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EC21 Series

Hardware Design

LTE Standard Module Series

Version: 1.9

Date: 2021-08-17

Status: Released

Summary of content (122 pages)

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EC21 Series Hardware Design LTE Standard Module Series Version: 1.
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LTE Standard Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
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LTE Standard Module Series Copyright The information contained here is proprietary technical information of Quectel Wireless Solutions Co., Ltd. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
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LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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LTE Standard Module Series metal powders.
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LTE Standard Module Series About the Document Revision History Version Date Author Description 1.0 2016-04-15 Yeoman CHEN Initial Yeoman CHEN/ Frank WANG/ Lyndon LIU 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5.
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LTE Standard Module Series 10. Added note about SIMO in Chapter 6.6. 1. 2. 3. 4. 5. 1.3 2017-01-24 Lyndon LIU/ Rex WANG 6. 7. 8. 9. 10. 1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.5 2018-03-05 Annice ZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. EC21_Series_Hardware_Design Updated frequency bands in Table 1. Updated function diagram in Figure 1. Updated pin assignment (top view) in Figure 2.
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LTE Standard Module Series 20. Updated storage information in Chapter 8.1 1.6 2019-04-30 Woody WU/ Nathan LIU/ Frank WANG 1. Added new variants EC21-EU and related information. 2. Updated star structure of the power supply in Figure 8. 3. Updated power-on scenario of module in Figure 12. 4. Updated reference circuit with translator chip in Figure 20. 5. Added timing sequence for entering emergency download mode of USB_BOOT interface in Figure 32. 6. Updated GNSS frequency in Table 29. 7.
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LTE Standard Module Series 8. 9. 10. 11. 12. 13. 1.8 2019-11-26 Fanny CHEN 1. Removed related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. AT command AT+QCFG="airplanecontrol" has been fully developed in Chapter 3.5. 4. Updated the notes for GNSS performance in Chapter 4.2. 5. Updated the AT command be used to disable the receive diversity in Chapter 5.1.3. 1. 2. 3. 1.9 2021-08-17 Barret XIONG 4. 5. 6. 7.
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LTE Standard Module Series Contents Safety Information...................................................................................................................................................... 3 About the Document..................................................................................................................................................5 Contents..................................................................................................................................
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LTE Standard Module Series 3.14. Interfaces for WLAN & Bluetooth Applications................................................................................ 58 3.14.1. WLAN Application Interface......................................................................................................61 3.14.2. Bluetooth Application Interface................................................................................................ 61 3.15. ADC Interfaces.....................................................
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LTE Standard Module Series 8 Appendix References....................................................................................................................................
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LTE Standard Module Series Table Index Table 1: Special Marks..............................................................................................................................................18 Table 2: Supported Frequency Bands and GNSS Function of EC21 Series Module.................................... 19 Table 3: Key Features of EC21 Series Module.................................................................................................... 20 Table 4: I/O Parameters Definition..........
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LTE Standard Module Series Table 42: Absolute Maximum Ratings....................................................................................................................86 Table 43: Power Supply Ratings............................................................................................................................. 87 Table 44: Operating and Storage Temperatures..................................................................................................
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LTE Standard Module Series Figure Index Figure 1: Functional Diagram.................................................................................................................................. 23 Figure 2: Pin Assignment (Top View)..................................................................................................................... 26 Figure 3: Sleep Mode Application via UART.........................................................................................................
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LTE Standard Module Series Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module)............................................. 105 Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)..........................105 Figure 44: Module Top and Side Dimensions.....................................................................................................107 Figure 45: Module Bottom Dimensions (Bottom View).......................................................
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LTE Standard Module Series 1 Introduction This document defines EC21 series module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC21 series module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
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LTE Standard Module Series permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).
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LTE Standard Module Series L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.
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LTE Standard Module Series 2 Product Overview 2.1. Frequency Bands and Functions EC21 series module is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS 1 and voice functionality 2 for customers’ specific applications.
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LTE Standard Module Series EC21-AUT FDD: B1/B3/B5/B7/B28 B1/B5 - √ EC21-J FDD: B1/B3/B8/B18/B19/ B26 - - √ - EC21-KL FDD: B1/B3/B5/B7/B8 - - √ - EC21-AUX 3 FDD: B1/B2/B3/B4/B5/B7/ B8/B28 TDD: B40 B1/B2/B4/ B5/B8 850/900/1800/ 1900 MHz √ √ EC21-EUX FDD: B1/B3/B7/B8/B20/ B28A B1/B8 900/1800 MHz √ √ With a compact profile of 29.0 mm × 32.0 mm × 2.
