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ManualsBrandsQuectel ManualsElectronicsLTE Module

EC25 Mini PCIe

Hardware Design

LTE Standard Module Series

Rev. EC25_Mini_PCIe_Hardware_Design_V2.4

Date: 2019-12-18

Status: Released

www.quectel.com

Summary of content (83 pages)

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EC25 Mini PCIe Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.4 Date: 2019-12-18 Status: Released www.quectel.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design About the Document Revision History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/ Frank WANG Initial 1. 2. 1.1 2017-01-24 Lyndon LIU/ Frank WANG 3. 4. 5. 6. 1. 2. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN 3. 4. 5. 6. 7. EC25_Mini_PCIe_Hardware_Design Deleted description of EC25-AUT Mini PCIe in Table 1. Added description of EC25-AU and EC25-J Mini PCIe in Table 1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 2.1 2019-07-05 Fanny CHEN/ Ethan SHAN EC25_Mini_PCIe_Hardware_Design 3.6. Modified description of W_DISABLE# signal in Chapter 3.8.3. Modified description of LED_WWAN# signal in Chapter 3.8.5. Updated description of antenna connection in Chapter 5. Added thermal consideration in Chapter 6.7. Added operating frequencies in Table 16.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 3. 4. 5. 6. 7. 8. 1. 2. 3. 4. 2.2 2019-08-19 Ward WANG/ Owen WEI 5. 6. 7. 8. 1. 2. 3. 2.3 2019-11-26 Fanny CHEN 4. 5. 6. 2.4 2019-12-18 Ward WANG EC25_Mini_PCIe_Hardware_Design 1. drivers in Table 2. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 29. Updated EC25-AF Mini PCIe current consumption in Table 39.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 2. EC25_Mini_PCIe_Hardware_Design Modified the current consumption EC25-EUX Mini PCIe in Table 43.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Contents About the Document..................................................................................................................................................2 Contents........................................................................................................................................................................6 Table Index.........................................................................................
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.2. 5.3. Antenna Requirements........................................................................................................................ 43 Recommended Mating Plugs for Antenna Connection.................................................................. 44 6 Electrical, Reliability and Radio Characteristics.....................................................................................46 6.1. General Description................
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE...........................................................................................................16 TABLE 2: KEY FEATURES OF EC25 MINI PCIE........................................................................................................ 18 TABLE 3: I/O PARAMETERS DEFINITION................................................................................................................
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LTE Standard Module Series EC25 Mini PCIe Hardware Design TABLE 42: CURRENT CONSUMPTION OF EC25-AF MINI PCIE...........................................................................63 TABLE 43: CURRENT CONSUMPTION OF EC25-EUX MINI PCIE........................................................................65 TABLE 44: CURRENT CONSUMPTION OF EC25-AFX MINI PCIE........................................................................ 67 TABLE 45: CURRENT CONSUMPTION OF EC25-MX MINI PCIE......................
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................................ 20 FIGURE 2: PIN ASSIGNMENT....................................................................................................................................... 21 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY..............................................................................
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 1 Introduction This document defines EC25 Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers’ applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers’ reference.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).
