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EC25 Series

Hardware Design

LTE Standard Module Series

Version: 2.4.2

Date: 2021-04-08

Status: Preliminary

Summary of content (138 pages)

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EC25 Series Hardware Design LTE Standard Module Series Version: 2.4.
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LTE Standard Module Series EC25 Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
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LTE Standard Module Series EC25 Series Hardware Design Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
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LTE Standard Module Series EC25 Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2016-04-01 Woody WU Initial 1. 2. 1.1 2016-09-22 Lyndon LIU/ Frank WANG Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4.
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LTE Standard Module Series EC25 Series Hardware Design 1. 2. 3. 4. 5. 1.3 2017-01-24 Lyndon LIU/ Frank WANG 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1.5 2018-04-20 Kinsey ZHANG 1. 2. 3. 4. EC25_Series_Hardware_Design Updated function diagram in Figure 1. Updated pin assignment (top view) in Figure 2. Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24.
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LTE Standard Module Series EC25 Series Hardware Design 5. 2.0 2019-04-30 Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN EC25_Series_Hardware_Design module into Table 41. Added EC25-AF conducted RF receiving sensitivity in Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5.
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LTE Standard Module Series EC25 Series Hardware Design 2.1 2.2 2.3 2019-07-05 2019-08-19 2019-11-26 Fanny CHEN/ Ethan SHAN 1. Added new variants EC25-AFX/-AUX and related information. 2. Added notes for interfaces not supported by ThreadX modules. 3. Updated supported protocols and USB serial drivers in Table 2. 4. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. 5. Added EC25-AFX current consumption in Table 41. 6.
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LTE Standard Module Series EC25 Series Hardware Design 2.4.2 2021-04-08 Barret XIONG/ Ailsa WANG EC25_Series_Hardware_Design Added related information of EC25-JL. Added related information of EC25-AFDL.
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LTE Standard Module Series EC25 Series Hardware Design Contents About the Document ................................................................................................................................... 3 Contents ....................................................................................................................................................... 8 Table Index .......................................................................................................................
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LTE Standard Module Series EC25 Series Hardware Design 3.13. SD Card Interface ................................................................................................................ 5856 3.14. Wireless Connectivity Interfaces ......................................................................................... 6058 3.14.1. WLAN Interface .......................................................................................................... 6260 3.14.2. BT Interface ........................
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LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References............................................................................................................. 130127 10 Appendix B GPRS Coding Schemes ....................................................................................... 134131 11 Appendix C GPRS Multi-slot Classes ...................................................................................... 135132 12 Appendix D EDGE Modulation and Coding Schemes ....
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LTE Standard Module Series EC25 Series Hardware Design Table Index Table 1: Supported Frequency Bands and GNSS Function of EC25 Series Module ................................... 1917 Table 2: Key Features of EC25 Series Module ............................................................................................. 2119 Table 3: I/O Parameters Definition ................................................................................................................ 2725 Table 4: Pin Description .......
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LTE Standard Module Series EC25 Series Hardware Design Table 42: EC25-AF Current Consumption..................................................................................................... 9694 Table 43: EC25-AFX Current Consumption .................................................................................................. 9795 Table 44: EC25-EU Current Consumption ....................................................................................................
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LTE Standard Module Series EC25 Series Hardware Design Figure Index Figure 1: Functional Diagram ........................................................................................................................ 2422 Figure 2: Pin Assignment (Top View) ............................................................................................................ 2624 Figure 3: Sleep Mode Application via UART ................................................................................................
