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EC25 Hardware Design

LTE Standard Module Series

Rev. EC25_Hardware_Design_V2.3

Date: 2019-11-26

Status: Released

Summary of content (133 pages)

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EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.
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www.quectel.
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LTE Standard Module Series EC25 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.
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LTE Standard Module Series EC25 Hardware Design About the Document Revision History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4.
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LTE Standard Module Series EC25 Hardware Design 1. 2. 3. 4. 5. 1.3 2017-01-24 Lyndon LIU/ Frank WANG 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1.5 2018-04-20 Kinsey ZHANG 1. 2. 3. 4. EC25_Hardware_Design Updated function diagram in Figure 1. Updated pin assignment (top view) in Figure 2. Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24.
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LTE Standard Module Series EC25 Hardware Design 5. 2.0 2019-04-30 EC25_Hardware_Design Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN module into Table 41. Added EC25-AF conducted RF receiving sensitivity in Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20.
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LTE Standard Module Series EC25 Hardware Design 2.1 2.2 2.3 2019-07-05 2019-08-19 2019-11-26 EC25_Hardware_Design Fanny CHEN/ Ethan SHAN 1. Added new variants EC25-AFX/-AUX and related information. 2. Added notes for interfaces not supported by ThreadX modules. 3. Updated supported protocols and USB serial drivers in Table 2. 4. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. 5. Added EC25-AFX current consumption in Table 41. 6.
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LTE Standard Module Series EC25 Hardware Design Contents About the Document..................................................................................................................................................2 Contents........................................................................................................................................................................6 Table Index...................................................................................................
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LTE Standard Module Series EC25 Hardware Design 3.14.1. WLAN Interface.......................................................................................................................... 60 3.14.2. BT Interface*............................................................................................................................... 61 3.15. ADC Interfaces...................................................................................................................................... 61 3.16.
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LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes...................................................................................................... 129 12 Appendix D EDGE Modulation and Coding Schemes.........................................................................
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LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: SUPPORTED FREQUENCY BANDS AND GNSS FUNCTION OF EC25 SERIES MODULE.......... 17 TABLE 2: KEY FEATURES OF EC25 MODULE......................................................................................................... 18 TABLE 3: I/O PARAMETERS DEFINITION..................................................................................................................25 TABLE 4: PIN DESCRIPTION...........................................
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LTE Standard Module Series EC25 Hardware Design TABLE 42: EC25-EU CURRENT CONSUMPTION.....................................................................................................94 TABLE 43: EC25-EC CURRENT CONSUMPTION.....................................................................................................96 TABLE 44: EC25-EUX CURRENT CONSUMPTION.................................................................................................. 98 TABLE 45: EC25-MX CURRENT CONSUMPTION.....
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LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................................22 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)................................................................................................................24 FIGURE 3: SLEEP MODE APPLICATION VIA UART................................................................................................
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LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA......................................................................................76 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)..................................................... 78 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS......................................................................................78 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM)............................
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LTE Standard Module Series EC25 Hardware Design 1 Introduction This document defines EC25 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference.
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LTE Standard Module Series EC25 Hardware Design permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).
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LTE Standard Module Series EC25 Hardware Design L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.
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LTE Standard Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
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LTE Standard Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
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LTE Standard Module Series EC25 Hardware Design EC25-EU FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y EC25-EUX FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y EC25-AUTL FDD: B3/B7/B28 N N Y N EC25-EC FDD: B1/B3/B7/B8/B20/ B28A B1/B8 900/1800MHz Y N EC25-MX FDD: B2/B4//B5/B7/B28/ B66 B2/B4/B5 N Y N NOTES 1. 2. 3. 4. 1) GNSS function is optional. EC25 series module contains Telematics version and Data-only version.
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LTE Standard Module Series EC25 Hardware Design Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to non-CA Cat 4 FDD and TDD Support 1.
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LTE Standard Module Series EC25 Hardware Design Support echo cancellation and noise suppression PCM Interface USB Interface UART Interfaces Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.
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LTE Standard Module Series EC25 Hardware Design RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. Within operation temperature range, the module is 3GPP compliant. Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network.
