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EC25 Series

Hardware Design

LTE Standard Module Series

Rev. EC25_Series_Hardware_Design_V2.4

Date: 2020-12-21

Status: Released

www.quectel.com

Summary of content (133 pages)

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EC25 Series Hardware Design LTE Standard Module Series Rev. EC25_Series_Hardware_Design_V2.4 Date: 2020-12-21 Status: Released www.quectel.
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LTE Standard Module Series EC25 Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EC25 Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4.
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LTE Standard Module Series EC25 Series Hardware Design 1. 2. 3. 4. 5. 1.3 2017-01-24 Lyndon LIU/ Frank WANG 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1.5 2018-04-20 Kinsey ZHANG 1. 2. 3. 4. EC25_Series_Hardware_Design Updated function diagram in Figure 1. Updated pin assignment (top view) in Figure 2. Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24.
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LTE Standard Module Series EC25 Series Hardware Design 5. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN EC25_Series_Hardware_Design module into Table 41. Added EC25-AF conducted RF receiving sensitivity in Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5.
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LTE Standard Module Series EC25 Series Hardware Design 2.1 2.2 2.3 2019-07-05 2019-08-19 2019-11-26 Fanny CHEN/ Ethan SHAN 1. Added new variants EC25-AFX/-AUX and related information. 2. Added notes for interfaces not supported by ThreadX modules. 3. Updated supported protocols and USB serial drivers in Table 2. 4. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. 5. Added EC25-AFX current consumption in Table 41. 6.
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LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 5 / 126
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LTE Standard Module Series EC25 Series Hardware Design Contents About the Document ................................................................................................................................... 1 Contents ....................................................................................................................................................... 6 Table Index .......................................................................................................................
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LTE Standard Module Series EC25 Series Hardware Design 3.13. SD Card Interface .................................................................................................................... 55 3.14. Wireless Connectivity Interfaces ............................................................................................. 57 3.14.1. WLAN Interface .............................................................................................................. 59 3.14.2. BT Interface* .................
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LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References................................................................................................................... 124 10 Appendix B GPRS Coding Schemes ............................................................................................. 128 11 Appendix C GPRS Multi-slot Classes ............................................................................................
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LTE Standard Module Series EC25 Series Hardware Design Table Index Table 1: Supported Frequency Bands and GNSS Function of EC25 Series Module ....................................... 17 Table 2: Key Features of EC25 Series Module ................................................................................................. 18 Table 3: I/O Parameters Definition .................................................................................................................... 24 Table 4: Pin Description .
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LTE Standard Module Series EC25 Series Hardware Design Table 42: EC25-AFX Current Consumption ...................................................................................................... 94 Table 43: EC25-EU Current Consumption ........................................................................................................ 95 Table 44: EC25-EUX Current Consumption ......................................................................................................
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LTE Standard Module Series EC25 Series Hardware Design Figure Index Figure 2: Pin Assignment (Top View) ................................................................................................................ 23 Figure 3: Sleep Mode Application via UART ..................................................................................................... 37 Figure 4: Sleep Mode Application with USB Remote Wakeup ..........................................................................
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LTE Standard Module Series EC25 Series Hardware Design Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) .............................. 115 Figure 44: Module Top and Side Dimensions ................................................................................................. 116 Figure 45: Module Bottom Dimensions (Bottom View) .................................................................................... 117 Figure 46: Recommended Footprint (Top View) ...........
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LTE Standard Module Series EC25 Series Hardware Design 1 Introduction This document defines EC25 series module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 series module.
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LTE Standard Module Series EC25 Series Hardware Design ❒ ❒ ❒ ❒ ❒ LTE Band2:≤11.000dBi LTE Band 4 / LTE Band 66:≤5.000dBi LTE Band 5:≤9.541dBi LTE Band 12:≤8.734dBi LTE Band 71:≤8.545dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
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LTE Standard Module Series EC25 Series Hardware Design user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
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LTE Standard Module Series EC25 Series Hardware Design 1.2. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EC25 Series Hardware Design 2 Product Concept 2.1. General Description EC25 module is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
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LTE Standard Module Series EC25 Series Hardware Design EC25-AFX FDD: B2/B4/B5/B12/B13/ B14/B66/B71 B2/B4/B5 N Y EC25-EU FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800 MHz Y EC25-EUX FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800 MHz Y EC25-T FDD: B2/B4/B5/B12/B66/B71 N N Y EC25-AUTL FDD: B3/B7/B28 N N Y N EC25-MX FDD: B2/B4//B5/B7/B28/ B66 B2/B4/B5 N Y N EC25-EX FDD:B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 B1/B5/B8 900/1800 MHz N N NOTES 1. 2. 3. 4.
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LTE Standard Module Series EC25 Series Hardware Design Power Supply Supply voltage: 3.3–4.3 V Typical supply voltage: 3.
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LTE Standard Module Series EC25 Series Hardware Design (U)SIM Interface Support USIM/SIM card: 1.8 V, 3.
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LTE Standard Module Series EC25 Series Hardware Design Temperature Range Operating temperature range: -35 to +75 °C1) Extended temperature range: -40 to +85 °C2) Storage temperature range: -40 to +90 °C Firmware Upgrade USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operating temperature range, the module is 3GPP compliant.