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LTE Standard Module Series EC25 Mini PCIe Hardware Design les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers’ applications.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.2. Description of Module Series EC25 Mini PCIe series contains 12 variants, and are listed in the following table.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25-EU Mini PCIe Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25-EC Mini PCIe Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support digital audio2) EC25-EUX Mini PCIe Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B4
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Features Description Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0V~3.6V Typical supply voltage: 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Max 296Kbps (DL)/Max 236.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Physical Characteristics Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm Weight: approx. 9.8g Temperature Range Operation temperature range: -35°C to +75°C1) Extended temperature range: -40°C to +80°C2) Storage temperature range: -40°C to +90°C Firmware Upgrade Upgrade via USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC25 Mini PCIe.       Power supply (U)SIM interface USB interface UART interfaces PCM and I2C interfaces Control and indication pins 3.1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC25 Mini PCIe. Table 3: I/O Parameters Definition Type Description DI Digital Input DO Digital Output IO Bidirectional OC Open Collector PI Power Input PO Power Output OD Open drain Table 4: Pin Description Pin No.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design PO Power supply for the (U)SIM card 8 UIM_PWR USIM_VDD 9 GND GND 10 UIM_DATA USIM_DATA IO Data signal of (U)SIM card 11 REFCLK- UART_RX DI UART receive data 12 UIM_CLK USIM_CLK DO Clock signal of (U)SIM card 13 REFCLK+ UART_TX DO UART transmit data 14 UIM_RESET USIM_RST DO Reset signal of (U)SIM card 15 GND GND Mini card ground 16 UIM_VPP RESERVED Reserved 17 RESERVED RI 18 GND GND Mini card ground 19
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 30 SMB_CLK I2C_SCL OD I2C serial clock 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA OD I2C serial data 33 PETp0 RESERVED Reserved 34 GND GND Mini card ground 35 GND GND Mini card ground 36 USB_D- USB_DM 37 GND GND IO USB differential data (-) Require external pull-up to 1.8V. Require differential impedance of 90Ω. Mini card ground 38 USB_D+ USB_DP IO USB differential data (+) 39 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 50 GND GND Mini card ground 51 RESERVED PCM_SYNC1) IO PCM frame synchronization 52 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply NOTES 1. 2. 1) The digital audio (PCM) function is only supported on Telematics version. Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design    Execute AT+QSCLK=1 to enable sleep mode. Ensure the DTR is kept at high level or be kept open. The host’s USB bus, which is connected with the module’s USB interface, enters suspend state. 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. 3.5.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 3: Reference Circuit of Power Supply 3.6. (U)SIM Interface EC25 Mini PCIe’s (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 7: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD 8 PO 1.8V/3.0V Power supply for (U)SIM card USIM_DATA 10 IO 1.8V/3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design USIM_VDD Module 100nF 15K (U)SIM Card Connector GND USIM_VDD USIM_RST VCC RST 0R 0R USIM_CLK GND VPP IO CLK USIM_PRESENCE 0R USIM_DATA 33pF GND 33pF 33pF GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Test Points Minimize these stubs Module R3 NM_0R R4 NM_0R L1 USB_DM USB_DM USB_DP USB_DP GND MCU ESD Array Close to Module GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design The following table shows the pin definition of the main UART interface. Table 9: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX 11 DI 3.3V UART receive data UART_TX 13 DO 3.3V UART transmit data UART_CTS 23 DI 3.3V UART clear to send UART_RTS 25 DO 3.3V UART request to send The signal level of main UART interface is 3.3V.