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LTE Standard Module Series EC25 Series Hardware Design Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) .......................................... 120118 Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) ........................ 120118 Figure 44: Module Top and Side Dimensions ........................................................................................... 122119 Figure 45: Module Bottom Dimensions (Bottom View) ..........................
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LTE Standard Module Series EC25 Series Hardware Design 1 Introduction This document defines EC25 series module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 series module.
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LTE Standard Module Series EC25 Series Hardware Design configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label.
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LTE Standard Module Series EC25 Series Hardware Design appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
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LTE Standard Module Series EC25 Series Hardware Design Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft.
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LTE Standard Module Series EC25 Series Hardware Design 2 Product Concept 2.1. General Description EC25 module is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific applications.
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LTE Standard Module Series EC25 Series Hardware Design EC25-AF FDD: B2/B4/B5/B12/B13/ B14/B66/B71 B2/B4/B5 N Y EC25-AFX FDD: B2/B4/B5/B12/B13/ B14/B66/B71 B2/B4/B5 N Y EC25-EU FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800 MHz Y EC25-EUX FDD: B1/B3/B7/B8/B20/ B28A TDD: B38/B40/B41 B1/B8 900/1800 MHz Y EC25-T FDD: B2/B4/B5/B12/B66/B71 N N Y EC25-AUTL FDD: B3/B7/B28 N N Y N EC25-MX FDD: B2/B4//B5/B7/B28/ B66 B2/B4/B5 N Y N EC25-EX FDD:B1/B3/B5/B7/B8/B20 TDD:
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LTE Standard Module Series EC25 Series Hardware Design 2.2. Key Features The following table describes the detailed features of EC25 series module. Table 2: Key Features of EC25 Series Module Features Description Power Supply Supply voltage: 3.3–4.3 V Typical supply voltage: 3.
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LTE Standard Module Series EC25 Series Hardware Design Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max 296 kbps (DL)/Max 236.
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LTE Standard Module Series EC25 Series Hardware Design Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 Data update rate: 1 Hz by default AT Commands Compliant with 3GPP TS 27.007, 27.
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LTE Standard Module Series EC25 Series Hardware Design SAW ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch Duplex LNA SAW VBAT_RF PA APT PRx DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N ADCs 19.2M XO STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4.
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LTE Standard Module Series EC25 Series Hardware Design 3 Application Interfaces 3.1. General Description EC25 series are equipped with 80 LCC pads and 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions.
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LTE Standard Module Series EC25 Series Hardware Design CTS DCD RI ST ATUS VBAT_BB VBAT_BB VBAT_RF VBAT_RF GND RESERVED 64 63 62 61 60 59 58 57 56 55 7 65 VDD_EXT RTS 6 66 NET_ST ATUS 67 119 TXD 131 DTR 5 68 NET_MODE1) RXD 118 69 130 70 4 USB_DP W_DISABLE# USB_DM 3 71 RESERVED 72 2 GND 1 AP_READY USB_VBUS 113 RESERVED 114 RESERVED WAKEUP_IN1) 117 129 132 120 RESERVED 14 1 133 121 RESERVED GND 14 2 8 134 122 GND 9 135 123 USIM_GND 10
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LTE Standard Module Series EC25 Series Hardware Design be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3. Pin Description The following tables show the pin definition of EC25 series module. Table 3: I/O Parameters Definition Type Description AI Analog Input AO Analog Output DI Digital Input DO Digital Output IO Bidirectional OD Open Drain PI Power Input PO Power Output Table 4: Pin Description Power Supply Pin Name VBAT_BB Pin No.
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LTE Standard Module Series EC25 Series Hardware Design circuits. If unused, keep it open. GND 8, 9, 19, 22, 36, 46, 48, 50–54, 56, 72, 85–112 Ground Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment DI Turn on/off the module VH = 0.8 V The output voltage is 0.8 V because of the diode drop in the Qualcomm chipset. DI Reset signal of the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design open. USB_DM 70 IO USB differential data bus (-) I/O Description USB 2.0 Compliant. Require differential impedance of 90 Ω. If unused, keep it open. (U)SIM Interface Pin Name Pin No. USIM_GND 10 USIM_ PRESENCE 13 DC Characteristics Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design USIM_RST 17 DO Reset signal of (U)SIM card For 1.8 V (U)SIM: VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM: VOLmax = 0.45 V VOHmin = 2.55 V Main UART Interface Pin Name RI DCD CTS RTS DTR TXD RXD Pin No. 62 63 64 65 66 67 68 I/O Description DC Characteristics Comment DO Ring indicator VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. DO Data carrier detection VOLmax = 0.45 V VOHmin = 1.