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LTE Standard Module Series LTE Features UMTS Features GSM Features       Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm ±2 dB) for LTE-FDD bands Class 3 (23 dBm ±2 dB) for LTE-TDD bands      Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20 MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max. 10 Mbps (DL)/Max.
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LTE Standard Module Series   Supports long frame synchronization and short frame synchronization Supports master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480 Mbps  Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB  Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6–5.12, Android 4.x–11.x, etc.
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LTE Standard Module Series Firmware Upgrade USB 2.0 interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of EC21 series and illustrates the major functional parts.
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LTE Standard Module Series 2.4. EVB To help customers develop applications with EC21 series, Quectel supplies an evaluation board (UMTS<E EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, see document [1].
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LTE Standard Module Series 3 Application Interfaces 3.1. General Description EC21 series module is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions.
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LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of EC21 series module.
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LTE Standard Module Series 5. 6. 7. 8. function pins. Bluetooth function is under development. Pins 119–126 and pin 128 are used for SGMII interface. Pins 24–27 for PCM function are used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. Keep all RESERVED pins and unused pins unconnected. GND pins 85–112 should be connected to ground in the design.
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LTE Standard Module Series VBAT_RF 57, 58 PI PO Power supply for module’s RF part Provide 1.8 V for external circuit Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current up to 1.8 A in a burst transmission. Vnom = 1.8 V IOmax = 50 mA Power supply for external GPIO’s pullup circuits. When used with FC20 series/FC21 modules, it also defaults to supply power to the VIO pin of FC20 series/FC21 modules. If unused, keep it open.
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LTE Standard Module Series NET_STATUS VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open. Comment 6 DO Indicate the module’s network activity status Pin No. I/O Description DC Characteristics Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V USB Interface Pin Name USB_VBUS 71 DI USB connection detect USB_DP 69 AIO USB differential data (+) USB_DM 70 AIO USB differential data (-) Pin Name Pin No. I/O Description USIM_GND 10 USB 2.0 Compliant.
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LTE Standard Module Series VOHmin = 2.55 V 1.8 V (U)SIM： VOLmax = 0.45 V VOHmin = 1.35 V USIM_CLK 16 DO (U)SIM card clock 3.0 V (U)SIM： VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM： VOLmax = 0.45 V VOHmin = 1.35 V USIM_RST 17 DO (U)SIM card reset 3.0 V (U)SIM： VOLmax = 0.45 V VOHmin = 2.55 V Main UART Interface DC Characteristics Comment VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep them open. DTE request to send signal from DCE VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.
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LTE Standard Module Series Pin Name Pin No. I/O Description DC Characteristics DBG_TXD 12 DO Debug UART transmit VOLmax = 0.45 V VOHmin = 1.35 V 11 DI Debug UART receive VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V Pin Name Pin No. I/O Description DC Characteristics ADC0 45 AI General-purpose ADC interface Voltage range: 0.3 V to VBAT_BB ADC1 44 AI General-purpose ADC interface Voltage range: 0.3 V to VBAT_BB Pin No.
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LTE Standard Module Series Pin Name Pin No. I/O Description SDC2_DATA3 28 DIO SD card SDIO data bit 3 SDC2_DATA2 29 DIO SD card SDIO data bit 2 DIO SD card SDIO data bit 1 SDC2_DATA1 SDC2_DATA0 30 31 DIO SD card SDIO data bit 0 DC Characteristics 1.8 V signaling: VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling: VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.
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LTE Standard Module Series VDD_SDIO 34 PO SD card SDIO pullup power IOmax = 50 mA Configurable power supply. 1.8/2.85 V power domain. Cannot be used for SD card power supply. If unused, keep it open. Pin No. I/O Description DC Characteristics Comment SGMII Interface Pin Name 1.8 V: VOLmax = 0.45 V VOHmin = 1.4 V EPHY_RST_N 119 DO Ethernet PHY reset 2.85 V: VOLmax = 0.35 V VOHmin = 2.14 V EPHY_INT_N 120 DI Ethernet PHY interrupt VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.
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LTE Standard Module Series SGMII_TX_P 124 AO SGMII transmit (+) SGMII_RX_P 125 AI SGMII receive (+) SGMII_RX_M 126 AI SGMII receive (-) USIM2_VDD 128 PO 0.1 μF capacitor, and close to the PHY side. If unused, keep them open. Connect it with a 0.1 μF capacitor, and close to the module. If unused, keep them open. Configurable power supply. 1.8/2.85 V power domain. If unused, keep it open. SGMII_MDATA pullup power supply Interfaces for WLAN and Bluetooth Applications Pin Name Pin No.
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LTE Standard Module Series before startup. If unused, keep it open. COEX_UART_ RX 137 DI LTE/WLAN & Bluetooth coexistence receive VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open.