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LTE Standard Module Series EC25 Series Hardware Design 3 Application Interfaces 3.1. General Description EC25 series are equipped with 80 LCC pads and 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions.
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LTE Standard Module Series EC25 Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 series module.
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LTE Standard Module Series EC25 Series Hardware Design 5. 6. 7. 8. Pins 119–126 and 128 are used for SGMII interface. Pins 24–27 for PCM function are used for audio design on EC25 series module and BT function on FC20 module. Keep all RESERVED pins and unused pins unconnected. GND pins 85–112 should be connected to ground in the design. RESERVED pins 73–84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3.
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LTE Standard Module Series EC25 Series Hardware Design Vnorm = 3.8 V VDD_EXT 7 PO GND 8, 9, 19, 22, 36, 46, 48, 50–54, 56, 72, 85–112 Provide 1.8 V for external circuit Vnorm = 1.8 V IOmax = 50 mA 1.8 A in a burst transmission. Power supply for external GPIO’s pull-up circuits. If unused, keep it open. Ground Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment DI Turn on/off the module VH = 0.8 V The output voltage is 0.
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LTE Standard Module Series EC25 Series Hardware Design USB_DP USB_DM 69 70 USB differential data bus (+) USB 2.0 Compliant. Require differential impedance of 90 Ω. If unused, keep it open. IO USB differential data bus (-) USB 2.0 Compliant. Require differential impedance of 90 Ω. If unused, keep it open. I/O Description IO (U)SIM Interface Pin Name Pin No. USIM_GND 10 USIM_ PRESENCE 13 DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.
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LTE Standard Module Series EC25 Series Hardware Design For 3.0 V (U)SIM: VOLmax = 0.45 V VOHmin = 2.55 V USIM_RST 17 DO Reset signal of (U)SIM card For 1.8 V (U)SIM: VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM: VOLmax = 0.45 V VOHmin = 2.55 V Main UART Interface Pin Name RI DCD CTS RTS DTR TXD RXD Pin No. 62 63 64 65 66 67 68 I/O Description DC Characteristics Comment DO Ring indicator VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design DBG_TXD DBG_RXD 12 11 Transmit data VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. DI Receive data VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. I/O Description DC Characteristics Comment AI General-purpose analog to digital converter Voltage range: 0.3 V to VBAT_BB If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design Pin Name I2C_SCL I2C_SDA Pin No. 41 42 I/O Description DC Characteristics Comment I2C serial clock. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it open. OD I2C serial data. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it open. I/O Description OD SD Card Interface Pin Name SDC2_ DATA3 SDC2_ DATA2 Pin No.
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LTE Standard Module Series EC25 Series Hardware Design VIHmax = 3.34 V SDC2_ DATA1 SDC2_ DATA0 SDC2_CLK SDC2_CMD 30 31 32 33 IO IO DO IO EC25_Series_Hardware_Design SD card SDIO bus DATA1 SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8 V signaling: VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling: VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.
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LTE Standard Module Series EC25 Series Hardware Design VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V SD 3.0 protocol for more details. If unused, keep it open. 3.0 V signaling: VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax = 50 mA 1.8/2.
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LTE Standard Module Series EC25 Series Hardware Design VOHmin = 2.14 V VILmax = 0.71 V VIHmin = 1.78 V SGMII_ MCLK 122 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 USIM2_VDD 128 DO AO AO AI AI PO SGMII MDIO (Management Data Input/Output) clock For 1.8 V: VOLmax = 0.45 V VOHmin = 1.4 V For 2.85 V: VOLmax = 0.35 V VOHmin = 2.14 V 1.8/2.85 V power domain. If unused, keep it open. SGMII transmission - minus Connect with a 0.1 μF capacitor, and is close to the PHY side.
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LTE Standard Module Series EC25 Series Hardware Design VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 130 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 COEX_UART 137 _RX open. WLAN SDIO data bus D2 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. WLAN SDIO data bus D1 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.
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LTE Standard Module Series EC25 Series Hardware Design VIHmin = 1.2 V VIHmax = 2.0 V COEX_UART 138 _TX DO LTE/WLAN & BT coexistence signal WLAN_SLP_ 118 CLK DO WLAN sleep clock BT_RTS BT_TXD BT_RXD 37 38 39 VOLmax = 0.45 V VOHmin = 1.35 V before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. DI BT UART request to send VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain.
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LTE Standard Module Series EC25 Series Hardware Design Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DI Description Sleep mode control DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8 V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
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LTE Standard Module Series EC25 Series Hardware Design The following figure shows the connection between the module and the host. Host Module RXD TXD TXD RXD RI EINT DTR GPIO AP_READY GPIO GND GND Figure 2: Sleep Mode Application via UART ⚫ ⚫ ⚫ Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode.
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LTE Standard Module Series EC25 Series Hardware Design Module Host GPIO USB_VBUS Power Switch VDD USB_DP USB_DP USB_DM USB_DM RI EINT AP_READY GPIO GND GND Figure 5: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. 3.5.2.
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LTE Standard Module Series EC25 Series Hardware Design 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. ⚫ ⚫ Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max.
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LTE Standard Module Series EC25 Series Hardware Design diode with suggested low reverse stand-off voltage VRWM 4.5 V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. 错误!不能通过编辑域代码创建对象。 Figure 7: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source.
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LTE Standard Module Series EC25 Series Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 21 I/O Description Comment DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms.
