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UC200A-GL

Hardware Design

UMTS/HSPA+ Module Series

Version: 1.0.0

Date: 2021-11-19

Status: Preliminary

Summary of content (80 pages)

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UC200A-GL Hardware Design UMTS/HSPA+ Module Series Version: 1.0.
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UMTS/HSPA+ Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
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UMTS/HSPA+ Module Series or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
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UMTS/HSPA+ Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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UMTS/HSPA+ Module Series About the Document Revision History Version Date Author Description - 2021-10-29 Anthony LIU/Ethan FANG Creation of the document 1.0.
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UMTS/HSPA+ Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 5 Table Index .
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UMTS/HSPA+ Module Series 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. (U)SIM Interface ................................................................................................................... 37 PCM and I2C Interface ......................................................................................................... 40 UART Interface ..................................................................................................................... 42 SDIO Interface .....................................
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UMTS/HSPA+ Module Series Table Index Table 1: Special Marks ............................................................................................................................. 11 Table 2: Brief Introduction of the Module ................................................................................................. 12 Table 3: Wireless Network Type .............................................................................................................. 12 Table 4: Key Features ............
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UMTS/HSPA+ Module Series Table 42: Terms and Abbreviations ..........................................................................................................
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UMTS/HSPA+ Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................................................................................................... 15 Figure 3: Sleep Mode Application via UART............................................................................................ 23 Figure 4: Sleep Mode Application with USB Remote Wakeup................................................................. 24 Figure 5: Sleep Mode Application with MAIN_RI .......................
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UMTS/HSPA+ Module Series Figure 43: Plastic Reel Dimension Drawing ........................................................................................ 70 Figure 44: Packaging Process.................................................................................................................
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UMTS/HSPA+ Module Series 1 Introduction This document defines UC200A-GL module and describes its air interface and hardware interface which are connected with customers’ applications. This document helps customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of UC200A-GL module. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. 1.1.
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UMTS/HSPA+ Module Series 2 Product Overview UC200A-GL is a WCDMA/GSM wireless communication module. Its general features are listed below： ⚫ ⚫ Supports HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS coverage. Provides audio support for customers’ specific applications. Table 2: Brief Introduction of the Module Categories Packaging and pins number 80 LCC pins; 64 LGA pins Dimensions (29.0 ±0.15) mm × (32.0 ±0.15) mm × (2.4 ±0.2) mm Weight approx. 4.4 g Wireless network functions WCDMA/GSM 2.1.
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UMTS/HSPA+ Module Series 2.2. Key Features Table 4: Key Features Features Details Power Supply ⚫ ⚫ Supply voltage range: 3.4–4.5 V Typical supply voltage: 3.8 V SMS ⚫ ⚫ ⚫ ⚫ Text and PDU modes. Point-to-point MO and MT. SMS cell broadcast. SMS storage: ME by default. (U)SIM Interface ⚫ Supports (U)SIM card: 1.8/3.0 V. Audio Features ⚫ ⚫ ⚫ ⚫ Supports one digital audio interface: PCM interface. GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Supports echo cancellation and noise suppression.
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UMTS/HSPA+ Module Series ⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT commands. Antenna Interface ⚫ ⚫ Main antenna interface (ANT_MAIN). 50 Ω impedance.
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UMTS/HSPA+ Module Series 2.3. Pin Assignment RESERVED GND 55 57 58 56 VBAT_RF VBAT_RF 59 VBAT_BB 60 VBAT_BB 61 STATUS 62 MAIN_RI 63 MAIN_DCD 64 MAIN_CTS 65 MAIN_RTS 66 MAIN_DTR 67 68 MAIN_TXD MAIN_RXD 69 70 USB_DP USB_DM 71 GND USB_VBUS 72 113 RESERVED 114 1 RESERVED The following figure illustrates the pin assignment of the module.
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UMTS/HSPA+ Module Series 1. 2. USB_BOOT cannot be pulled up before startup. Other unused and RESERVED pins are kept open, and all GND pins are connected to the ground network. 2.4. Pin Description The following table shows the DC characteristics and pin descriptions.
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UMTS/HSPA+ Module Series 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA It can provide a pull-up power to the external GPIO. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI Turn on/off the module VDD_EXT Turn On/Off VBAT power domain. Active low. VILmax = 0.5 V RESET_N 20 DI Reset the module Pin Name Pin No.