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design before startup. 5 COEX_UART_TX DO 1.8V LTE/WLAN&BT coexistence transmitting signal. It is prohibited to be pulled up high before startup. NOTES 1. AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 2. “*” means under development. 3.9.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design  Auxiliary mode (long frame synchronization, works as master only) NOTE The digital audio (PCM) function is only supported on Telematics version. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 9: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC25 Mini PCIe’s firmware has integrated the configuration on some PCM codec’s application with I2C interface. Please refer to document [2] for details about AT+QDAI command.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10. Control and Indication Signals The following table shows the pin definition of control and indication signals. Table 12: Pin Definition of Control and Indication Signals Pin Name Pin No. I/O Power Domain Description RI 17 DO 3.3V Output signal used to wake up the host DTR 31 DI 3.3V Sleep mode control W_DISABLE# 20 DI 3.3V Airplane mode control; Pulled up by default; Active low. PERST# 22 DI 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode, driving it to low level can wake up the module. For more details about the preconditions for module to enter sleep mode, please refer to Chapter 3.4.1. 3.10.3. W_DISABLE# Signal EC25 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (excluding GNSS). The W_DISABLE# pin is pulled up by default.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 12: Timing of Resetting Module 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 16: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light ON) Registered on network successfully High I
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 4 GNSS Receiver 4.1. General Description EC25 Mini PCIe includes a fully integrated global navigation satellite system solution that supports Qualcomm Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). Additionally, it supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Accuracy (GNSS) Autonomous @open sky CEP-50 <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 5 Antenna Connection 5.1. Antenna Connectors EC25 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50Ω. 5.1.1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE-FDD B12 699~716 729~746 MHz LTE-FDD B13 777~787 746~756 MHz LTE-FDD B14 788~798 758~768 MHZ LTE-FDD B18 815~830 860~875 MHz LTE-FDD B19 830~845 875~890 MHz LTE-FDD B20 832~862 791~821 MHz LTE-FDD B26 814~849 859~894 MHz LTE-FDD B28 7
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.2. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 20: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.3. Recommended Mating Plugs for Antenna Connection EC25 Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. Figure 16: Mechanicals of U.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 17: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe:       Power supply requirements I/O requirements RF characteristics ESD characteristics Current consumption Thermal consideration 6.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.0V~3.6V, as specified by PCI Express Mini CEM Specifications 1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 6.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 22: I/O Requirements Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3 - 0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V NOTES 1. 2. The PCM and I2C interfaces belong to 1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD bands 23dBm±2dB < -39dBm LTE-TDD bands 23dBm±2dB < -39dBm Table 24: Conducted RF Receiving Sensitivity of EC25-A Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B2 (10MHz) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10MHz) -97.5dBm -99.0dBm -101.0dBm -96.