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LTE Standard Module Series EC25 Series Hardware Design S1 PWRKEY TVS Close to S1 Figure 10: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure.
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LTE Standard Module Series EC25 Series Hardware Design NOTE 1 VBA T 500 ms VH=0.8 V PWRKEY VIL 0.5 V Abo ut 100 ms VDD_EXT 100 ms. Over th is time, BOO T_CONFIG pins can be pu lled up external ly. BOO T_CONFIG & USB_BOO T Pin s RESET_N 2.5 s STATUS (OD) 12 s UART Inactive Active 13 s USB Inactive Active Figure 11: Timing of Turning on Module NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin.
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LTE Standard Module Series EC25 Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. VBA T 650 ms 29.5 s PWRKEY STATUS (OD) Module Status RUNNING Power-down procedure OFF Figure 12: Timing of Turning off Module 3.7.2.2.
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LTE Standard Module Series EC25 Series Hardware Design Table 8: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N 150–460 ms 4.
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LTE Standard Module Series EC25 Series Hardware Design The reset scenario is illustrated in the following figure. VBAT 460 ms 150 ms VIH RESET_N VIL Module Status Running 1.3 V 0.5 V Resetting Restart Figure 15: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements.
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LTE Standard Module Series EC25 Series Hardware Design EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for more details about the command The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 μF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly.
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LTE Standard Module Series EC25 Series Hardware Design Test Points Minimize these stubs Module VDD R3 NM_0R R4 NM_0R MCU ESD Array USB_VBUS L1 USB_DM USB_DM USB_DP USB_DP Close to Module GND GND Figure 18: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication. The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log output.
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LTE Standard Module Series EC25 Series Hardware Design VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8 V UART interface. A level translator should be used if customers’ application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA 120K VCCB 10K 0.1 μF VDD_MCU 0.
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LTE Standard Module Series EC25 Series Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 3.12.
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LTE Standard Module Series EC25 Series Hardware Design 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 22: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8 V power domain PCM_OUT 25 DO PCM data output 1.
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LTE Standard Module Series EC25 Series Hardware Design PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT DAC PCM_DIN ADC I2C_SCL SCL I2C_SDA SDA INP INN BIAS MICBIAS Module 4.7K 4.7K LOUTP LOUTN Codec 1.8 V Figure 23: Reference Circuit of PCM and I2C Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.13.
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LTE Standard Module Series EC25 Series Hardware Design SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8/2.85 V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8 V power domain. If unused, keep it open. The following figure shows a reference design of SD card.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ trace is 50 Ω ( ±10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15 pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1 mm and the total routing length less than 50 mm. The total trace length inside the module is 27 mm, so the exterior total trace length should be less than 23 mm. 3.14.
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LTE Standard Module Series EC25 Series Hardware Design Cannot be pulled up before startup. If unused, keep it open. COEX_UART_TX 138 DO LTE/WLAN & BT coexistence signal WLAN_SLP_CLK 118 DO WLAN sleep clock 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. BT Part BT_RTS 37 DI BT UART request to send 1.8 V power domain BT_TXD 38 DO BT UART transmit data 1.8 V power domain BT_RXD 39 DI BT UART receive data 1.
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LTE Standard Module Series EC25 Series Hardware Design Module FC20 Module PM_ENABL E DCDC/LDO VDD_3V3 POWER VDD_EXT SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 WLAN SDIO_CLK SDC1_CMD SDIO_CMD WLAN_EN WLAN_EN WLAN_SLP_CLK 32KHZ_IN WAKE_ON_WIREL ESS COEX_UART_RX LTE_UART_TXD COEX_UART_TX LTE_UART_RXD BT_EN BT_RTS Bluetooth SDIO_D0 SDC1_CLK WAKE_ON_WIREL ESS COEX VIO BT_EN BT_UART_RTS BT_CTS BT_UART_CTS BT_TXD BT_UART_RXD BT_RXD BT_UART_TXD PCM_IN
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 Ω ±10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1 mm and total routing length less than 50 mm.
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LTE Standard Module Series EC25 Series Hardware Design Table 18: Characteristic of ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range Max. Unit 0.3 VBAT_BB V 0.3 VBAT_BB V ADC Resolution Typ. 15 bits NOTES 1. 2. 3. ADC input voltage must not exceed that of VBAT_BB. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. It is recommended to use a resistor divider circuit for ADC application. 3.16.
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LTE Standard Module Series EC25 Series Hardware Design EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8 V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8/2.85 V power domain SGMII_MCLK 122 DO SGMII MDIO (Management Data Input/Output) clock 1.8/2.85 V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8/2.85 V power domain.
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LTE Standard Module Series EC25 Series Hardware Design The following figure shows a reference design of SGMII interface with PHY AR8033 application. Module R1 10K R2 1.5K VDD_EXT AR8033 USIM2_VDD EPHY_INT_N INT EPHY_RST_N RSTN Control SGMII_MDATA MDIO SGMII_MCLK MDC USIM2_VDD USIM2_VDD SGMII_RX_P C1 0.1uF SGMII_RX_M C2 0.1uF Close to Module SOP SON SGMII Data SGMII_TX_P 0.1uF C3 SIP SGMII_TX_M 0.
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LTE Standard Module Series EC25 Series Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment 1.8 V power domain Cannot be pulled up before startup 1.
