/B3/B5/B7/B8/B20/B28 23dBm±2dB < -39dBm LTE-TDD B34/B38/B39/B40/B41 23dBm±2dB < -39dBm Table 23: Conducted RF Receiving Sensitivity of EC200T-CN Mini PCIe Receiving Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO EGSM900 -108dBm NA NA -102dBm DCS1800 -108dBm NA NA -102dBm WCDMA B1 -108dBm NA NA -106.7dBm WCDMA B5 -109dBm NA NA -104.7dBm WCDMA B8 -110dBm NA NA -103.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B1 -108dBm / / -106.7dBm WCDMA B5 2) TBD NA NA -104.7dBm WCDMA B8 -108dBm / / -103.7dBm LTE-FDD B1 (10MHz) -98.2dBm -98.0dBm -101.8dBm -96.3dBm LTE-FDD B3 (10MHz) -97.8dBm -97.5dBm -100.5dBm -93.3dBm LTE-FDD B5 2) (10MHz) TBD TBD TBD -94.3dBm LTE-FDD B7 (10MHz) -96.5dBm -96.5dBm -99.5dBm -94.3dBm LTE-FDD B8 (10MHz) -98.2dBm -98.5dBm -101 dBm -93.3dBm LTE-FDD B20 2) (10MHz) -97.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B8 TBD NA NA -103.7 dBm LTE-FDD B1 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B2 (10 MHz) TBD TBD TBD -94.3 dBm LTE-FDD B3 (10 MHz) TBD TBD TBD -93.3 dBm LTE-FDD B4 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B5 (10 MHz) TBD TBD TBD -94.3 dBm LTE-FDD B7 (10 MHz) TBD TBD TBD -94.3 dBm LTE-FDD B8 (10 MHz) TBD TBD TBD -93.3 dBm LTE-TDD B28 (10 MHz) TBD TBD TBD -94.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5.6. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table Table 27: Operation and Storage Temperatures Parameter Min. Typ. Max. Unit Operation Temperature Range 1) -35 +25 +75 ºC Extended Operation Range 2) -40 +85 ºC Storage Temperature Range -40 +90 ºC NOTE 1. 2. 1) Within the operation temperature range, the module is 3GPP compliant.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Idle state EGSM900 @ DRX=5 (USB disconnected) 5.66 mA EGSM900 @ DRX=5 (USB suspend) 6.10 mA EGSM900 @ DRX=9 (USB disconnected) 5.77 mA DCS1800 @ DRX=2 (USB disconnected) 6.03 mA DCS1800 @ DRX=5 (USB disconnected) 5.37 mA DCS1800 @ DRX=5 (USB suspend) 5.80 mA DCS1800 @ DRX=9 (USB disconnected) 6.38 mA WCDMA @ PF=64 (USB disconnected) 7.16 mA WCDMA @ PF=64 (USB suspend) 7.02 mA WCDMA @ PF=128 (USB disconnected) 6.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design GPRS data transfer EDGE data transfer WCDMA data transfer WCDMA @ PF=64 (USB connected) 69.77 mA LTE-FDD @ PF=64 (USB disconnected) 48.11 mA LTE-FDD @ PF=64 (USB connected) 69.07 mA LTE-TDD @ PF=64 (USB disconnected) 49.16 mA LTE-TDD @ PF=64 (USB connected) 69.88 mA EGSM900 4DL/1UL @ 31.37 dBm 331.2 mA EGSM900 3DL/2UL @ 31.32 dBm 559.5 mA EGSM900 2DL/3UL @ 30.22 dBm 689.4 mA EGSM900 1DL/4UL @ 28.15 dBm 707.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE data transfer GSM voice call WCDMA voice call WCDMA B8 HSDPA @ 22.47 dBm 843.54 mA WCDMA B8 HSUPA @ 21.17 dBm 824.58 mA LTE-FDD B1 @ 22.46 dBm 828.24 mA LTE-FDD B3 @ 22.15 dBm 841.85 mA LTE-FDD B5 @ 22.84 dBm 750.57 mA LTE-FDD B8 @ 22.49 dBm 878.72 mA LTE-TDD B34 @ 22.78 dBm 435.50 mA LTE-TDD B38 @ 22.51 dBm 483.14 mA LTE-TDD B39 @ 22.48 dBm 410.16 mA LTE-TDD B40 @ 23.19 dBm 549.74 mA LTE-TDD B41 @ 21.