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LTE Standard Module Series EC25 Hardware Design SAW ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF APT PA PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC PWRKEY Control Control Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4.
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LTE Standard Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads and 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions.
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LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module.
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LTE Standard Module Series EC25 Hardware Design 5. 6. 7. 8. Pins 119~126 and 128 are used for SGMII interface. Pins 24~27 for PCM function are used for audio design on EC25 module and BT function on FC20 module. Keep all RESERVED pins and unused pins unconnected. GND pins 85~112 should be connected to ground in the design. RESERVED pins 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3.
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LTE Standard Module Series EC25 Hardware Design transmission. VDD_EXT 7 PO GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull-up circuits. If unused, keep it open. Ground Power-on/off Pin Name PWRKEY RESET_N Pin No. I/O Description DC Characteristics Comment DI Turn on/off the module VH=0.8V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
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LTE Standard Module Series EC25 Hardware Design USB_DP USB_DM 69 70 USB differential data bus (+) USB 2.0 Compliant. Require differential impedance of 90Ω. If unused, keep it open. IO USB differential data bus (-) USB 2.0 Compliant. Require differential impedance of 90Ω. If unused, keep it open. I/O Description IO (U)SIM Interface Pin Name Pin No. USIM_GND 10 USIM_ PRESENCE 13 DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
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LTE Standard Module Series EC25 Hardware Design For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM_RST 17 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name RI DCD CTS RTS DTR TXD RXD Pin No. 62 63 64 65 66 67 68 I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.
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LTE Standard Module Series EC25 Hardware Design DBG_TXD DBG_RXD 12 11 Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment AI General-purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. AI General-purpose analog to digital converter Voltage range: 0.
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LTE Standard Module Series EC25 Hardware Design Pin Name I2C_SCL I2C_SDA Pin No. 41 42 I/O Description DC Characteristics Comment I2C serial clock. Used for external codec. An external 1.8V pull-up resistor is required. If unused, keep it open. OD I2C serial data. Used for external codec. An external 1.8V pull-up resistor is required. If unused, keep it open. I/O Description OD SD Card Interface Pin Name SDC2_ DATA3 SDC2_ DATA2 Pin No.
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LTE Standard Module Series EC25 Hardware Design VIHmax=3.34V SDC2_ DATA1 SDC2_ DATA0 SDC2_CLK SDC2_CMD 30 31 32 33 EC25_Hardware_Design IO IO DO IO SD card SDIO bus DATA1 SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.
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LTE Standard Module Series EC25 Hardware Design VILmax=0.58V VIHmin=1.27V VIHmax=2.0V SD 3.0 protocol for more details. If unused, keep it open. 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable. Cannot be used for SD card power.
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LTE Standard Module Series EC25 Hardware Design VOHmin=2.14V VILmax=0.71V VIHmin=1.78V SGMII_ MCLK 122 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 USIM2_VDD 128 DO AO AO AI AI PO SGMII MDIO (Management Data Input/Output) clock For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. SGMII transmission - minus Connect with a 0.1μF capacitor, and is close to the PHY side. If unused, keep it open.
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LTE Standard Module Series EC25 Hardware Design VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 130 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 COEX_UART 137 _RX EC25_Hardware_Design open. WLAN SDIO data bus D2 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. WLAN SDIO data bus D1 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.
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LTE Standard Module Series EC25 Hardware Design VIHmin=1.2V VIHmax=2.0V COEX_UART 138 _TX DO LTE/WLAN&BT coexistence signal WLAN_SLP_ 118 CLK DO WLAN sleep clock BT_RTS BT_TXD BT_RXD BT_CTS BT_EN 37 38 39 VOLmax=0.45V VOHmin=1.35V before startup. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain.
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LTE Standard Module Series EC25 Hardware Design Pin Name WAKEUP_IN W_DISABLE# AP_READY Pin No. 1 4 2 I/O DI Description Sleep mode control DC Characteristics Comment VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. DI Airplane mode control VILmin=-0.3V VILmax=0.
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LTE Standard Module Series EC25 Hardware Design 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
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LTE Standard Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART    Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection).
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LTE Standard Module Series EC25 Hardware Design   Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode.