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LTE Standard Module Series EC25 Series Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series EC25 Series Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120 ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command.
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LTE Standard Module Series EC25 Series Hardware Design The following figure shows a reference circuit of USB_BOOT interface. Module VDD_EXT Test points USB_BOOT 4.7K Close to test points TVS Figure 30: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT ≥ 500 ms VH = 0.8 V PWRKEY VDD_EXT VIL≤ 0.5 V About 100 ms USB_BOOT can be pulled up to 1.8 V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on.
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LTE Standard Module Series EC25 Series Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC25 Series Hardware Design Hot start @ open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @ open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
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LTE Standard Module Series EC25 Series Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50 Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA B2 1850–1910 1930–1990 MHz WCDMA B4 1710–1755 2110–2155 MHz WCDMA B5 824–849 869–894 MHz WCDMA B6 830–840 875–885 MHz WCDMA B8 880–915 925– 960 MHz WCDMA B19 830–845 875–890 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B2 1850–1910 1930–1990 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B4 1710–1755 2110–2155 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–91
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B71 663–698 617–652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Main Antenna Module R1 0R ANT_MAIN C1 C2 NM NM Diversity Antenna R2 0R ANT_DIV C3 C4 NM NM Figure 32: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3.
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LTE Standard Module Series EC25 Series Hardware Design .
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LTE Standard Module Series EC25 Series Hardware Design Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC25 Series Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42 ±1.023 MHz GLONASS 1597.5–1605.8 MHz Galileo 1575.42 ±2.046 MHz BeiDou (Compass) 1561.098 ±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. VDD 0.1 μF 10R Module GNSS Antenna 47nH 100 pF 0R ANT_GNSS NM NM Figure 37: Reference Circuit of GNSS Antenna NOTES 1. 2.
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LTE Standard Module Series EC25 Series Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.
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LTE Standard Module Series EC25 Series Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.
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LTE Standard Module Series EC25 Series Hardware Design The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EC25 Series Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC25 Series Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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LTE Standard Module Series EC25 Series Hardware Design 3. operating temperature levels, the module will meet 3GPP specifications again. “*” means under development. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX = 2 (USB disconnected) 2.74 mA GSM DRX = 9 (USB disconnected) 2.
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LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) LTE-TDD PF = 64 (USB connected) 32.0 mA EGSM900 4DL/1UL @ 33.22 dBm 271.0 mA EGSM900 3DL/2UL @ 33.0 dBm 464.0 mA EGSM900 2DL/3UL @ 30.86 dBm 524.0 mA EGSM900 1DL/4UL @ 29.58 dBm 600.0 mA DCS1800 4DL/1UL @ 29.92 dBm 192.0 mA DCS1800 3DL/2UL @ 29.84 dBm 311.0 mA DCS1800 2DL/3UL @ 29.67 dBm 424.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @ 22.83 dBm 762.0 mA LTE-FDD B7 @ 23.37 dBm 842.0 mA LTE-FDD B8 @ 23.48 dBm 720.0 mA LTE-FDD B20 @ 22.75 dBm 714.0 mA LTE-TDD B38 @ 23.05 dBm 481.0 mA LTE-TDD B40 @ 23.17 dBm 431.8 mA LTE-TDD B41 @ 23.02 dBm 480.0 mA EGSM900 PCL = 5 @ 33.08 dBm 264.0 mA DCS1800 PCL = 0 @ 29.75 dBm 190.0 mA WCDMA B1 @ 23.22 dBm 680.0 mA WCDMA B5 @ 23.18 dBm 677.0 mA WCDMA B8 @ 23.54 dBm 618.
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LTE Standard Module Series EC25 Series Hardware Design LTE-TDD PF = 64 (USB disconnected) 1.95 mA LTE-TDD PF = 128 (USB disconnected) 1.39 mA GSM DRX = 5 (USB disconnected) 15.37 mA GSM DRX = 5 (USB connected) 24.83 mA WCDMA PF = 64 (USB disconnected) 15.68 mA WCDMA PF = 64 (USB connected) 25.02 mA LTE-FDD PF = 64 (USB disconnected) 14.71 mA LTE-FDD PF = 64 (USB connected) 23.87 mA LTE-TDD PF = 64 (USB disconnected) 14.66 mA LTE-TDD PF = 64 (USB connected) 23.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 1DL/4UL PCL = 2 @ 21.32 dBm 444.3 mA WCDMA B1 HSDPA @ 22.08 dBm 504.0 mA WCDMA B1 HSUPA @ 21.46 dBm 498.4 mA WCDMA B5 HSDPA @ 22.65 dBm 531.9 mA WCDMA B5 HSUPA @ 22.36 dBm 500.4 mA WCDMA B8 HSDPA @ 22.13 dBm 544.5 mA WCDMA B8 HSUPA @ 21.12 dBm 504.1 mA LTE-FDD B1 @ 22.38 dBm 622.8 mA LTE-FDD B3 @ 22.31 dBm 666.
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LTE Standard Module Series EC25 Series Hardware Design Sleep state AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF = 64 (USB disconnected) 1.8 mA WCDMA PF = 128 (USB disconnected) 1.5 mA LTE-FDD PF = 64 (USB disconnected) 2.2 mA LTE-FDD PF = 128 (USB disconnected) 1.6 mA WCDMA PF = 64 (USB disconnected) 21.0 mA WCDMA PF = 64 (USB connected) 31.0 mA LTE-FDD PF = 64 (USB disconnected) 21.0 mA LTE-FDD PF = 64 (USB connected) 31.0 mA WCDMA B2 HSDPA @ 21.9 dBm 591.