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LTE Standard Module Series open. Other Interface Pins Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Cannot be pulled up before startup. Low level can wake up the module. If unused, keep it open. DI Airplane mode control VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Pull-up by default. At low level, module can enter airplane mode.
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LTE Standard Module Series 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 6: Overview of Operating Modes Mode Normal Operation Details Idle The module remains registered on the network, and is ready to send and receive data. In this mode, the software is active. Talk/Data The module is connected to network. Its current consumption varies with the network setting and data transfer rate.
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LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART    Driving the module’s DTR to low level will wake up the module. When module has a URC to report, RI signal will wake up the host. See Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). For more details about AT+QCFG="apready", see document [3]. 3.5.1.2.
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LTE Standard Module Series   Sending data to module via USB will wake up the module. When module has a URC to report, the module will send remote wake-up signals via USB bus to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode.
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LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application Without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Pay attention to the voltage-level matching of the circuit in dotted line between the module and the host. For more details about EC21 series power management application, see document [4]. 3.5.2.
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LTE Standard Module Series NOTE 1. 2. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol". For details of the command, see document [2]. The execution of AT+CFUN will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC21 series provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT.   Two VBAT_RF pins for module’s RF part.
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LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease voltage-drop, use bypass capacitors of at least 100 µF with low ESR, and reserve a multilayer ceramic chip capacitor (MLCC) array due to their low ESR. It is recommended to use at least three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB and VBAT_RF pins.
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LTE Standard Module Series to provide sufficient current up to 2.0 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0 V input power source. The typical output of the power supply is about 3.
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LTE Standard Module Series Table 8: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the baseband chipset. When the module is in power down mode, it can be turned on by driving the PWRKEY pin low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
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LTE Standard Module Series The power-up scenario is illustrated in the following figure. Figure 12: Power-up Timing NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10 kΩ resistor if the module needs to be powered on automatically and shutdown is not needed. 3.7.2.
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LTE Standard Module Series  Turn off the module using AT+QPOWD. For details of the command, see document [2]. 3.7.2.1. Turn off with PWRKEY Driving the PWRKEY pin low for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. Figure 13: Power-down Timing 3.7.2.2.
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LTE Standard Module Series for 150–460 ms. Table 9: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using a Button The reset scenario is illustrated in the following figure.
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LTE Standard Module Series Figure 16: Reset Timing NOTE 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 10: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment Either 1.8 V or 3.0 V is supported by the module automatically.
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LTE Standard Module Series USIM_GND 10 Specified ground for (U)SIM card EC21 series supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET. See document [2] for more details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
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LTE Standard Module Series USIM_VDD USIM_GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 100 nF (U)SIM Card Connector VCC RST CLK 0R 0R 0R GND VPP IO 33 pF 33 pF 33 pF GND GND Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as poss
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LTE Standard Module Series 3.10. USB Interface EC21 series contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as a slave device. EC21 series module can be used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB.
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LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default.
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LTE Standard Module Series CTS 64 DO DTE clear to send signal from DCE RTS 65 DI DTE request to send signal from DCE DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit RXD 68 DI Receive 1.8 V power domain. Pulled up by default. Driving it low can wake up the module. If unused, keep it open. 1.8 V power domain. If unused, keep them open. Table 13: Pin Definition of Debug UART Interface Pin Name Pin No.
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LTE Standard Module Series Figure 21: Reference Circuit with Transistor Circuit NOTE 1. 2. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 3.12.
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LTE Standard Module Series EC21 series supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.
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LTE Standard Module Series Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock I2C_SCL 41 OD I2C serial clock (for external codec) I2C_SDA 42 OD I2C serial data (for external codec) Comment 1.8 V power domain If unused, keep them open. 1.8 V power domain. Serve as output signal in master mode. Serve as input signal in slave mode.
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LTE Standard Module Series 3.13. SD Card Interface EC21 series module supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.
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LTE Standard Module Series In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:          SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7–3.6 V and sufficient current up to 0.8 A should be provided. As the maximum output current of VDD_SDIO is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card.
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LTE Standard Module Series SDC1_DATA1 131 DIO WLAN SDIO data bit 1 SDC1_DATA0 132 DIO WLAN SDIO data bit 0 SDC1_CLK 133 DO WLAN SDIO clock SDC1_CMD 134 DIO WLAN SDIO command WLAN function enable 1.8 V power domain Active high. Cannot be pulled up before startup. If unused, keep it open. DO WLAN power control 1.8 V power domain. Active high. If unused, keep it open. 135 DI WLAN wake up the module 1.8 V power domain. Active low. If unused, keep it open.