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LTE Standard Module Series EC25 Hardware Design Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. 3.5.2.
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LTE Standard Module Series EC25 Hardware Design 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT.   Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 Power supply for module’s RF part 3.
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LTE Standard Module Series EC25 Hardware Design To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins.
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LTE Standard Module Series EC25 Hardware Design Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Power-on/off Scenarios 3.7.1.
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LTE Standard Module Series EC25 Hardware Design PWRKEY ≥ 500ms 4.7K 10nF Turn-on pulse 47K Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure.
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LTE Standard Module Series EC25 Hardware Design The power-on scenario is illustrated in the following figure. NOTE 1 VBA T ≥500ms PWRKEY VH=0.8V VIL≤0.5V Abo ut 100ms VDD_EXT BOO T_CONFIG & USB_BOO T Pin s RESET_N ≥ 100ms. Afte r this time, the BOOT_CONFIG pins ca n b e set to high level by external circuit. ≥2.5s STATUS (OD) ≥12s UART Inactive Act ive ≥13s USB Inactive Act ive Figure 12: Timing of Turning on Module NOTES 1.
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LTE Standard Module Series EC25 Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. VBA T ≥650ms ≥29.5s PWRKEY STATUS (OD) Module Status RUNNING Power-down procedure OFF Figure 13: Timing of Turning off Module 3.7.2.2.
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LTE Standard Module Series EC25 Hardware Design Table 8: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.
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LTE Standard Module Series EC25 Hardware Design The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported.
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LTE Standard Module Series EC25 Hardware Design EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for more details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
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LTE Standard Module Series EC25 Hardware Design In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:       Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces.
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LTE Standard Module Series EC25 Hardware Design For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
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LTE Standard Module Series EC25 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.   The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication.
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LTE Standard Module Series EC25 Hardware Design Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA 120K VCCB 10K 0.1uF 0.
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LTE Standard Module Series EC25 Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
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LTE Standard Module Series EC25 Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain PCM_OUT 25 DO PCM data output 1.
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LTE Standard Module Series EC25 Hardware Design PCM_SYNC 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 27 IO PCM data bit clock 1.8V power domain I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC.
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LTE Standard Module Series EC25 Hardware Design The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.
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LTE Standard Module Series EC25 Hardware Design         The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10kΩ~100kΩ and the recommended value is 100kΩ.
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LTE Standard Module Series EC25 Hardware Design SDC1_CMD WLAN_EN 134 136 IO DO WLAN SDIO bus command 1.8V power domain WLAN function control via FC20 module. 1.8V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. Coexistence and Control Part PM_ENABLE 127 DO WLAN power control 1.8V power domain Active high. WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module 1.8V power domain LTE/WLAN&BT coexistence signal 1.8V power domain.
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LTE Standard Module Series EC25 Hardware Design The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module.
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LTE Standard Module Series EC25 Hardware Design SDIO interface supports SDR mode, and the maximum frequency is up to 50MHz. As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:      It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50Ω±10%.
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LTE Standard Module Series EC25 Hardware Design ADC1 44 General-purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range Max. Unit 0.3 VBAT_BB V 0.3 VBAT_BB V ADC Resolution Typ. 15 bits NOTES 1. 2. 3. ADC input voltage must not exceed that of VBAT_BB. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed.
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LTE Standard Module Series EC25 Hardware Design Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK 122 DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.85V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain.
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LTE Standard Module Series EC25 Hardware Design Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:     Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
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LTE Standard Module Series EC25 Hardware Design NET_MODE 5 DO Indicate the module’s network registration mode NET_STATUS 6 DO Indicate the module’s network activity status 1.8V power domain Cannot be pulled up before startup 1.
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LTE Standard Module Series EC25 Hardware Design on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No. 61 I/O OD Description Comment Indicate the module’s operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers’ application demands.
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LTE Standard Module Series EC25 Hardware Design In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.
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LTE Standard Module Series EC25 Hardware Design Module VDD_EXT Test points USB_BOOT 4.7K Close to test points TVS Figure 31: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT PWRKEY ≥500ms VH=0.8V VIL≤0.5V About 100ms VDD_EXT USB_BOOT can be pulled up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2.