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B4 (10MHz) -97.7dBm -97.4dBm -100.2dBm -96.3dBm LTE-FDD B5 (10MHz) -98.0dBm -98.2dBm -101.0dBm -94.3dBm LTE-FDD B7 (10MHz) -97.7dBm -97.7dBm -101.2dBm -94.3dBm LTE-FDD B8 (10MHz) -99.2dBm -98.2dBm -102.2dBm -93.3dBm LTE-FDD B28 (10MHz) -98.6dBm -98.7dBm -102.0dBm -94.8dBm LTE-TDD B40 (10MHz) -97.2dBm -98.4dBm -101.2dBm -96.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10MHz) -98.0dBm -98.0dBm -101.5dBm -96.3dBm LTE-FDD B3 (10MHz) -96.5dBm -98.5dBm -101.5dBm -93.3dBm LTE-FDD B5 (10MHz) -98.0dBm -98.5dBm -101.0dBm -94.3dBm LTE-FDD B7 (10MHz) -97.0dBm -97.0dBm -99.5dBm -94.3dBm LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B5 (10MHz) -98.0dBm -98.5dBm -100.5dBm -94.3dBm LTE-FDD B12 (10MHz) -99.0dBm -99.5dBm -100.5dBm -93.3dBm LTE-FDD B13 (10MHz) -98.5dBm -99.5dBm -100.7dBm -93.3dBm LTE-FDD B14 (10MHz) -99.4dBm -99.5dBm -100.9dBm -93.3dBm LTE-FDD B66 (10MHz) -97.5dBm -98.5dBm -99.6dBm -95.8dBm LTE-FDD B71 (10MHz) -98.6dBm -99.5dBm -100dBm -93.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B1 -110dBm -109dBm / -106.7dBm WCDMA B8 -110dBm -111dBm / -103.7dBm LTE-FDD B1 (10MHz) -98.2dBm -99.0dBm -101.2dBm -96.3dBm LTE-FDD B3 (10MHz) -97.7dBm -99.8dBm -101.0dBm -93.3dBm LTE-FDD B7 (10MHz) -96.7dBm -98.5dBm -100.2dBm -94.3dBm LTE-FDD B8 (10MHz) -98.2dBm -100.4dBm -101.7 dBm -93.3dBm LTE-FDD B20 (10MHz) -98.2dBm -100.8dBm -101.7dBm -93.3dBm LTE-FDD B28 (10MHz) -98.2dBm -100.5dBm -101.7dBm -94.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 33: Conducted RF Receiving Sensitivity of EC25-EUX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10MHz) -98.0dBm -98.0dBm -101dBm -96.3dBm LTE-FDD B3 (10MHz) -96.5dBm -98.5dBm -99.5dBm -93.3dBm LTE-FDD B7 (10MHz) -97.0dBm -94.5dBm -99.5dBm -94.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B28 (10MHz) -97.2dBm -99.3dBm -101.7dBm -94.8dBm LTE-FDD B66 (10MHz) -97.2dBm -98.4dBm -101.2dBm -95.8dBm Table 35: Conducted RF Receiving Sensitivity of EC25-AUX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm -109.5dBm -112dBm -106.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.5. ESD Characteristics The following table shows the ESD characteristics of EC25 Mini PCIe.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) 27.0 mA WCDMA PF=64 (USB connected) 40.0 mA LTE-FDD PF=64 (USB disconnected) 43.0 mA LTE-FDD PF=64 (USB connected) 59.0 mA WCDMA B2 HSDPA @22.63dBm 764.0 mA WCDMA B2 HSUPA @23.19dBm 741.0 mA WCDMA B4 HSDPA @22.45dBm 745.0 mA WCDMA B4 HSUPA @22.57dBm 752.0 mA WCDMA B5 HSDPA @22.49dBm 616.0 mA WCDMA B5 HSUPA @22.43dBm 637.0 mA LTE-FDD B2 @22.92dBm 977.0 mA LTE-FDD B4 @23.42dBm 1094.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) 3.5 mA LTE-TDD PF=64 (USB disconnected) 4.5 mA LTE-TDD PF=128 (USB disconnected) 3.7 mA GSM DRX=5 (USB disconnected) 22.0 mA GSM DRX=5 (USB connected) 34.0 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 29.0 mA LTE-FDD PF=64 (USB connected) 42.0 mA LTE-TDD PF=64 (USB disconnected) 30.0 mA LTE-TDD PF=64 (USB connected) 42.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) PCS1900 3UL/2DL @29.32dBm 367.0 mA PCS1900 4UL/1DL @29.19dBm 465.0 mA EGSM900 4DL/1UL @27.54dBm 264.0 mA EGSM900 3DL/2UL @27.38dBm 368.0 mA EGSM900 2DL/3UL @27.27dBm 498.0 mA EGSM900 1DL/4UL @27.17dBm 634.0 mA DCS1800 4DL/1UL @27.64dBm 223.0 mA DCS1800 3DL/2UL @27.45dBm 333.0 mA DCS1800 2DL/3UL @27.34dBm 449.0 mA DCS1800 1DL/4UL @27.29dBm 573.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B8 HSUPA @21.07dBm 634.0 mA LTE-FDD B1 @23.28dBm 817.0 mA LTE-FDD B2 @23.34dBm 803.0 mA LTE-FDD B3 @23.2dBm 785.0 mA LTE-FDD B4 @22.9dBm 774.0 mA LTE-FDD B5 @23.45dBm 687.0 mA LTE-FDD B7 @22.84dBm 843.0 mA LTE-FDD B8 @22.92dBm 689.0 mA LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) 4.4 mA LTE-TDD PF=64 (USB disconnected) 5.1 mA LTE-TDD PF=128 (USB disconnected) 4.4 mA WCDMA PF=64 (USB disconnected) 31.5 mA WCDMA PF=64 (USB connected) 43.5 mA LTE-FDD PF=64 (USB disconnected) 32.3 mA LTE-FDD PF=64 (USB connected) 45.4 mA LTE-TDD PF=64 (USB disconnected) 32.3 mA LTE-TDD PF=64 (USB connected) 43.3 mA WCDMA B1 HSDPA @22.55dBm 829.0 mA WCDMA B1 HSUPA @22.25dBm 848.