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LTE Standard Module Series PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock 1.8 V power domain. Serve as output signal in master mode. Serve as input signal in slave mode. If unused, keep them open. The following figure shows a reference design of interfaces for WLAN and Bluetooth application with Quectel FC20 series/FC21 modules.
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LTE Standard Module Series 1. 2. 3. FC20 series/FC21 modules can only be used as a slave device. When Bluetooth function is enabled on EC21 series module, PCM_SYNC and PCM_CLK pins are only used to output signals. Bluetooth function is under development. For more information about interfaces for WLAN and Bluetooth applications, see document [6]. 3.14.1. WLAN Application Interface EC21 series provides a low power SDIO 3.0 interface and a control interface for WLAN design.
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LTE Standard Module Series Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description Comment ADC0 45 General-purpose ADC interface ADC1 44 General-purpose ADC interface If unused, keep them open. The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. Typ. Max. Unit ADC0 Voltage Range 0.3 - VBAT_BB V ADC1 Voltage Range 0.3 - VBAT_BB V ADC Resolution - 15 - bits NOTE 1. 2. 3.
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LTE Standard Module Series Table 19: Pin Definition of SGMII Interface Pin No. Pin Name I/O Description Comment Control Signal Interface EPHY_RST_N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_MDATA 121 DIO SGMII MDIO data SGMII_MCLK 122 DO SGMII MDIO clock USIM2_VDD 128 PO SGMII_MDATA pull-up power supply 1.8/2.85 V power domain. If unused, keep them open. Configurable power supply. 1.8/2.85 V power domain. If unused, keep it open.
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LTE Standard Module Series Figure 28: Reference Design of SGMII Interface with PHY AR8033 Application To enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:     Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 25.
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LTE Standard Module Series Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain If unused, keep it open.
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LTE Standard Module Series 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series 3.19. RI AT+QCFG="risignaltype","physical" can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behaviors of RI pin. See document [3] for details. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG. The default port is USB AT port. See document [2] for details. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below.
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LTE Standard Module Series The following figure shows a reference circuit of USB_BOOT interface. Module VDD_EXT Test points USB_BOOT 4.7K Close to test points TVS Figure 31: Reference Circuit of USB_BOOT Interface Figure 32: Timing Sequence for Entering Emergency Download Mode NOTE 1. 2. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms.
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LTE Standard Module Series 4 RF Specifications EC21 series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high-speed movement and multipath effect, and a GNSS antenna interface. The impedance of antenna ports is 50 Ω. 4.1. Cellular Network 4.1.1. Antenna Interfaces & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series WCDMA B2 1850–1910 1930–1990 MHz WCDMA B4 1710–1755 2110–2155 MHz WCDMA B5 824–849 869–894 MHz WCDMA B8 880–915 925–960 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B2 1850–1910 1930–1990 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B4 1710–1755 2110–2155 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–915 925–960 MHz LTE-FDD B12 699–716 729–746 MHz LTE-FDD B13 777–787 746–756 MHz LTE-FDD
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LTE Standard Module Series 4.1.3. Tx Power The following table shows the RF output power of EC21 series module. Table 27: RF Output Power Frequency Max. RF output power Min.
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LTE Standard Module Series DCS1800 -109.0 dBm - - -102.0 dBm WCDMA B1 -110.5 dBm - - -106.7 dBm WCDMA B5 -110.5 dBm - - -104.7 dBm WCDMA B8 -110.5 dBm - - -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -98.0 dBm -101.5 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -98.5 dBm -101.5 dBm -93.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.5 dBm -101.0 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97.0 dBm -97.0 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -97.0 dBm -97.0 dBm -101.0 dBm -93.
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LTE Standard Module Series LTE-FDD B13 (10 MHz) -97.7 dBm -97.0 dBm -100.0 dBm -93.3 dBm Table 31: EC21-AU Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO GSM850 -109.0 dBm - - -102.0 dBm EGSM900 -109.0 dBm - - -102.0 dBm DCS1800 -109.0 dBm - - -102.0 dBm PCS1900 -109.0 dBm - - -102.0 dBm WCDMA B1 -110.0 dBm - - -106.7 dBm WCDMA B2 -110.0 dBm - - -104.7 dBm WCDMA B5 -111.0 dBm - - -104.
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LTE Standard Module Series Table 32: EC21-EU Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109.0 dBm - - -102.0 dBm DCS1800 -109.0 dBm - - -102.0 dBm WCDMA B1 -110.5 dBm - - -106.7 dBm WCDMA B8 -110.5 dBm - - -103.7 dBm LTE-FDD B1 (10 MHz) -98.2 dBm -99 dBm -101.7 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -98.7 dBm -99.5 dBm -101.2 dBm -93.3 dBm LTE-FDD B7 (10 MHz) -96.8 dBm -98.5 dBm -100.