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LTE Standard Module Series EC25 Series Hardware Design Sleep state AT+CFUN=0 (USB disconnected) 0.85 mA LTE-FDD PF = 64 (USB disconnected) 2.0 mA LTE-FDD PF = 128 (USB disconnected) 1.5 mA LTE-FDD PF = 64 (USB disconnected) 20.0 mA LTE-FDD PF = 64 (USB connected) 31.0 mA LTE-FDD B4 @ 23.14 dBm 770.0 mA LTE-FDD B13 @ 23.48 dBm 531.0 mA Idle state LTE data transfer (GNSS OFF) Table 38: EC25-J Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC25 Series Hardware Design transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B1 HSUPA @ 21.79 dBm 533.0 mA WCDMA B6 HSDPA @ 22.64 dBm 515.0 mA WCDMA B6 HSUPA @ 22.33 dBm 520.0 mA WCDMA B19 HSDPA @ 22.67 dBm 516.0 mA WCDMA B19 HSUPA @ 22.33 dBm 521.0 mA LTE-FDD B1 @ 23.16 dBm 685.0 mA LTE-FDD B3 @ 23.22 dBm 765.0 mA LTE-FDD B8 @ 23.22 dBm 640.0 mA LTE-FDD B18 @ 23.35 dBm 660.0 mA LTE-FDD B19 @ 23.16 dBm 676.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA PF = 64 (USB disconnected) 2.0 mA WCDMA PF = 128 (USB disconnected) 1.6 mA LTE-FDD PF = 64 (USB disconnected) 2.2 mA LTE-FDD PF = 128 (USB disconnected) 1.6 mA LTE-TDD PF = 64 (USB disconnected) 2.3 mA LTE-TDD PF = 128 (USB disconnected) 1.6 mA EGSM900 DRX = 5 (USB disconnected) 22.0 mA EGSM900 DRX = 5 (USB connected) 34.0 mA WCDMA PF = 64 (USB disconnected) 22.0 mA WCDMA PF = 64 (USB connected) 33.
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LTE Standard Module Series EC25 Series Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) PCS1900 2UL/3DL @ 29.48 dBm 273.0 mA PCS1900 3UL/2DL @ 29.32 dBm 367.0 mA PCS1900 4UL/1DL @ 29.19 dBm 465.0 mA GSM850 1UL/4DL @ 27.09 dBm 154.0 mA GSM850 2UL/3DL @ 26.94 dBm 245.0 mA GSM850 3UL/2DL @ 26.64 dBm 328.0 mA GSM850 4UL/1DL @ 26.53 dBm 416.0 mA EGSM900 1UL/4DL @ 26.64 dBm 157.0 mA EGSM900 2UL/3DL @ 26.95 dBm 251.0 mA EGSM900 3UL/2DL @ 26.57 dBm 340.
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LTE Standard Module Series EC25 Series Hardware Design LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B8 HSDPA @ 22.31 dBm 556.0 mA WCDMA B8 HSUPA @ 22.11 dBm 572.0 mA LTE-FDD B1 @ 23.28 dBm 817.0 mA LTE-FDD B2 @ 23.34 dBm 803.0 mA LTE-FDD B3 @ 23.2 dBm 785.0 mA LTE-FDD B4 @ 22.9 dBm 774.0 mA LTE-FDD B5 @ 23.45 dBm 687.0 mA LTE-FDD B7 @ 22.84 dBm 843.0 mA LTE-FDD B8 @ 22.92 dBm 689.0 mA LTE-FDD B28 @ 23.23 dBm 804.0 mA LTE-TDD B40 @ 23.3 dBm 429.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD PF = 64 (USB disconnected) 2.3 mA LTE-FDD PF = 128 (USB disconnected) 1.9 mA WCDMA PF = 64 (USB disconnected) 23.0 mA WCDMA PF = 64 (USB connected) 33.0 mA LTE-FDD PF = 64 (USB disconnected) 17.0 mA LTE-FDD PF = 64 (USB connected) 29.0 mA WCDMA B1 HSDPA @ 22.24 dBm 500.0 mA WCDMA B1 HSUPA @ 22.05 dBm 499.0 mA WCDMA B5 HSDPA @ 22.39 dBm 418.0 mA WCDMA B5 HSUPA @ 22 dBm 486.0 mA LTE-FDD B1 @ 23.28 dBm 707.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD PF = 64 (USB disconnected) 2.2 mA LTE-FDD PF = 128 (USB disconnected) 1.8 mA WCDMA PF = 64 (USB disconnected) 23.3 mA WCDMA PF = 64 (USB connected) 33.4 mA LTE-FDD PF = 64 (USB disconnected) 17.6 mA LTE-FDD PF = 64 (USB connected) 29.4 mA WCDMA B2 HSDPA @ 22.63 dBm 560.0 mA WCDMA B2 HSUPA @ 22.49 dBm 564.0 mA WCDMA B4 HSDPA @ 22.45 dBm 601.0 mA WCDMA B4 HSUPA @ 22.57 dBm 610.0 mA WCDMA B5 HSDPA @ 22.49 dBm 603.