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LTE Standard Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC25 Hardware Design Accuracy (GNSS) @open sky XTRA enabled 1.8 s CEP-50 Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
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LTE Standard Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC25 Hardware Design WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B6 830~840 875~885 MHz WCDMA B8 880~915 925~960 MHz WCDMA B19 830~845 875~890 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~9
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity.
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LTE Standard Module Series EC25 Hardware Design .
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LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.42±2.046 MHz BeiDou (Compass) 1561.098±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement.
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LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.
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LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
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LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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LTE Standard Module Series EC25 Hardware Design 3. returns to the normal operation temperature levels, the module will meet 3GPP specifications again. “*” means under development. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.
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LTE Standard Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design LTE-TDD PF=64 (USB connected) 32.0 mA EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600.0 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.67dBm 424.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.0 mA WCDMA B8 @23.54dBm 618.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA B2 @22.93dBm 646.0 mA WCDMA B4 @23dBm 572.
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LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 10 μA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA LTE-TDD PF=64 (USB disconnected) 2.6 mA LTE-TDD PF=128 (USB disconnected) 1.9 mA WCDMA PF=64 (USB disconnected) 21.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call LTE-FDD B19 @23.16dBm 676.0 mA LTE-FDD B26 @22.87dBm 689.0 mA LTE-TDD B41 @22.52dBm 438.0 mA WCDMA B1 @23.33dBm 604.0 mA WCDMA B6 @23.28dBm 548.0 mA WCDMA B19 @23.28dBm 548.0 mA Table 38: EC25-AU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 1.3 mA AT+CFUN=0 (USB disconnected) 1.46 mA GSM850 DRX=5 (USB disconnected) 1.
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LTE Standard Module Series EC25 Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) EC25_Hardware_Design WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA GSM850 1UL/4DL @32.53dBm 232.0 mA GSM850 2UL/3DL @32.34dBm 384.0 mA GSM850 3UL/2DL @30.28dBm 441.0 mA GSM850 4UL/1DL @29.09dBm 511.0 mA EGSM900 1UL/4DL @32.34dBm 241.0 mA EGSM900 2UL/3DL @32.19dBm 397.0 mA EGSM900 3UL/2DL @30.17dBm 459.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EC25_Hardware_Design EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS1800 1UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.62dBm 240.0 mA DCS1800 3UL/2DL @25.42dBm 325.0 mA DCS1800 4UL/1DL @25.21dBm 415.0 mA PCS1900 1UL/4DL @25.65dBm 148.0 mA PCS1900 2UL/3DL @25.63dBm 232.0 mA PCS1900 3UL/2DL @25.54dBm 313.0 mA PCS1900 4UL/1DL @25.26dBm 401.
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LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.59dBm 235.0 mA DCS1800 PCL0 @29.72dBm 178.0 mA PCS1900 PCL0 @29.82dBm 170.0 mA WCDMA B1 @23.27dBm 687.0 mA WCDMA B2 @23.38dBm 668.0 mA WCDMA B5 @23.38dBm 592.0 mA WCDMA B8 @23.32dBm 595.0 mA Table 39: EC25-AUT Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC25 Hardware Design LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B5 HSUPA @22dBm 486.0 mA LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.0 mA LTE-FDD B5 @23.32dBm 588.0 mA LTE-FDD B7 @23.08dBm 692.0 mA LTE-FDD B28A @23.37dBm 752.0 mA LTE-FDD B28B @23.48dBm 770.0 mA WCDMA B1 @23.22dBm 546.0 mA WCDMA B5 @23.01dBm 511.0 mA Table 40: EC25-AF Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC25 Hardware Design LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.0 mA WCDMA B5 HSUPA @22.43dBm 617.0 mA LTE-FDD B2 @22.92dBm 698.0 mA LTE-FDD B4 @23.12dBm 710.0 mA LTE-FDD B5 @22.98dBm 650.0 mA LTE-FDD B12 @23.42dBm 648.0 mA LTE-FDD B13 @22.92dBm 690.0 mA LTE-FDD B14 @23.42dBm 685.0 mA LTE-FDD B66 @23.35dBm 715.0 mA LTE-FDD B71 @23.39dBm 689.0 mA WCDMA B2 @23.59dBm 585.