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LTE Standard Module Series Table 34: EC21-J Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Diversity SIMO 8 LTE-FDD B1 (10 MHz) -97.5 dBm -98.7 dBm -100.2 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -97.1 dBm -100.5 dBm -93.3 dBm LTE-FDD B8 (10 MHz) -98.4 dBm -99.0 dBm -101.2 dBm -93.3 dBm LTE-FDD B18 (10 MHz) -99.5 dBm -99.0 dBm -101.7 dBm -96.3 dBm LTE-FDD B19 (10 MHz) -99.2 dBm -99.0 dBm -101.4 dBm -96.
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LTE Standard Module Series PCS1900 -109.0 dBm - - -102.0 dBm WCDMA B1 -110.0 dBm -109.5 dBm -112 dBm -106.7 dBm WCDMA B2 -110.5 dBm - - -104.7 dBm WCDMA B4 -110.0 dBm -110 dBm -112 dBm -104.7 dBm WCDMA B5 -111.0 dBm -112 dBm -113 dBm -104.7 dBm WCDMA B8 -111.0 dBm -112 dBm -113 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -97.7 dBm -101.2 dBm -96.3 dBm LTE-FDD B2 (10 MHz) -98.5 dBm - - -94.3 dBm LTE-FDD B3 (10 MHz) -99.0 dBm -98.8 dBm -102.2 dBm -93.
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LTE Standard Module Series LTE-FDD B7 (10 MHz) -97.0 dBm -96.0 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98.5 dBm -97.0 dBm -101.0 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97.5 dBm -99.0 dBm -100.5 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.0 dBm -98.7 dBm -101.0 dBm -94.8 dBm 4.1.5. Reference Design A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default.
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LTE Standard Module Series 4.2. GNSS 4.2.1. Antenna Interface and Frequency Bands EC21 series includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou (COMPASS), Galileo and QZSS. EC21 series supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC21 series GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series 4.2.2. GNSS Performance The following table shows the GNSS performance of EC21 series. Table 40: GNSS Performance Parameter Sensitivity (GNSS) Description Conditions Typ. Unit Cold start Autonomous -146 dBm Reacquisition Autonomous -157 dBm Tracking Autonomous -157 dBm Autonomous 35 s XTRA enabled 18 s Autonomous 26 s XTRA enabled 2.2 s Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @ open sky < 2.
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LTE Standard Module Series 4.2.3. Reference Design A reference design of GNSS antenna is shown as below. Figure 34: Reference Circuit of GNSS Antenna NOTE 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 4.2.4. Layout Guidelines The following layout guidelines should be taken into account in customers’ designs.
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LTE Standard Module Series traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. .
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LTE Standard Module Series Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:       Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series 4.4. Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 41: Antenna Requirements Type Requirements GNSS 9 Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.
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LTE Standard Module Series Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector.
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LTE Standard Module Series Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. .
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LTE Standard Module Series 5 Electrical Characteristic and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 42: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series 5.2. Power Supply Ratings Table 43: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900 - - 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 - 1.8 2.0 A USB_VBUS USB connection detection - 3.
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LTE Standard Module Series 5.4. Power Consumption The values of current consumption are shown below. Table 45: EC21-E Current Consumption Description Conditions Typ. Unit OFF state Power down 13 μA AT+CFUN=0 (USB disconnected) 1.4 mA EGSM900 @ DRX = 9 (USB disconnected) 1.8 mA DCS1800 @ DRX = 9 (USB disconnected) 1.8 mA WCDMA PF = 64 (USB disconnected) 2.4 mA WCDMA PF = 128 (USB disconnected) 1.9 mA LTE-FDD PF = 64 (USB disconnected) 3.2 mA LTE-FDD PF = 128 (USB disconnected) 2.
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LTE Standard Module Series EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 2DL/3UL @ 28.8 dBm 431 mA DCS1800 1DL/4UL @ 29.
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LTE Standard Module Series WCDMA B5 @ 23.61 dBm 741 mA WCDMA B8 @ 23.35 dBm 564 mA Table 46: EC21-A Current Consumption Description Conditions Typ. Unit OFF state Power down 10 μA AT+CFUN=0 (USB disconnected) 1.25 mA WCDMA PF = 64 (USB disconnected) 2.03 mA WCDMA PF = 128 (USB disconnected) 1.65 mA LTE-FDD PF = 64 (USB disconnected) 2.31 mA LTE-FDD PF = 128 (USB disconnected) 1.85 mA WCDMA PF = 64 (USB disconnected) 23.1 mA WCDMA PF = 64 (USB connected) 32.