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LTE Standard Module Series EC25 Series Hardware Design Table 42: EC25-AFX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 8 μA AT+CFUN=0 (USB disconnected) 0.83 mA WCDMA PF = 64 (USB disconnected) 1.55 mA WCDMA PF = 128 (USB disconnected) 1.24 mA WCDMA PF = 256 (USB disconnected) 1.07 mA WCDMA PF = 512 (USB disconnected) 1.00 mA LTE-FDD PF = 32 (USB disconnected) 2.97 mA LTE-FDD PF = 64 (USB disconnected) 1.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA voice call LTE-FDD B12 @ 22.66 dBm 648.0 mA LTE-FDD B13 @ 22.79 dBm 617.0 mA LTE-FDD B14 @ 22.72 dBm 622.0 mA LTE-FDD B66 @ 22.86 dBm 698.0 mA LTE-FDD B71 @ 22.73 dBm 628.0 mA WCDMA B2 @ 22.63 dBm 578.0 mA WCDMA B4 @ 22.74 dBm 581.0 mA WCDMA B5 @ 22.6 dBm 561.0 mA Table 43: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.
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LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data LTE-FDD PF = 64 (USB disconnected) 20.7 mA LTE-FDD PF = 64 (USB connected) 30.8 mA LTE-TDD PF = 64 (USB disconnected) 20.8 mA LTE-TDD PF = 64 (USB connected) 32.0 mA EGSM900 4DL/1UL @ 33.23 dBm 243.0 mA EGSM900 3DL/2UL @ 31.96 dBm 388.0 mA EGSM900 2DL/3UL @ 29.73 dBm 453.0 mA EGSM900 1DL/4UL @ 28.
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LTE Standard Module Series EC25 Series Hardware Design transfer (GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B3 @ 23.67 dBm 728.0 mA LTE-FDD B7 @ 23.83 dBm 821.0 mA LTE-FDD B8 @ 23.82 dBm 695.0 mA LTE-FDD B20 @ 23.88 dBm 649.0 mA LTE-FDD B28A @ 23.43 dBm 689.0 mA LTE-TDD B38 @ 22.82 dBm 438.0 mA LTE-TDD B40 @ 23.43 dBm 355.0 mA LTE-TDD B41 @ 23.46 dBm 451.0 mA EGSM900 PCL = 5 @ 33.25 dBm 258.0 mA DCS1800 PCL = 0 @ 30.23 dBm 178.0 mA WCDMA B1 @ 23.88 dBm 548.
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LTE Standard Module Series EC25 Series Hardware Design GSM DRX = 5 (USB disconnected) 14.5 mA GSM DRX = 5 (USB connected) 34.3 mA WCDMA PF = 64 (USB disconnected) 14.7 mA WCDMA PF = 64 (USB connected) 35.3 mA LTE-FDD PF = 64 (USB disconnected) 15.0 mA LTE-FDD PF = 64 (USB connected) 36.5 mA LTE-TDD PF = 64 (USB disconnected) 15.0 mA LTE-TDD PF = 64 (USB connected) 36.5 mA EGSM900 4DL/1UL @ 33.02 dBm 270.7 mA EGSM900 3DL/2UL @ 32.24 dBm 444.3 mA EGSM900 2DL/3UL @ 30.
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LTE Standard Module Series EC25 Series Hardware Design transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B1 HSUPA @ 21.38 dBm 526.7 mA WCDMA B8 HSDPA @ 22.21 dBm 459.8 mA WCDMA B8 HSUPA @ 21.85 dBm 471.6 mA LTE-FDD B1 @ 23.38 dBm 743.4 mA LTE-FDD B3 @ 22.87 dBm 674.6 mA LTE-FDD B7 @ 22.08 dBm 658.8 mA LTE-FDD B8 @ 23.49 dBm 607.3 mA LTE-FDD B20 @ 23.01 dBm 711.0 mA LTE-FDD B28A @ 23.18 dBm 788.2 mA LTE-TDD B38 @ 23.38 dBm 446.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA PF = 64 (USB disconnected) 12.9 mA WCDMA PF = 64 (USB connected) 32.0 mA LTE-FDD PF = 64 (USB disconnected) 13.7 mA LTE-FDD PF = 64 (USB connected) 32.6 mA WCDMA B2 HSDPA @ 22.27 dBm 581.9 mA WCDMA B2 HSUPA @ 22.15 dBm 603.0 mA WCDMA B4 HSDPA @ 22.5 dBm 578.0 mA WCDMA B4 HSUPA @ 22.5 dBm 571.0 mA WCDMA B5 HSDPA @ 22.4 dBm 499.0 mA WCDMA B5 HSUPA @ 22.17 dBm 515.0 mA LTE-FDD B2 @ 23.2 dBm 685.0 mA LTE-FDD B4 @ 23.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD PF = 128 (USB disconnected) 2.5 mA LTE-TDD PF = 64 (USB disconnected) 3.4 mA GSM DRX = 5 (USB disconnected) 16.9 mA GSM DRX = 5 (USB connected) 34.5 mA WCDMA PF = 64 (USB disconnected) 17.9 mA WCDMA PF = 64 (USB connected) 35.2 mA LTE-FDD PF = 64 (USB disconnected) 18.3 mA LTE-FDD PF = 64 (USB connected) 35.1 mA LTE-TDD PF = 64 (USB disconnected) 18.4 mA LTE-TDD PF = 64 (USB connected) 35.1 mA GSM850 4DL/1UL @ 32.