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LTE Standard Module Series EC25 Hardware Design Idle state WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call EC25_Hardware_Design LTE-FDD PF=128 (USB disconnected) 1.43 mA LTE-FDD PF=256 (USB disconnected) 1.17 mA WCDMA PF=64 (USB disconnected) 14.9 mA WCDMA PF=64 (USB connected) 34.2 mA LTE-FDD PF=64 (USB disconnected) 15.2 mA LTE-FDD PF=64 (USB connected) 34.8 mA WCDMA B2 HSDPA @22.1dBm 548.0 mA WCDMA B2 HSUPA @22.28dBm 545.0 mA WCDMA B4 HSDPA @22.
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LTE Standard Module Series EC25 Hardware Design Table 42: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.15 mA WCDMA PF=128 (USB disconnected) 1.67 mA LTE-FDD PF=64 (USB disconnected) 2.60 mA LTE-FDD PF=128 (USB disconnected) 1.90 mA LTE-TDD PF=64 (USB disconnected) 2.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call EC25_Hardware_Design DCS1800 2DL/3UL @27.15dBm 337.0 mA DCS1800 1DL/4UL @25.88dBm 406.0 mA EGSM900 4DL/1UL PCL=8 @26.60dBm 142.0 mA EGSM900 3DL/2UL PCL=8 @25.43dBm 229.0 mA EGSM900 2DL/3UL PCL=8 @23.4dBm 286.0 mA EGSM900 1DL/4UL PCL=8 @22.36dBm 348.0 mA DCS1800 4DL/1UL PCL=2 @25.59dBm 136.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 225.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call WCDMA B1 @23.88dBm 548.0 mA WCDMA B8 @23.8dBm 615.0 mA Table 43: EC25-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 μA AT+CFUN=0 (USB disconnected) 1.0 mA GSM DRX=2 (USB disconnected) 2.0 mA GSM DRX=9 (USB disconnected) 1.3 mA WCDMA PF=64 (USB disconnected) 2.1 mA WCDMA PF=128 (USB disconnected) 1.7 mA LTE-FDD PF=64 (USB disconnected) 2.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call EC25_Hardware_Design DCS1800 2DL/3UL @29.37dBm 344.0 mA DCS1800 1DL/4UL @29.28dBm 443.0 mA EGSM900 4DL/1UL PCL=8 @25.21dBm 175.0 mA EGSM900 3DL/2UL PCL=8 @24.80dBm 295.0 mA EGSM900 2DL/3UL PCL=8 @24.74dBm 397.0 mA EGSM900 1DL/4UL PCL=8 @24.38dBm 509.0 mA DCS1800 4DL/1UL PCL=2 @25.72dBm 134.
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LTE Standard Module Series EC25 Hardware Design Table 44: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 μA AT+CFUN=0 (USB disconnected) 0.9 mA GSM DRX=2 (USB disconnected) 1.8 mA GSM DRX=9 (USB disconnected) 1.3 mA WCDMA PF=64 (USB disconnected) 1.6 mA WCDMA PF=128 (USB disconnected) 1.3 mA LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.6 mA LTE-TDD PF=64 (USB disconnected) 2.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call EC25_Hardware_Design DCS1800 2DL/3UL @27.49dBm 310.6 mA DCS1800 1DL/4UL @26.44dBm 377.7 mA EGSM900 4DL/1UL PCL=8 @27.27dBm 175.4 mA EGSM900 3DL/2UL PCL=8 @26.13dBm 292.1 mA EGSM900 2DL/3UL PCL=8 @24.03dBm 386.8 mA EGSM900 1DL/4UL PCL=8 @23.35dBm 494.7 mA DCS1800 4DL/1UL PCL=2 @25.92dBm 134.5 mA DCS1800 3DL/2UL PCL=2 @25.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call WCDMA B1 @23.09dBm 594.2 mA WCDMA B8 @23.18dBm 504.3 mA Table 45: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 19 μA AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 2.3 mA WCDMA PF=128 (USB disconnected) 1.7 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 2.2 mA WCDMA PF=64 (USB disconnected) 12.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call LTE-FDD B28 @23.45dBm 631.0 mA LTE-FDD B66 @22.68dBm 781.0 mA WCDMA B2 @23.47dBm 643.0 mA WCDMA B4 @23.5dBm 633.0 mA WCDMA B5 @23.5dBm 551.0 mA Table 46: EC25-AUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 μA AT+CFUN=0 (USB disconnected) 0.9 mA GSM DRX=2 (USB disconnected) 2.4 mA LTE-FDD PF=128 (USB disconnected) 2.5 mA LTE-TDD PF=64 (USB disconnected) 3.