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LTE Standard Module Series WCDMA B4 @ 22.91 dBm 590.0 mA WCDMA B5 @ 23.06 dBm 493.0 mA Table 47: EC21-V Current Consumption Description Conditions Typ. Unit OFF state Power down 10 μA AT+CFUN = 0 (USB disconnected) 1.07 mA LTE-FDD PF = 64 (USB disconnected) 2.85 mA LTE-FDD PF = 128 (USB disconnected) 2.26 mA LTE-FDD PF = 64 (USB disconnected) 22.0 mA LTE-FDD PF = 64 (USB connected) 32.0 mA LTE-FDD B4 @ 22.77 dBm 762.0 mA LTE-FDD B13 @ 23.05 dBm 533.
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LTE Standard Module Series Idle state (GNSS OFF) GPRS data transfer (GNSS OFF) WCDMA PF = 128 (USB disconnected) 1.34 mA LTE-FDD PF = 64 (USB disconnected) 2.01 mA LTE-FDD PF = 128 (USB disconnected) 1.41 mA LTE-TDD PF = 64 (USB disconnected) 2.31 mA LTE-TDD PF = 128 (USB disconnected) 1.68 mA EGSM900 @ DRX = 5 (USB disconnected) 19.8 mA EGSM900 @ DRX = 5 (USB connected) 29.6 mA WCDMA PF = 64 (USB disconnected) 19.5 mA WCDMA PF = 64 (USB connected) 29.
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LTE Standard Module Series EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) PCS1900 4DL/1UL @ 29.73 dBm 164 mA PCS1900 3DL/2UL @ 29.67 dBm 280.1 mA PCS1900 2DL/3UL @ 29.53 dBm 388 mA PCS1900 1DL/4UL @ 29.36 dBm 490.9 mA EGSM900 4DL/1UL @ 26.99 dBm 146.5 mA EGSM900 3DL/2UL @ 26.91 dBm 245.0 mA EGSM900 2DL/3UL @ 26.77 dBm 341.2 mA EGSM900 1DL/4UL @ 26.69 dBm 439.3 mA DCS1800 4DL/1UL @ 25.76 dBm 140.8 mA DCS1800 3DL/2UL @ 25.56 dBm 231.6 mA DCS1800 2DL/3UL @ 25.
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LTE Standard Module Series LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B5 HSUPA @ 21.2 dBm 496.2 mA WCDMA B8 HSDPA @ 22.14 dBm 553.2 mA WCDMA B8 HSUPA @ 21.78 dBm 559.7 mA LTE-FDD B1 @ 22.85 dBm 742.2 mA LTE-FDD B2 @ 22.5 dBm 770.6 mA LTE-FDD B3 @ 23.00 dBm 770.1 mA LTE-FDD B4 @ 22.7 dBm 684.3 mA LTE-FDD B5 @ 23.16 dBm 649.5 mA LTE-FDD B7 @ 22.91 dBm 731.9 mA LTE-FDD B8 @ 23.09 dBm 633.6 mA LTE-FDD B28 @ 23.24 dBm 769.8 mA LTE-TDD B40 @ 22.
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LTE Standard Module Series Idle state (GNSS OFF) GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) GSM DRX = 9 (USB disconnected) 2.2 mA WCDMA PF = 64 (USB disconnected) 3.1 mA WCDMA PF = 128 (USB disconnected) 2.6 mA LTE-FDD PF = 64 (USB disconnected) 3.3 mA LTE-FDD PF = 128 (USB disconnected) 2.6 mA EGSM900 @ DRX = 5 (USB disconnected) 17.6 mA EGSM900 @ DRX = 5 (USB connected) 27.7 mA WCDMA PF = 64 (USB disconnected) 17.9 mA WCDMA PF = 64 (USB connected) 27.
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LTE Standard Module Series WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 2DL/3UL @ 23.46 dBm 302.8 mA DCS1800 1DL/4UL @ 22.19 dBm 381.7 mA WCDMA B1 HSDPA @ 23.26 dBm 605.0 mA WCDMA B1 HSUPA @ 23.09 dBm 615.3 mA WCDMA B8 HSDPA @ 23.27 dBm 544.0 mA WCDMA B8 HSUPA @ 22.67 dBm 536.1 mA LTE-FDD B1 @ 24.50 dBm 798.7 mA LTE-FDD B3 @ 23.67 dBm 751.8 mA LTE-FDD B7 @ 23.75 dBm 878.7 mA LTE-FDD B8 @ 22.81 dBm 592.