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B6 @23.36dBm 692.3 mA WCDMA B8 @23.54dBm 763.9 mA WCDMA B19 @23.29dBm 682.1 mA Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 3.9 mA GSM DRX=2 (USB disconnected) 5.1 mA GSM DRX=9 (USB disconnected) 4.3 mA WCDMA PF=64 (USB disconnected) 5.5 mA WCDMA PF=128 (USB disconnected) 4.8 mA LTE-FDD PF=64 (USB disconnected) 5.8 mA LTE-FDD PF=128 (USB disconnected) 5.0 mA LTE-TDD PF=64 (USB disconnected) 5.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 2DL/3UL @29.86dBm 706.0 mA EGSM900 1DL/4UL @29.44dBm 767.0 mA DCS1800 4DL/1UL @30.39dBm 262.0 mA DCS1800 3DL/2UL @30.19dBm 417.0 mA DCS1800 2DL/3UL @30.02dBm 564.0 mA DCS1800 1DL/4UL @29.86dBm 709.0 mA EGSM900 4DL/1UL @27.59dBm 233.0 mA EGSM900 3DL/2UL @27.45dBm 370.0 mA EGSM900 2DL/3UL @27.31dBm 500.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design GSM voice call WCDMA voice call LTE-FDD B20 @22.51dBm 946.0 mA LTE-TDD B38 @22.58dBm 686.0 mA LTE-TDD B40 @22.31dBm 576.0 mA LTE-TDD B41 @22.03dBm 611.0 mA EGSM900 PCL=5 @33.31dBm 367.0 mA DCS1800 PCL=0 @29.48dBm 248.0 mA WCDMA B1 @23.18dBm 868.0 mA WCDMA B5 @22.62dBm 808.0 mA WCDMA B8 @23.02dBm 728.0 mA Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 3.4 mA LTE-FDD PF=64 (USB disconnected) 4.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=64 (USB disconnected) 3.7 mA LTE-FDD PF=128 (USB disconnected) 3.1 mA WCDMA PF=64 (USB disconnected) 21.7 mA WCDMA PF=64 (USB connected) 32.5 mA LTE-FDD PF=64 (USB disconnected) 25.0 mA LTE-FDD PF=64 (USB connected) 38.0 mA WCDMA B2 HSDPA @22.63dBm 560.0 mA WCDMA B2 HSUPA @22.49dBm 564.0 mA WCDMA B4 HSDPA @22.45dBm 601.0 mA WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 43: Current Consumption of EC25-EUX Mini PCIe Parameter Description Sleep state Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 1.69 mA GSM DRX=2 (USB disconnected) 2.59 mA GSM DRX=9 (USB disconnected) 1.97 mA WCDMA PF=64 (USB disconnected) 2.52 mA WCDMA PF=128 (USB disconnected) 2.25 mA LTE-FDD PF=64 (USB disconnected) 3.01 mA LTE-FDD PF=128 (USB disconnected) 2.4 mA LTE-TDD PF=64 (USB disconnected) 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 1DL/4UL @25.74dBm 455.8 mA EGSM900 4DL/1UL @25.54dBm 200.1 mA EGSM900 3DL/2UL @25.41dBm 343.4 mA EGSM900 2DL/3UL @23.51dBm 471.5 mA EGSM900 1DL/4UL @22.94dBm 607.8 mA DCS1800 4DL/1UL @25.05dBm 183.1 mA DCS1800 3DL/2UL @25.07dBm 291.0 mA DCS1800 2DL/3UL @22.54dBm 392.0 mA DCS1800 1DL/4UL @21.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B8 @22.17dBm 689.3 mA Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 1.67 mA WCDMA PF=64 (USB disconnected) 2.51 mA WCDMA PF=64 (USB connected) 2.93 mA WCDMA PF=128 (USB disconnected) 2.16 mA WCDMA PF=256 (USB disconnected) 2.07 mA WCDMA PF=512 (USB disconnected) 1.88 mA LTE-FDD PF=32 (USB disconnected) 4.29 mA LTE-FDD PF=64 (USB disconnected) 3.04 mA LTE-FDD PF=64 (USB connected) 3.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD B2 @23.01dBm 743.0 mA LTE-FDD B4 @22.58dBm 816.0 mA LTE-FDD B5 @23.2dBm 751.0 mA LTE-FDD B12 @22.94dBm 825.0 mA LTE-FDD B13 @23.18dBm 815.0 mA LTE-FDD B14 @23.44dBm 849.0 mA LTE-FDD B66 @23.2dBm 850.0 mA LTE-FDD B71 @22.82dBm 788.0 mA WCDMA B2 @23.27dBm 672.0 mA WCDMA B4 @23.22dBm 663.0 mA WCDMA B5 @23.02dBm 680.0 mA Conditions Typ.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) 20.0 mA WCDMA PF=64 (USB connected) 41.1 mA LTE-FDD PF=64 (USB disconnected) 20.5 mA LTE-FDD PF=64 (USB connected) 40.7 mA WCDMA B2 HSDPA @22.75dBm 848.0 mA WCDMA B2 HSUPA @22.3dBm 818.0 mA WCDMA B4 HSDPA @23.34dBm 813.0 mA WCDMA B4 HSUPA @23.11dBm 774.0 mA WCDMA B5 HSDPA @22.53dBm 759.0 mA WCDMA B5 HSUPA @22.58dBm 717.0 mA LTE-FDD B2 @23.09dBm 918.0 mA LTE-FDD B4 @23.12dBm 933.