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LTE Standard Module Series EC25 Hardware Design EDGE data transfer (GNSS OFF) EC25_Hardware_Design EGSM900 4DL/1UL @33.27dBm 272.7 mA EGSM900 3DL/2UL @31.99dBm 406.9 mA EGSM900 2DL/3UL @29.67dBm 470.2 mA EGSM900 1DL/4UL @28.44dBm 547.1 mA DCS1800 4DL/1UL @29.44dBm 164.5 mA DCS1800 3DL/2UL @28.47dBm 235.7 mA DCS1800 2DL/3UL @26.29dBm 292.2 mA DCS1800 1DL/4UL @25.26dBm 363.8 mA PCS1900 4DL/1UL @29.44dBm 162.9 mA PCS1900 3DL/2UL @28.59dBm 246.8 mA PCS1900 2DL/3UL @26.
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LTE Standard Module Series EC25 Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call EC25_Hardware_Design PCS1900 3DL/2UL @25.46dBm 231.4 mA PCS1900 2DL/3UL @23.45dBm 316.1 mA PCS1900 1DL/4UL @22.38dBm 411.0 mA WCDMA B1 HSDPA @22.60dBm 534.6 mA WCDMA B1 HSUPA @22.48dBm 541.3 mA WCDMA B2 HSDPA @21.60dBm 572.9 mA WCDMA B2 HSUPA @22.06dBm 560.0 mA WCDMA B4 HSDPA @22.97dBm 495.8 mA WCDMA B4 HSUPA @23.20dBm 512.4 mA WCDMA B5 HSDPA @22.
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LTE Standard Module Series EC25 Hardware Design WCDMA voice call PCS1900 PCL0 @29.47dBm 160.3 mA WCDMA B1 @23.13dBm 568.9 mA WCDMA B2 @22.99dBm 628.4 mA WCDMA B4 @22.90dBm 506.3 mA WCDMA B5 @23.10dBm 507.5 mA WCDMA B8 @22.90dBm 581.5 mA Conditions Typ. Unit Cold start @Passive Antenna 54.0 mA Lost state @Passive Antenna 53.9 mA Instrument Environment 30.5 mA Open Sky @Passive Antenna 33.2 mA Open Sky @Active Antenna 40.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD bands 23dBm±2dB < -39dBm LTE-TDD bands 23dBm±2dB < -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module.
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LTE Standard Module Series EC25 Hardware Design Table 50: EC25-A Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B2 (10MHz) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10MHz) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10MHz) -97.2dBm -98.0dBm -101.0dBm -93.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B19 (10MHz) -99.2dBm -99.0dBm -101.4dBm -96.3dBm LTE-FDD B26 (10MHz) -99.5dBm -99.0dBm -101.5dBm -93.8dBm LTE-TDD B41 (10MHz) -95.0dBm -95.7dBm -99.0dBm -94.3dBm Table 53: EC25-AU Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.