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UMTS/HSPA+ Module Series 1.8 V (U)SIM： USIM_VDD 14 PO (U)SIM card power supply Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM： Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM： USIM_DATA 15 DIO (U)SIM card data USIM_CLK 16 DO (U)SIM card clock USIM_RST 17 DO (U)SIM card reset VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM： VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM： VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM： VOLmax = 0.45 V VOHmin = 2.
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UMTS/HSPA+ Module Series If unused, keep it open. Main UART Interface Pin Name Pin No. I/O Description DC Characteristics MAIN_RI 62 DO Main UART ring indication MAIN_DCD 63 DO Main UART data carrier detect MAIN_CTS 64 DO DTE clear to send (Connect to DTE’s CTS) MAIN_RTS 65 DI DTE request to send (Connect to DTE’s RTS) MAIN_DTR 66 DI Main UART data terminal ready MAIN_RXD 68 DI Main UART receive MAIN_TXD 67 DO Main UART transmit VOLmax = 0.45 V VOHmin = 1.
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UMTS/HSPA+ Module Series PCM_SYNC PCM_CLK 26 27 DIO DIO PCM data frame sync PCM clock VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. PCM_DIN 24 DI PCM data input VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V PCM_DOUT 25 DO PCM data output VOLmax = 0.45 V VOHmin = 1.
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UMTS/HSPA+ Module Series Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. GND Pin Name Pin No. GND 8, 9, 10,19, 22, 36, 46, 48, 50–54, 56, 72, 85–112 RESERVED Pins Pin Name Pin No. Comment RESERVED 3, 18, 35, 37–40, 43, 47, 55, 73–84,113, 114, 116–144 Keep these pins open. 2.5.
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UMTS/HSPA+ Module Series 3 Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details Idle Software is active. The module is registered on the network and ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
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UMTS/HSPA+ Module Series 3.2.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to enable the module enter sleep mode. ⚫ ⚫ Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host.
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UMTS/HSPA+ Module Series The following figure shows the connection between the module and the host. Host Module USB_VBUS VDD USB_DP USB_DP USB_DM USB_DM AP_READY GPIO GND GND Figure 3: Sleep Mode Application with USB Remote Wakeup ⚫ ⚫ Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will send remote wakeup signals via USB bus to wake up the host. NOTE The AP_READY is active low and the default state is high. 3.2.2.1.
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UMTS/HSPA+ Module Series The following figure shows the connection between the module and the host. Module Host VDD USB_VBUS USB_DP USB_DP USB_DM USB_DM AP_READY GPIO MAIN_RI EINT GND GND Figure 4: Sleep Mode Application with MAIN_RI ⚫ ⚫ Sending data to UC200A-GL through USB will wake up the module. When UC200A-GL has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior. 3.2.2.2.
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UMTS/HSPA+ Module Series Turn on the power switch and supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. 3.3.1. Hardware The W_DISABLE# pin is pulled up by default.
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UMTS/HSPA+ Module Series The following table shows the details of power supply and GND pins. Table 8: Pin Definition of Power Supply Pin Name Pin No. VBAT_BB 59, 60 VBAT_RF 57, 58 VDD_EXT 7 I/O Description Comment PI Power supply for the module’s baseband part It must be provided with sufficient current up to 0.8 A. PI Power supply for the module’s RF part It must be provided with sufficient current up to 1.8 A. Provide 1.
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UMTS/HSPA+ Module Series ⚫ NOTE 1. If you use the module that does not support the GSM band, a power supply capable of providing at least 2 A can be used in the design. 2. It is recommended to design switch control for power supply. 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.4 V to 4.5 V. Please make sure the input voltage will never drop below 3.4 V.
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UMTS/HSPA+ Module Series VBAT VBAT_RF VBAT_BB + + D1 C3 C2 C1 100 nF WS4.5D3HV 100 µF C5 C4 33 pF 10 pF 100 µF C6 C7 C8 100 nF 33 pF 10 pF Module Figure 8: Star Structure of the Power Supply 3.5. Turn On 3.5.1. Turn on the Module with PWRKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module VBAT power domain. Active low.
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UMTS/HSPA+ Module Series Another way to control the PWRKEY is using a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. S1 PWRKEY TVS Turn-on pulse M odule Close to S1 Figure 10: Turning on the Module with a Button The power up scenario is illustrated in the following figure.
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UMTS/HSPA+ Module Series . NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 4.7 kΩ resistor if module needs to be powered on automatically and shutdown is not needed. 3.6. Turn Off The following procedures can be used to turn off the module. 3.6.1.