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LTE Standard Module Series EC25 Series Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) PCS1900 1DL/4UL @ 25.34 dBm 370.5 mA GSM850 4DL/1UL @ 26.94 dBm 177.5 mA GSM850 3DL/2UL @ 25.90 dBm 290.8 mA GSM850 2DL/3UL @ 23.70 dBm 394.0 mA GSM850 1DL/4UL @ 22.47 dBm 504.5 mA EGSM900 4DL/1UL @ 27.18 dBm 176.6 mA EGSM900 3DL/2UL @ 26.03 dBm 289.6 mA EGSM900 2DL/3UL @ 23.97 dBm 390.7 mA EGSM900 1DL/4UL @ 22.68 dBm 502.1 mA DCS1800 4DL/1UL @ 26.01 dBm 141.
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LTE Standard Module Series EC25 Series Hardware Design LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B8 HSDPA @ 22.46 dBm 545.5 mA WCDMA B8 HSUPA @ 21.89 dBm 541.1 mA LTE-FDD B1 @ 22.91 dBm 713.5 mA LTE-FDD B2 @ 22.85 dBm 713.4 mA LTE-FDD B3 @ 23.12 dBm 675.7 mA LTE-FDD B4 @ 22.52 dBm 607.8 mA LTE-FDD B5 @ 23.12 dBm 563.1 mA LTE-FDD B7 @ 22.95 dBm 702.9 mA LTE-FDD B8 @ 23.55 dBm 728.8 mA LTE-FDD B28 @ 23.23 dBm 769.3 mA LTE-TDD B40 @ 23.54 dBm 335.
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LTE Standard Module Series EC25 Series Hardware Design AT+CFUN=0 (USB Suspend) 1.01 mA AT+CFUN=4 (USB disconnected) 0.88 mA AT+CFUN=4 (USB Suspend) 1.09 mA LTE-FDD PF = 32 (USB disconnected) 3.05 mA LTE-FDD PF = 64 (USB disconnected) 2.11 mA LTE-FDD PF = 64 (USB Suspend) 2.17 mA LTE-FDD PF = 128 (USB disconnected) 1.68 mA LTE-FDD PF = 256 (USB disconnected) 1.13 mA LTE-FDD PF = 64 (USB disconnected) 18.71 mA LTE-FDD PF = 64 (USB active) 27.74 mA LTE-FDD B2 @ 23.23 dBm 683.
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LTE Standard Module Series EC25 Series Hardware Design 6.5. RF Output Power The following table shows the RF output power of EC25 series module. Table 49: RF Output Power Frequency Max. Output Power Min.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA B5 -110.5 dBm / / -104.7 dBm WCDMA B8 -110.5 dBm / / -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -98.0 dBm -101.5 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -98.5 dBm -101.5 dBm -93.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.5 dBm -101.0 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97.0 dBm -97.0 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -97.0 dBm -97.0 dBm -101.0 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97.5 dBm -99.
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LTE Standard Module Series EC25 Series Hardware Design Table 53: EC25-J Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0 dBm -110.5 dBm -111.0 dBm -106.7 dBm WCDMA B6 -110.5 dBm -110.5 dBm -111.0 dBm -106.7 dBm WCDMA B8 -110.5 dBm -111.0 dBm -111.0 dBm -103.7 dBm WCDMA B19 -110.5 dBm -110.5 dBm -111.0 dBm -106.7 dBm LTE-FDD B1 (10 MHz) -97.5 dBm -98.7 dBm -100.2 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -97.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz) -97.2 dBm -97.5 dBm -100.2 dBm -96.3 dBm LTE-FDD B2 (10 MHz) -98.2 dBm / / -94.3 dBm LTE-FDD B3 (10 MHz) -98.7 dBm -98.6 dBm -102.2 dBm -93.3 dBm LTE-FDD B4 (10 MHz) -97.7 dBm -97.4 dBm -100.2 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.2 dBm -101.0 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97.7 dBm -97.7 dBm -101.2 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -99.2 dBm -98.2 dBm -102.2 dBm -93.
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LTE Standard Module Series EC25 Series Hardware Design Table 57: EC25-AF Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -109.5 dBm -110 dBm -110.4 dBm -104.7 dBm WCDMA B4 -109.6 dBm -110 dBm -110.6 dBm -106.7 dBm WCDMA B5 -110 dBm -110 dBm -110.7 dBm -104.7 dBm LTE-FDD B2 (10 MHz) -98.0 dBm -98.5 dBm -100.5 dBm -94.3 dBm LTE-FDD B4 (10 MHz) -97.5 dBm -98.2 dBm -99.5 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.5 dBm -100.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B66 (10 MHz) -97.5 dBm -98.5 dBm -99.6 dBm -95.8 dBm LTE-FDD B71 (10 MHz) -98.6 dBm -99.5 dBm -100 dBm -93.5 dBm Table 59: EC25-EU Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -108.5 dBm / / -102.0 dBm DCS1800 -108.5 dBm / / -102.0dbm WCDMA B1 -109.5 dBm -109.5 dBm / -106.7 dBm WCDMA B8 -110.0 dBm -111.5 dBm / -103.7 dBm LTE-FDD B1 (10 MHz) -98.5 dBm -99.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz) -98.0 dBm -98.0 dBm -101 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -98.5 dBm -99.5 dBm -93.3 dBm LTE-FDD B7 (10 MHz) -97.0 dBm -94.5 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -97.0 dBm -97.0 dBm -100.0 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97.5 dBm -99.0 dBm -101.5 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.6 dBm -98.7 dBm -101.0 dBm -94.8 dBm LTE-TDD B38 (10 MHz) -96.3 dBm -97 dBm -98.5 dBm -96.