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) 3.8 mA WCDMA PF=128 (USB disconnected) 3.4 mA LTE-FDD PF=64 (USB disconnected) 4.5 mA LTE-FDD PF=128 (USB disconnected) 3.9 mA LTE-TDD PF=64 (USB disconnected) 4.5 mA LTE-TDD PF=128 (USB disconnected) 3.7 mA GSM DRX=5 (USB disconnected) 23.4 mA GSM DRX=5 (USB connected) 43.4 mA WCDMA PF=64 (USB disconnected) 24.2 mA WCDMA PF=64 (USB connected) 45.6 mA LTE-FDD PF=64 (USB disconnected) 28.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) DCS1800 1DL/4UL @25.80dBm 468.3 mA PCS1900 4DL/1UL @30.22dBm 243.2 mA PCS1900 3DL/2UL @28.93dBm 336.9 mA PCS1900 2DL/3UL @27.00dBm 398.3 mA PCS1900 1DL/4UL @25.86dBm 478.0 mA GSM850 4DL/1UL @27.45dBm 253.6 mA GSM850 3DL/2UL @26.29dBm 389.8 mA GSM850 2DL/3UL @23.96dBm 515.4 mA GSM850 1DL/4UL @22.72dBm 647.6 mA EGSM900 4DL/1UL @27.63dBm 257.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B5 HSDPA @23.27dBm 672.6 mA WCDMA B5 HSUPA @22.93dBm 672.0 mA WCDMA B8 HSDPA @21.70dBm 667.9 mA WCDMA B8 HSUPA @21.12dBm 674.5 mA LTE-FDD B1 @23.50dBm 963.9 mA LTE-FDD B2 @22.95dBm 941.7 mA LTE-FDD B3 @23.27dBm 856.4 mA LTE-FDD B4 @23.28dBm 817.1 mA LTE-FDD B5 @23.09dBm 724.5 mA LTE-FDD B7 @23.09dBm 945.2 mA LTE-FDD B8 @23.64dBm 888.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Sleep state IVBAT AT+CFUN=0 (USB disconnected) 3.4 mA GSM DRX=2 (USB disconnected) 5.2 mA GSM DRX=9 (USB disconnected) 4.1 mA WCDMA PF=64 (USB disconnected) 4.9 mA WCDMA PF=128 (USB disconnected) 4.4 mA LTE-FDD PF=64 (USB disconnected) 5.3 mA LTE-FDD PF=128 (USB disconnected) 4.6 mA LTE-TDD PF=64 (USB disconnected) 5.3 mA LTE-TDD PF=128 (USB disconnected) 4.5 mA GSM DRX=5 (USB disconnected) 23.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call EGSM900 4DL/1UL @27.51dBm 234.0 mA EGSM900 3DL/2UL @27.23dBm 372.0 mA EGSM900 2DL/3UL @27.08dBm 501.0 mA EGSM900 1DL/4UL @26.81dBm 628.0 mA DCS1800 4DL/1UL @26.29dBm 199.0 mA DCS1800 3DL/2UL @26.18dBm 309.0 mA DCS1800 2DL/3UL @26.05dBm 415.0 mA DCS1800 1DL/4UL @25.35dBm 503.0 mA WCDMA B1 HSDPA @22.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 48: GNSS Current Consumption of EC25 Mini PCIe Series Module Parameter Description Searching (AT+CFUN=0) IVBAT (GNSS) Tracking (AT+CFUN=0) Conditions Typ. Unit Cold start @Passive Antenna 75.0 mA Lost state @Passive Antenna 74.0 mA Instrument environment 44.0 mA Open Sky @Passive Antenna 53.0 mA Open Sky @Active Antenna 58.0 mA 6.7.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 18: Referenced Heatsink Design NOTES 1. 2. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 7 Dimensions and Packaging 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.2. Mechanical Dimensions of EC25 Mini PCIe 30.00±0.15 24.20±0.20 8.25±0.10 5.45±0.10 6.38±0.10 3x3.00±0.10 5.98±0.10 2xΦ2.60±0.1 6.35±0.10 0.61±0.05 2.35±0.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for Detail A and Detail B.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679105700 as an example. Figure 21: Dimensions of the Mini PCI Express Connector (Molex 679105700) 7.4. Packaging Specifications EC25 Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest package of EC25 Mini PCIe contains 100 modules.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design 8 Appendix A References Table 49: Related Documents SN Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.
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LTE Standard Module Series EC25 Mini PCIe Hardware Design EMI Electro Magnetic Interference ESD Electrostatic Discharge ESR Equivalent Series Resistance FDD Frequency Division Duplexing FR Full Rate GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet
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LTE Standard Module Series EC25 Mini PCIe Hardware Design PDA Personal Digital Assistant PDU Protocol Data Unit POS Point of Sale PPP Point-to-Point Protocol RF Radio Frequency RTS Ready To Send Rx Receive SIMO Single Input Multiple Output SMS Short Message Service TX Transmitting Direction TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver & Transmitter UL Uplink URC Unsolicited Result Code USB Universal Serial Bus (U)SIM (Universal) Subscriber Identificat