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LTE Standard Module Series Idle state (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA PF = 64 (USB disconnected) 22.0 mA WCDMA PF = 64 (USB connected) 32.0 mA LTE-FDD PF = 64 (USB disconnected) 23.6 mA LTE-FDD PF = 64 (USB connected) 33.6 mA WCDMA B1 HSDPA @ 22.59 dBm 589.0 mA WCDMA B1 HSUPA @ 22.29 dBm 623.0 mA WCDMA B5 HSDPA @ 22.22 dBm 511.0 mA WCDMA B5 HSUPA @ 21.64 dBm 503.0 mA LTE-FDD B1 @ 23.38 dBm 813.0 mA LTE-FDD B3 @ 22.
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LTE Standard Module Series LTE-FDD B3 @ 22.95 dBm 778.0 mA LTE-FDD B8 @ 22.81 dBm 722.0 mA LTE-FDD B18 @ 23.15 dBm 677.0 mA LTE-FDD B19 @ 23.17 dBm 688.0 mA LTE-FDD B26 @ 23.37 dBm 723.0 mA Table 52: EC21-KL Current Consumption Description Conditions Typ. Unit OFF state Power down 10 μA AT+CFUN = 0 (USB disconnected) 1.08 mA LTE-FDD PF = 64 (USB disconnected) 2.1 mA LTE-FDD PF = 128 (USB disconnected) 1.4 mA LTE-FDD PF = 64 (USB disconnected) 24.
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LTE Standard Module Series Idle state (GNSS OFF) GPRS data transfer (GNSS OFF) GSM DRX = 9 (USB disconnected) 1.31 mA WCDMA PF = 64 (USB disconnected) 2.19 mA WCDMA PF = 128 (USB disconnected) 1.91 mA LTE-FDD PF = 64 (USB disconnected) 2.74 mA LTE-FDD PF = 128 (USB disconnected) 2.12 mA LTE-TDD PF = 64 (USB disconnected) 2.68 mA LTE-TDD PF = 128 (USB disconnected) 2.16 mA GSM DRX = 5 (USB disconnected) 16.6 mA GSM DRX = 5 (USB connected) 33.
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LTE Standard Module Series EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) DCS1800 2DL/3UL @ 26.05 dBm 283.0 mA DCS1800 1DL/4UL @ 25.14 dBm 357.0 mA PCS1900 4DL/1UL @ 29.39 dBm 159.7 mA PCS1900 3DL/2UL @ 28.06 dBm 234.6 mA PCS1900 2DL/3UL @ 26.01 dBm 289.0 mA PCS1900 1DL/4UL @ 25.20 dBm 363.9 mA GSM850 4DL/1UL PCL = 8 @ 26.86 dBm 169.9 mA GSM850 3DL/2UL PCL = 8 @ 25.76 dBm 284.1 mA GSM850 2DL/3UL PCL = 8 @ 23.68 dBm 387.2 mA GSM850 1DL/4UL PCL = 8 @ 22.39 dBm 498.
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LTE Standard Module Series LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B2 HSUPA @ 22.17 dBm 542.4 mA WCDMA B4 HSDPA @ 23.27 dBm 491.0 mA WCDMA B4 HSUPA @ 23.19 dBm 504.0 mA WCDMA B5 HSDPA @ 23.18 dBm 480.4 mA WCDMA B5 HSUPA @ 22.90 dBm 490.0 mA WCDMA B8 HSDPA @ 22.32 dBm 504.0 mA WCDMA B8 HSUPA @ 22.26 dBm 528.0 mA LTE-FDD B1 @ 23.48 dBm 690.0 mA LTE-FDD B2 @ 22.85 dBm 696.7 mA LTE-FDD B3 @ 23.45 dBm 655.0 mA LTE-FDD B4 @ 23.16 dBm 603.
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LTE Standard Module Series WCDMA B8 @ 23.05 dBm 553.0 mA Table 54: EC21-EUX Current Consumption Description Conditions Typ. Unit OFF state Power down 7 μA AT+CFUN=0 (USB disconnected) 1.03 mA AT+CFUN=0 (USB suspend) 1.27 mA EGSM DRX = 2 (USB disconnected) 1.89 mA EGSM DRX = 9 (USB disconnected) 1.30 mA DCS 698 DRX = 2 (USB disconnected) 1.89 mA DCS 698 DRX = 9 (USB disconnected) 1.32 mA WCDMA PF = 64 (USB disconnected) 1.70 mA WCDMA PF = 128 (USB disconnected) 1.