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Idle state EGSM900 @ DRX=5 (USB disconnected) 4.26 mA EGSM900 @ DRX=5 (USB suspend) 4.58 mA EGSM900 @ DRX=9 (USB disconnected) 3.99 mA DCS1800 @ DRX=2 (USB disconnected) 5.71 mA DCS1800 @ DRX=5 (USB disconnected) 4.24 mA DCS1800 @ DRX=5 (USB suspend) 4.64 mA DCS1800 @ DRX=9 (USB disconnected) 3.73 mA WCDMA @ PF=64 (USB disconnected) 5.94 mA WCDMA @ PF=64 (USB suspend) 6.15 mA WCDMA @ PF=128 (USB disconnected) 4.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA @ PF=64 (USB connected) 74.74 mA LTE-FDD @ PF=64 (USB disconnected) 52.94 mA LTE-FDD @ PF=64 (USB connected) 73.83 mA LTE-TDD @ PF=64 (USB disconnected) 51.45 mA LTE-TDD @ PF=64 (USB connected) 74.27 mA EGSM900 4DL/1UL @ 33.01dBm 367.6 mA EGSM900 3DL/2UL @ 32.93 dBm 605.7 mA EGSM900 2DL/3UL @ 30.91 dBm 671.4 mA EGSM900 1DL/4UL @ 28.95 dBm 682.7 mA DCS1800 4DL/1UL @ 29.74 dBm 299.8 mA DCS1800 3DL/2UL @ 29.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE data transfer GSM voice call LTE-FDD B1 @ 23.08 dBm 1016 mA LTE-FDD B3 @ 23.69 dBm 961.1 mA LTE-FDD B7 @ 23.98 dBm 1089 mA LTE-FDD B8 @ 23.16 dBm 865.1 mA LTE-FDD B20 @ 23.18 dBm 876.7 mA LTE-FDD B28 @ 23.21 dBm 967.6 mA LTE-TDD B38 @ 23.13 dBm 484.7 mA LTE-TDD B40 @ 22.72 dBm 513.8 mA LTE-TDD B41 @ 23.29 dBm 510.9 mA EGSM900 PCL=5 @ 33.14 dBm 363.7 mA EGSM900 PCL=12 @ 19.51 dBm 164.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 6 Dimensions and Packaging 6.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC200T Series Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless otherwise specified. 6.2. Mechanical Dimensions of EC200T Series Mini PCIe 30.00±0.15 24.20±0.20 8.25±0.10 5.45±0.10 6.38±0.10 3x3.00±0.10 5.98±0.10 2xΦ2.60±0.1 6.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 6.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for Detail A and Detail B.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EC200T Series Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679105700 as an example. Figure 19: Dimensions of the Mini PCI Express Connector (Molex 679105700) 6.4. Packaging Specifications EC200T Series Mini PCIe modules are packaged in a tray. Each tray contains 10 modules.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 7 Appendix References Table 30: Related Documents SN. Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.2 PCI Express Mini Card Electromechanical Specification [2] Quectel_EC200T-CN_AT_Commands_Manual_v1.
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design FR Full Rate GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access kbps Kilo Bits Per Second LED Light Emitting Diode LTE Long-Term Evolution Mbps Million Bits Per Second MCU Micro Control Unit ME Mobile Equipment MIMO Multiple-Input Multiple-Output MMS Multimedia Messaging Service MO Mobile Originated MT
LTE Standard Module Series EC200T Series Mini PCIe Hardware Design SMS Short Message Service TX Transmitting Direction TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver & Transmitter UL Uplink URC Unsolicited Result Code USB Universal Serial Bus (U)SIM (Universal) Subscriber Identification Module WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Networks EC200T_Series_Mini_PCIe_Hardware_Design 57 / 54
