Product Info

LPWA Module Series
BG95 Hardware Design
BG95_Hardware_Design 84 / 88
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.13–0.15 mm. For more details, please refer to
document [5].
It is suggested that the peak reflow temperature is 238–245 ºC, and the absolute maximum reflow
temperature is 245 ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Figure 39: Recommended Reflow Soldering Thermal Profile
Table 46: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1 to 3 °C/sec
Soak time (between A and B: 150 °C and 200 °C) 60 to 120 sec