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LTE Standard Module Series EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 2DL/3UL @ 27.56 dBm 307.0 mA DCS1800 1DL/4UL @ 26.39 dBm 375.5 mA GSM900 4DL/1UL @ 24.75 dBm 150.9 mA GSM900 3DL/2UL @ 24.37 dBm 269.4 mA GSM900 2DL/3UL @ 22.68 dBm 380.0 mA GSM900 1DL/4UL @ 21.85 dBm 489.7 mA DCS1800 4DL/1UL @ 26.02 dBm 128.0 mA DCS1800 3DL/2UL @ 25.39 dBm 221.2 mA DCS1800 2DL/3UL @ 22.81 dBm 311.
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LTE Standard Module Series Table 55: GNSS Current Consumption of EC21 Series Module Description Searching (AT+CFUN=0) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold start @ Passive Antenna 58 mA Lost state @ Passive Antenna 58 mA Instrument Environment 33 mA Open Sky @ Passive Antenna 35 mA Open Sky @ Active Antenna 43 mA 5.5. ESD The module is not protected against electrostatics discharge (ESD) in general.
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LTE Standard Module Series       Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation.
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LTE Standard Module Series NOTE 1. 2. The module offers the best performance when the internal baseband chip stays below 105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115 °C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115 °C.
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LTE Standard Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions 32.0±0.15 2.4±0.2 29.0±0.15 Pin Pin 1 1 0.
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LTE Standard Module Series 3.4 2.0 5.96 1.30 1.1 3.85 1.1 3.5 32.0＋/-0.15 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 4.8 1.05 1.6 29.0＋/-0.15 2.0 6.8 1.7 2.49 1.9 2.4 3.2 3.4 3.2 3.4 0.8 3.2 3.5 4.37 1.5 3.45 Figure 45: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.
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LTE Standard Module Series 6.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTE 1. 2. The keepout area (pin 73–84) should not be designed. For easy maintenance of the module, keep about 3 mm between the module and other components on the motherboard.
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LTE Standard Module Series 6.3. Top and Bottom Views Figure 47: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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LTE Standard Module Series 7 Storage, Manufacturing and Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
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LTE Standard Module Series Table 57: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/sec Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3°C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1.
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LTE Standard Module Series Figure 49: Carrier Tape Dimension Drawing Table 58: Carrier Tape Dimension Table (Unit: mm) W P T A0 B0 K0 K1 F E 44 44 0.35 32.5 29.5 3.0 3.8 20.2 1.75 7.3.2.
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LTE Standard Module Series Table 59: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 W 330 100 44.5 7.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it.
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LTE Standard Module Series 8 Appendix References Table 60: Related Documents Document Name [1] Quectel_UMTS<E_EVB_User_Guide [2] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_AT_Commands_Manual [3] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_QCFG_AT_Commands_Manual [4] Quectel_EC2x&EG9x_Power_Management_Application_Note [5] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note [6] Quectel_EC21_Reference_Design [7] Quectel_RF_Layout_Application_Note [8] Quectel_LTE_Module_Thermal_Design_Guide [9] Quectel_Module_Se
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LTE Standard Module Series CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DCE Data Communications Equipment DC-HSPA+ Dual-carrier High Speed Packet Access DCS Digital Communication System DFOTA Delta Firmware Upgrade Over The Air DL Downlink DTE Data Terminal Equipment DTR Data Terminal Ready DTX Discontinuous Transmission EDGE Enhanced Data Rates for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM ESD Electrostatic Discharge ESR Equivalent Series Resista
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LTE Standard Module Series GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HTTP Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure I/O Input/Output Inom Nominal Current LCC Leadless Chip Carrier (package) LDO Low-dropout Regulator LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LSB Least Significant Bit LTE Long Term Evolu
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LTE Standard Module Series MSB Most Significant Bit MT Mobile Terminated NITZ Network Identity and Time Zone / Network Informed Time Zone NMEA NMEA (National Marine Electronics Association) 0183 Interface Standard NTP Network Time Protocol PA Power Amplifier PAM Power Amplifier Module PAP Password Authentication Protocol PCB Printed Circuit Board PCM Pulse Code Modulation PCS Personal Communication System PDA Personal Digital Assistant PDU Protocol Data Unit PING Packet Internet
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LTE Standard Module Series SAW Surface Acoustic Wave SDR Software-Defined Radio SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure SSL Secure Sockets Layer TCP Transmission Control Protocol TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Ac
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LTE Standard Module Series VIHmin Minimum High-level Input Voltage VILmax Maximum Low-level Input Voltage VILmin Minimum Low-level Input Voltage VImax Absolute Maximum Input Voltage VImin Absolute Minimum Input Voltage VOHmax Maximum High-level Output Voltage VOHmin Minimum High-level Output Voltage VOLmax Maximum Low-level Output Voltage VOLmin Minimum Low-level Output Voltage VLAN Virtual Local Area Network VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Acce