HC06U Hardware Design Bluetooth Module Series Version: 1.
Bluetooth Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
Bluetooth Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Bluetooth Module Series metal powders.
Bluetooth Module Series About the Document Revision History Version Date Author Description - 2021-08-10 Elinor WANG/Lucas HUANG Creation of the document 1.
Bluetooth Module Series Contents Safety Information........................................................................................................................................................ 3 About the Document.................................................................................................................................................... 5 Contents................................................................................................................................
Bluetooth Module Series Table Index Table 1: Key Features...............................................................................................................................................11 Table 2: Pin Description........................................................................................................................................... 15 Table 3: Absolute Maximum Ratings............................................................................................................
Bluetooth Module Series Figure Index Figure 1: Module Block Diagram.......................................................................................... 错误！未定义书签。 Figure 2: Pin Assignment....................................................................................................................................... 14 Figure 3: Power on Reset Timing.........................................................................................................................
Bluetooth Module Series 1 Introduction This document defines the HC06U module and describes its air interfaces and hardware interfaces which are connected with customers’ application. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use HC06U module to design and set up applications easily.
Bluetooth Module Series 2 Product Overview 2.1. General Description Quectel HC06U is a low power Bluetooth on-chip system (SoC) solution. It integrates high performance and low power RF transceiver and rich peripheral IO extension. Mainly used in low-power data transmission, keyboard, mouse, remote control, sports and leisure equipment, mobile phone accessories and consumer electronics products. HC06U conforms to the Bluetooth 5.0 Specification and supports all Bluetooth Standard 5.0 functions.
Bluetooth Module Series CPU: ARM CM3, max. 48 MHz 128 KB SRAM 256 KB ROM, ROM Encryption 4 Mb SFLASH Clocks: 24 MHz crystal oscillator clock, 24 MHz RC clock, 32.768 kHz crystal oscillator clock, 32.768 kHz RC clock Link Controller: Bluetooth 5.0 LE physical layer, controller layer 2.4 GHz Private transport protocol 2.2. Key Features The following table describes the key features of HC06U module. Table 1: Key Features Specification HC06U Bluetooth specification Bluetooth 5.
Bluetooth Module Series Physical Characteristics (16.5 ±0.2) mm × (13.3 ±0.2) mm × (2.3 ±0.2) mm 2.3. Antenna requirement Type Requirements Frequency Range 2.400–2.
Bluetooth Module Series HC06U_Hardware_Design 13 / 31
Bluetooth Module Series 3 Application Interfaces 3.1.
Bluetooth Module Series 3.2. Pin Description Table 2: Pin Description Pin No. Pin Description Functions 1 GND GND 2 3V3 +3.
Bluetooth Module Series 23 ADC_IN5 Analog-digital conversion 24 PB12 Configurable GPIO 25 PB10 Configurable GPIO 25 PB11 Configurable GPIO 27 PB13 Configurable GPIO 28 PB14 Configurable GPIO 29 GND Ground 30 ANT RF Antenna (optional) 31 GND Ground NOTE All digital IO ports can be configured as any function of GPIO. 3.3. Power Supply Standard 3.3 V power supply. 3.4.
Bluetooth Module Series 3.5. RESET It supports hardware reset. The reset sequence is shown in the figure below, the Trst > 50 ms. Figure 3: Power on Reset Timing 3.6. I2C Interface The I2C interface is a master or slave interface. It supports 100 kHz, 400 kHz and 800 kHz clock rates for controlling EEPROM etc. The I2C interface provides several data formats and can fit various I2C peripherals. Sequential reading and writing are supported to improve throughputs.
Bluetooth Module Series SPI makes it suitable for most of SPI slave devices for its flexibility. SPI offers four modes due to the programmable ability of SCK’s polarity and phase. The delay from CS to SCK, the delay from SCK to NCS and SCK period are also programmable. SPI timing diagram is shown in figure below: Figure 5: SPI Timing 3.8.
Bluetooth Module Series Single-ended as well as differential input with two input scales Eight single-ended or four differential external input channels Battery monitor function Chopper function Offset and zero scale adjustment Common-mode input voltage adjustment HC06U_Hardware_Design 19 / 31
Bluetooth Module Series 4 Electrical Characteristics 4.1. Absolute Maximum Ratings Table 3: Absolute Maximum Ratings Operating mode Min. Max. Unit Storage Temperature -40 125 °C Human Body Model 2000 - V Machine Model 200 - V Charge Device Mode 500 - V ESD 4.2. Recommended Operating Conditions Table 4: Recommended Operating Conditions Operating mode Min. Typ. Max. Unit Operating temperature -40 - 85 °C I/O voltage 3.1 3.3 3.5 V Supply voltage 2 3.3 3.
Bluetooth Module Series 4.3. RF Characteristics 4.3.1. BLE Transmitter Table 5: BLE Transmitter Parameter Min. Typ. Max. BLE Specification Unit RF transmitted power - 2 - -6–4 dBm Power control range -18 - 2 - dB Frequency offset - 4.02 - -150–150 kHz Frequency drift - -3.31 - -50–50 kHz Frequency drift rate - -3.13 - -20–20 kHz/50 μs Initial carrier drift - -2.
Bluetooth Module Series NOTE Carrier signal strength -67 dBm, adjacent channel interference modulation signal, BER = 0.1 %. 4.3.3. Power Consumption Table 7: Power Consumption Operating Modes Min. Typ. Max. Unit Note Deep sleep - 31.44 - μA Stop the broadcast function, the module enters the sleep state Advertising - 227 - μA ADV interval = 320 ms, the module enters the sleep state Advertising - 3.
Bluetooth Module Series 5 Module Function Description 5.1. RF Transmitter The Radio Transceiver implements the RF part of the Bluetooth Low Energy protocol. Together with the Bluetooth 5.0 PHY layer, this provides a reliable wireless communication. All RF blocks are supplied by on-chip low-drop out-regulators (LDO’s). The Bluetooth LE radio comprises the receiver, transmitter, synthesizer, Rx/Tx combiner block, and biasing LDO’s. 5.2.
Bluetooth Module Series Figure 6: Bluetooth Baseband HC06U_Hardware_Design 24 / 31
Bluetooth Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of HC06U module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified 6.1. Mechanical Dimensions Figure 7: Top and Side Dimensions (Top and Side View) The detailed size information of HC06U is as follows: Table 8: Mechanical Dimensions (Top View) PCB Package Mechanical Size Process Type Stamp holes (16.5 ±0.2) mm × (13.3 ±0.2) mm × (2.
Bluetooth Module Series 6.2.
Bluetooth Module Series 6.3.
Bluetooth Module Series 7 Storage, Manufacturing and Packaging 7.1. Storage Condition The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35 % to 60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
Bluetooth Module Series Table 9: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 7.3. Packaging Specification The module is packaged in a vacuum-sealed bag which is ESD protected.
Bluetooth Module Series Figure 11: Tape Specifications HC06U_Hardware_Design 31 / 31
Bluetooth Module Series 8 Appendix Reference Table 10: Related Document Document Name [1] Quectel_Module_Secondary_SMT_Application_Note HC06U_Hardware_Design 32 / 31
Bluetooth Module Series Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2.
Bluetooth Module Series transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be in-stalled and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID: XMR202107HC06U.