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UMTS/HSPA+ Module Series See document [2] for details about AT+QPOWD. . NOTE 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off module with the AT command, please keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. 3.7.
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UMTS/HSPA+ Module Series S2 RESET_N TVS Close to S2 Figure 14: Reference Circuit of RESET_N with Button The timing of resetting module is illustrated in the following figure. VBAT ≥ 300 ms RESET_N VIL ≤ 0.5 V Module Status Running Baseband resetting Baseband restart Figure 15: Timing of Resetting Module ⚫ NOTE 1. 2. Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY and RESET_N pins.
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UMTS/HSPA+ Module Series 4 Application Interfaces 4.1. USB Interface UC200A-GL provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface.
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UMTS/HSPA+ Module Series It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface.
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UMTS/HSPA+ Module Series 4.2. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 13: Pin Definition of USB_BOOT Interface Pin Name USB_BOOT Pin No. 115 I/O DI Description Comment Forces the module to enter download mode 1.8 V power domain. Active High.
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UMTS/HSPA+ Module Series NOTE 1 VBAT 500 ms PWRKEY VIL 0.5V About 5 ms VDD_EXT USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. USB_BOOT About 22 ms RESET_N Figure 18: Timing Sequence for Entering Emergency Download Mode . NOTE 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2.
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UMTS/HSPA+ Module Series card is supported and can be identified automatically by the module. USIM_DATA 15 DIO (U)SIM card data USIM_CLK 16 DO (U)SIM card clock USIM_RST 17 DO (U)SIM card reset USIM_DET 13 DI (U)SIM card hot-plug detect 1.8 V power domain. If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pin, the function supports low-level and high-level detections. By default, it is disabled, and can be configured via AT+QSIMDET.
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UMTS/HSPA+ Module Series If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
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UMTS/HSPA+ Module Series 4.4. PCM and I2C Interface The module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and the module works as both master and slave. The module can only be used as primary devices in applications related to I2C interfaces. In short frame mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB.
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UMTS/HSPA+ Module Series PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output 1.8 V power domain. If unused, keep it open. Table 16: Pin Definition of I2C Interface Pin Name Pin No. I/O Description Comment I2C_SCL 41 OD I2C serial clock I2C_SDA 42 OD I2C serial data Used for external Codec. An external 1.8 V pull-up resistor is needed.
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UMTS/HSPA+ Module Series 4.5. UART Interface The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. ⚫ ⚫ The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps baud rates, and the baud rate is 115200 bps by default. This interface is used for data transmission and AT command communication. Also, it supports RTS and CTS hardware flow control.
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UMTS/HSPA+ Module Series VDD_EXT VCCA 120K VCCB 10K 0.1 μF VDD_MCU 0.1 μF OE GND MAIN_RI A1 B1 RI_MCU MAIN_DCD A2 B2 DCD_MCU B3 CTS_MCU Translator MAIN_CTS A3 MAIN_RTS A4 B4 RTS_MCU MAIN_DTR A5 B5 DTR_MCU MAIN_TXD A6 B6 RXD_MCU MAIN_RXD A7 B7 A8 B8 51K TXD_MCU 51K Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor circuit is shown as below.
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UMTS/HSPA+ Module Series 4.6. SDIO Interface The module provides one SD card interface which supports SD 3.0 protocol. Table 19: Pin Definition of SD Card Interface Pin Name Pin No.
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UMTS/HSPA+ Module Series ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ The voltage range of SD card power supply VDD_3V is 2.7–3.6 V and a sufficient current up to 800 mA should be provided. The maximum output current of SD_SDIO_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, R7–R11 are needed to pull up the SDIO to SD_SDIO_VDD. Value of these resistors is among 10 kΩ to 100 kΩ and the recommended value is 100 kΩ.
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UMTS/HSPA+ Module Series The resolution of the ADC is up to 12 bits. The following table describes the characteristic of the ADC interface. Table 21: Characteristics of ADC Interface Name Min. Typ. Max. Unit ADC0 Voltage Range 0 - VBAT_BB V ADC1 Voltage Range 0 - VBAT_BB V ADC Resolution - 12 - bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. 2. It is prohibited to supply any voltage to ADC pin when VBAT is removed. 3.