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LTE Standard Module Series EC25 Hardware Design Table 54: EC25-AUT Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B1 (10MHz) -98.5dBm -98.0dBm -101.0dBm -96.3dBm LTE-FDD B3 (10MHz) -98.0dBm -97.0dBm -100.0dBm -93.3dBm LTE-FDD B5 (10MHz) -98.0dBm -99.0dBm -102.5dBm -94.3dBm LTE-FDD B7 (10MHz) -97.0dBm -97.0dBm -98.5dBm -94.3dBm LTE-FDD B28 (10MHz) -97.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B13 (10MHz) -98.5dBm -99.5dBm -100.7dBm -93.3dBm LTE-FDD B14 (10MHz) -99.4dBm -99.5dBm -100.9dBm -93.3dBm LTE-FDD B66 (10MHz) -97.5dBm -98.5dBm -99.6dBm -95.8dBm LTE-FDD B71 (10MHz) -98.6dBm -99.5dBm -100dBm -93.5dBm Table 57: EC25-AFX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -109.5dBm -110dBm -110.4dBm -104.7dBm WCDMA B4 -109.6dBm -110dBm -110.6dBm -106.
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LTE Standard Module Series EC25 Hardware Design LTE-FDD B1 (10MHz) -98.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B3 (10MHz) -98.2dBm -99.8dBm -102dBm -93.3dBm LTE-FDD B7 (10MHz) -96.7dBm -98.5dBm -100.7dBm -94.3dBm LTE-FDD B8 (10MHz) -98.5dBm -100.4dBm -102.4dBm -93.3dBm LTE-FDD B20 (10MHz) -98.7dBm -100.2dBm -102.7dBm -93.3dBm LTE-FDD B28 (10MHz) -98.7dBm -100.5dBm -102.5dBm -94.8dBm LTE-TDD B38 (10MHz) -95.2dBm -97.0dBm -100.2dBm -96.3dBm LTE-TDD B40 (10MHz) -95.
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LTE Standard Module Series EC25 Hardware Design EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10MHz) -98.0dBm -98.0dBm -101dBm -96.3dBm LTE-FDD B3 (10MHz) -96.5dBm -98.5dBm -99.5dBm -93.3dBm LTE-FDD B7 (10MHz) -97.0dBm -94.5dBm -99.5dBm -94.3dBm LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -100.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.0dBm -101.5dBm -93.
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LTE Standard Module Series EC25 Hardware Design Table 62: EC25-AUX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm -109.5dBm -112dBm -106.7dBm WCDMA B2 -110.5dBm / / -104.7dBm WCDMA B4 -110.0dBm -110dBm -112dBm -104.7dBm WCDMA B5 -111.0dBm -112dBm -113dBm -104.7dBm WCDMA B8 -111.
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LTE Standard Module Series EC25 Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module‘s electrostatics discharge characteristics.
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LTE Standard Module Series EC25 Hardware Design The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105°C.
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LTE Standard Module Series EC25 Hardware Design 2. recover to network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. For more detailed guidelines on thermal design, please refer to document [7].
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LTE Standard Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 2.4±0.2 29.0±0.15 32.0±0.15 0.
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LTE Standard Module Series EC25 Hardware Design 3.4 2.0 5.96 1.30 1.1 3.85 1.1 3.5 32.0＋/-0.15 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 4.8 1.05 1.6 29.0＋/-0.15 2.0 6.8 1.7 2.49 1.9 2.4 3.2 3.4 3.2 3.4 0.8 3.2 3.5 4.37 1.5 3.
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LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
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LTE Standard Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC25 module. For authentic appearance, please refer to the module that you receive from Quectel.
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LTE Standard Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:   Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
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LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4].
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LTE Standard Module Series EC25 Hardware Design Max slope 2~3°C/sec Reflow time (D: over 220°C) 40~60sec Max temperature 238~245°C Cooling down slope 1~4°C/sec Reflow Cycle Max reflow cycle 1 8.3. Packaging 29.3± 0.15 0.35± 0.05 30.3± 0.15 1. .1 ±0 0 5 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250 modules. The figure below shows the package details, measured in mm. 4.2± 0.
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LTE Standard Module Series EC25 Hardware Design 48.5 Cover tape 13 100 Direction of feed 44.5+0.20 -0.
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LTE Standard Module Series EC25 Hardware Design 9 Appendix A References Table 65: Related Documents SN Document Name Remark [1] Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EC25 Hardware Design DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Globa
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LTE Standard Module Series EC25 Hardware Design MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short
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LTE Standard Module Series EC25 Hardware Design Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin
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LTE Standard Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 67: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC25 Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Hardware_Design 130 / 130
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LTE Standard Module Sires EC25 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 69: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.