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LTE Standard Module Series EC25 Series Hardware Design EGSM900 -109.0 dBm / / -102.0 dBm DCS1800 -109.0 dBm / / -102.0 dBm PCS1900 -109.0 dBm / / -102.0 dBm WCDMA B1 -110.0 dBm -109.5 dBm -112 dBm -106.7 dBm WCDMA B2 -110.5 dBm / / -104.7 dBm WCDMA B4 -110.0 dBm -110 dBm -112 dBm -104.7 dBm WCDMA B5 -111.0 dBm -112 dBm -113 dBm -104.7 dBm WCDMA B8 -111.0 dBm -112 dBm -113 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -97.7 dBm -101.2 dBm -96.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz) -98.0 dBm / / -96.3 dBm LTE-FDD B3 (10 MHz) -98.4 dBm / / -93.3 dBm LTE-FDD B5 (10 MHz) -99.0dBm / / -94.3 dBm LTE-FDD B7 (10 MHz) -96.5 dBm / / -94.3 dBm LTE-FDD B8 (10 MHz) -98.8 dBm / / -93.3 dBm LTE-FDD B20 (10 MHz) -98.0 dBm / / -93.3 dBm LTE-TDD B38 (10 MHz) -97.3 dBm / / -96.3 dBm LTE-TDD B40 (10 MHz) -97.3 dBm / / -96.3 dBm LTE-TDD B41 (10 MHz) -97.3 dBm / / -94.
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LTE Standard Module Series EC25 Series Hardware Design The following table shows the module‘s electrostatics discharge characteristics. Table 65: Electrostatics Discharge Characteristics (25 ºC, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 kV All Antenna Interfaces ±4 ±8 kV Other Interfaces ±0.5 ±1 kV 6.8.
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LTE Standard Module Series EC25 Series Hardware Design EC25 Module Heatsink Heatsink Thermal Pad Shielding Cover Application Board Application Board Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module) Thermal Pad EC25 Module Thermal Pad Heatsink Heatsink Application Board Shielding Cover Application Board Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. 2.
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LTE Standard Module Series EC25 Series Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 2.4± 0.2 29.0± 0.15 32.0± 0.15 0.
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LTE Standard Module Series EC25 Series Hardware Design 32.0＋/-0.15 3.4 1.30 2.0 5.96 3.85 1.1 1.1 3.5 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 1.05 4.8 1.6 29.0＋/-0.15 2.0 6.8 1.7 3.2 3.4 3.2 3.4 0.8 3.2 3.5 4.37 2.49 1.9 2.4 1.5 3.45 Figure 44: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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LTE Standard Module Series EC25 Series Hardware Design 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard.
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LTE Standard Module Series EC25 Series Hardware Design 7.3. Design Effect Drawings of the Module Figure 46: Top View of the Module Figure 47: Bottom View of the Module NOTE These are renderings of EC25 series module. For authentic appearance, please refer to the module received from Quectel.
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LTE Standard Module Series EC25 Series Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60%. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series EC25 Series Hardware Design NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120 ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB.
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LTE Standard Module Series EC25 Series Hardware Design Table 66: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 220 °C) 45–70 s Max temperature 238–246 °C Cooling down slope -1 to -4 °C/s Reflow Cycle Max reflow cycle 1 8.3. Packaging .1 ±0 50 1. 30.3±0.15 0.35±0.05 29.3±0.15 44.00±0.3 20.20±0.15 44.00±0.1 2.00±0.1 4.00±0.1 30.3±0.
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LTE Standard Module Series EC25 Series Hardware Design 48.5 Cover tape 13 100 Direction of feed 44.5+0.20 -0.
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LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References Table 67: Related Documents SN Document Name Remark [1] Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EC25 Series Hardware Design CTS Clear to Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation S
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LTE Standard Module Series EC25 Series Hardware Design MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Inpu
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LTE Standard Module Series EC25 Series Hardware Design Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Outp
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LTE Standard Module Series EC25 Series Hardware Design 10 Appendix B GPRS Coding Schemes Table 69: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC25 Series Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC25 Series Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Series_Hardware_Design 130 / 126
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LTE Standard Module Sires EC25 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 71: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot MCS-1 GMSK C 8.80 kbps 17.60 kbps 35.20 kbps MCS-2 GMSK B 11.2 kbps 22.4 kbps 44.8 kbps MCS-3 GMSK A 14.8 kbps 29.6 kbps 59.2 kbps MCS-4 GMSK C 17.6 kbps 35.2 kbps 70.4 kbps MCS-5 8-PSK B 22.4 kbps 44.8 kbps 89.6 kbps MCS-6 8-PSK A 29.6 kbps 59.2 kbps 118.