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UMTS/HSPA+ Module Series Table 23: Working State of the Network Connection Status/Activity Indication Pin Name Status Description Always High Registered on UMTS network Always Low Others Flicker slowly (200 ms High/1800 ms Low) Network searching Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing Always High Voice calling NET_MODE NET_STATUS VBAT Module 2.2 K NET_STATUS 4.
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UMTS/HSPA+ Module Series VBAT VDD_MCU 33 K 2.2 K STATUS MCU_GPIO Module STATUS Module Figure 27: Reference Circuits of STATUS NOTE The status pin cannot be used as indication of module shutdown status when VBAT is removed. 4.9. Behaviors of the MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin.
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UMTS/HSPA+ Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Cellular Network Interface Pin Name Pin No. I/O Description ANT_MAIN 49 AIO Main antenna interface Comment ⚫ NOTE Only passive antennas are supported. Considering authentication requirements, it is recommended to reserve diversity positions for overseas versions.
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UMTS/HSPA+ Module Series WCDMA B5 826–847 871–892 WCDMA B8 882–913 927–958 5.1.2. Tx Power The following table shows the Tx power of the module. Table 27: Tx Power . Frequency Max. Tx Power Min.
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UMTS/HSPA+ Module Series 5.1.3. Rx Sensitivity The following table shows conducted Rx sensitivity of the module. Table 28: Conducted RF Receiving Sensitivity of UC200A-GL Receiving Sensitivity (Typ.) Primary Diversity SIMO 3GPP Requirement (SIMO) GSM850 TBD - - -102 dBm EGSM900 TBD - - -102 dBm DCS1800 TBD - - -102 dBm PCS1900 TBD - - -102 dBm WCDMA B1 TBD - - -106.7 dBm WCDMA B2 TBD - - -104.7 dBm WCDMA B5 TBD - - -104.7 dBm WCDMA B8 TBD - - -103.
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UMTS/HSPA+ Module Series Main antenna Module R1 0R ANT_MAIN C1 C2 NM NM Figure 28: Reference Circuit for RF Antenna Interfaces 5.2. Reference Design of RF Routing For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
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UMTS/HSPA+ Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) UC200A-GL_Hardware_Design 53 / 79
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UMTS/HSPA+ Module Series In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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UMTS/HSPA+ Module Series 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.
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UMTS/HSPA+ Module Series The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
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UMTS/HSPA+ Module Series 6 Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 30: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 5.5 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB - 0.8 A Peak Current of VBAT_RF - 1.8 A Voltage on Digital Pins -0.3 2.
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UMTS/HSPA+ Module Series 6.2. Power Supply Ratings Table 31: The Module’s Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.4 3.8 4.5 V Voltage drop during transmitting burst Maximum power control level at EGSM 900. 0 0 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level at EGSM 900. 0 1.8 2.
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UMTS/HSPA+ Module Series DCS1800 @ DRX = 9 (USB disconnected) TBD mA WCDMA @ PF = 64 (USB disconnected) TBD mA WCDMA @ PF = 64 (USB suspend) TBD mA WCDMA @ PF = 128 (USB disconnected) TBD mA WCDMA @ PF = 256 (USB disconnected) TBD mA WCDMA @ PF = 512 (USB disconnected) TBD mA EGSM900 @ DRX = 5 (USB disconnected) TBD mA EGSM900 @ DRX = 5 (USB connected) TBD mA WCDMA @ PF = 64 (USB disconnected) TBD mA WCDMA @ PF = 64 (USB connected) TBD mA EGSM900 4DL/1UL @ 32.
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UMTS/HSPA+ Module Series DCS1800 1DL/4UL @ 21.93 dBm TBD mA WCDMA B1 HSDPA @ 22.06 dBm TBD mA WCDMA B5 HSDPA @ 21.68 dBm TBD mA WCDMA B8 HSDPA @ 21.64 dBm TBD mA WCDMA B1 HSUPA @ 21.30 dBm TBD mA WCDMA B5 HSUPA @ 20.02 dBm TBD mA WCDMA B8 HSUPA @ 21.03 dBm TBD mA EGSM900 PCL = 5 @ 32.24 dBm TBD mA EGSM900 PCL = 12 @ 19.09 dBm TBD mA EGSM900 PCL = 19 @ 5.82 dBm TBD mA DCS1800 PCL = 0 @ 29.40 dBm TBD mA DCS1800 PCL = 7 @ 15.75 dBm TBD mA DCS1800 PCL = 15 @ -0.
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UMTS/HSPA+ Module Series Table 34: (U)SIM 1.8 V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 1.7 1.9 V VIH Input high voltage 1.2 2.0 V VIL Input low voltage -0.3 0.6 V VOH Output high voltage 1.35 1.8 V VOL Output low voltage -0.3 0.45 V Table 35: (U)SIM 3.0 V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 2.7 3.05 V VIH Input high voltage 1.95 3.05 V VIL Input low voltage -0.3 1.
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UMTS/HSPA+ Module Series Table 36: Electrostatics Discharge Characteristics (25 °C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±8 ±10 kV All Antenna Interfaces ±8 ±10 kV Other Interfaces ±0.5 ±1 kV 6.6. Operating and Storage Temperatures Table 37: Operating and Storage Temperatures Parameter Operating Temperature Range 3 Extended Operating Temperature Range Storage temperature range 4 Min. Typ. Max.
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UMTS/HSPA+ Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1.
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UMTS/HSPA+ Module Series Pin 1 Figure 37: Module Bottom Dimensions View (Unit: mm) ⚫ NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.
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UMTS/HSPA+ Module Series 7.2. Recommended Footprint Figure 38: Recommended Footprint (Bottom View) . NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.
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UMTS/HSPA+ Module Series 7.3. Top and Bottom Views Figure 39: Top and Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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UMTS/HSPA+ Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage restrictions are shown as below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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UMTS/HSPA+ Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
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UMTS/HSPA+ Module Series Table 38: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1 to 3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70 to 120 s Reflow Zone Max slope 2 to 3 °C/s Reflow time (D: over 217 °C) 45 to 70 s Max temperature 235 to 246 °C Cooling down slope -1.5 ~ -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1. 2. 3. 4. 5.
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UMTS/HSPA+ Module Series 8.3. Packaging Specifications The module is packaged in tape and reel carriers. One reel is 11.88 meters long and contains 250 modules. The figures below show the package details, measured in mm. Figure 41: Carrier Tape Dimension Drawing Table 39: Carrier Tape Dimension Table (Unit: mm) W P T A0 B0 K0 K1 F E 44 44 0.35 32.5 29.5 3.0 3.8 20.2 1.75 8.3.1.
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UMTS/HSPA+ Module Series Table 40: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 W 330 100 44.5 8.3.2. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it.
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UMTS/HSPA+ Module Series 9 Appendix References Table 41: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_UC200T_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note Table 42: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AON Active Optical Network AP Application Processor bps Bits Per Second BPSK Binary Phase Shift Keying CHAP Challe
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UMTS/HSPA+ Module Series DCE Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access DDR Double Data Rate DFOTA Delta Firmware Upgrade Over the Air DL Downlink DRX Diversity Receive DTE Data Terminal Equipment DTR Data Terminal Ready EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FEM Front-End Module FR Full Rate GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS Global Na
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UMTS/HSPA+ Module Series I2C Inter-Integrated Circuit I2S Inter-IC Sound I/O Input/Output Inom Normal Current LAA License Assisted Access LB Low Band LED Light Emitting Diode LGA Land Grid Array LMHB Low/Middle/High Band LNA Low Noise Amplifier LTE Long Term Evolution MAC Media Access Control MB Middle Band MCU Microcontroller Unit MDC Management Data Clock MDIO Management Data Input/Output MHB Middle/High Band MIMO Multiple Input Multiple Output MO Mobile Originated M
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UMTS/HSPA+ Module Series PC Personal Computer PCB Printed Circuit Board PCIe Peripheral Component Interconnect Express PCM Pulse Code Modulation PDA Personal Digital Assistant PDU Protocol Data Unit PHY Physical Layer PMIC Power Management Integrated Circuit PRX Primary Receive QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying QZSS Quasi-Zenith Satellite System RI Ring Indicator RF Radio Frequency RGMII Reduced Gigabit Media Independent Interface RHCP Rig
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UMTS/HSPA+ Module Series STB Set Top Box TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TRX Transmit & Receive Tx Transmit UART Universal Asynchronous Receiver/Transmitter UHB Ultra High Band UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code USB Universal Serial Bus (U)SIM Universal Subscriber Identity Module VBAT Voltage at Battery (Pin) Vmax Maximum Voltage Vn
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UMTS/HSPA+ Module Series VOLmax Maximum Low-level Output Voltage VOLmin Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WWAN Wireless Wide Area Network 10 Warnings sentences 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3.
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UMTS/HSPA+ Module Series required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
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UMTS/HSPA+ Module Series (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.