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LTE Standard Module Series EC25 Series Hardware Design DBG_RXD 11 DI Receive data VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V I/O Description DC Characteristics Comment AI General-purpose analog to digital converter Voltage range: 0.3 V to VBAT_BB If unused, keep it open. AI General-purpose analog to digital converter Voltage range: 0.3 V to VBAT_BB If unused, keep it open. I/O Description DC Characteristics Comment PCM data input VILmin = -0.3 V VILmax = 0.
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LTE Standard Module Series EC25 Series Hardware Design codec. I2C_SDA 42 OD I2C serial data. Used for external codec. I/O Description required. If unused, keep it open. An external 1.8 V pull-up resistor is required. If unused, keep it open. SD Card Interface Pin Name SDC2_ DATA3 Pin No. 28 SDC2_ DATA2 29 SDC2_ DATA1 30 IO IO IO EC25_Series_Hardware_Design SD card SDIO bus DATA3 SD card SDIO bus DATA2 SD card SDIO bus DATA1 DC Characteristics 1.8 V signaling: VOLmax = 0.
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LTE Standard Module Series EC25 Series Hardware Design VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling: VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V SDC2_ DATA0 SDC2_CLK SDC2_CMD 31 32 33 IO DO IO EC25_Series_Hardware_Design SD card SDIO bus DATA0 SD card SDIO bus clock SD card SDIO bus command 1.8 V signaling: VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.
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LTE Standard Module Series EC25 Series Hardware Design 3.0 V signaling: VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V SD_INS_ DET VDD_SDIO 23 34 DI SD card insertion detect VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. PO SD card SDIO bus pull-up power IOmax = 50 mA 1.8/2.85 V configurable. Cannot be used for SD card power. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design SGMII_ MCLK 122 SGMII_TX_M 123 SGMII_TX_P 124 SGMII_RX_P 125 SGMII_RX_M 126 USIM2_VDD 128 DO AO AO AI AI PO SGMII MDIO (Management Data Input/Output) clock For 1.8 V: VOLmax = 0.45 V VOHmin = 1.4 V For 2.85 V: VOLmax = 0.35 V VOHmin = 2.14 V 1.8/2.85 V power domain. If unused, keep it open. SGMII transmission - minus Connect with a 0.1 μF capacitor, and is close to the PHY side. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design VIHmax = 2.0 V SDC1_ DATA2 SDC1_ DATA1 SDC1_ DATA0 SDC1_CLK SDC1_CMD 130 131 132 133 134 PM_ENABLE 127 WAKE_ON_ WIRELESS WLAN_EN 135 136 COEX_UART 137 _RX WLAN SDIO data bus D2 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. WLAN SDIO data bus D1 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.
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LTE Standard Module Series EC25 Series Hardware Design COEX_UART 138 _TX DO LTE/WLAN & BT coexistence signal WLAN_SLP_ 118 CLK DO WLAN sleep clock BT_RTS BT_TXD BT_RXD BT_CTS BT_EN 37 38 39 VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. DI BT UART request to send VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open.
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LTE Standard Module Series EC25 Series Hardware Design VIHmin = 1.2 V VIHmax = 2.0 V W_DISABLE# AP_READY 4 2 before startup. Low level wakes up the module. If unused, keep it open. 1.8 V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. DI Airplane mode control VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V DI Application processor sleep state detection VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.
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LTE Standard Module Series EC25 Series Hardware Design 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate.
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LTE Standard Module Series EC25 Series Hardware Design The following figure shows the connection between the module and the host. Host Module RXD TXD TXD RXD RI EINT DTR GPIO AP_READY GPIO GND GND Figure 3: Sleep Mode Application via UART ⚫ ⚫ ⚫ Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode.
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LTE Standard Module Series EC25 Series Hardware Design Module Host GPIO USB_VBUS Power Switch VDD USB_DP USB_DP USB_DM USB_DM RI EINT AP_READY GPIO GND GND Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. 3.5.2.
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LTE Standard Module Series EC25 Series Hardware Design 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. ⚫ ⚫ Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max.
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LTE Standard Module Series EC25 Series Hardware Design array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be.
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LTE Standard Module Series EC25 Series Hardware Design MIC29302WU DC_IN VBAT IN 470 μF ADJ GND 5 51K OUT 3 1 EN 2 4 100K 1% 470R 4.7K 100 nF VBAT_EN 47K 470 μF 100 nF 47K 1% Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4.
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LTE Standard Module Series EC25 Series Hardware Design released. A simple reference circuit is illustrated in the following figure. PWRKEY 500 ms 4.7K 10 nF Turn on pulse 47K Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection.
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LTE Standard Module Series EC25 Series Hardware Design NOTE 1 VBA T 500 ms VH=0.8 V PWRKEY VIL 0.5 V Abo ut 100 ms VDD_EXT 100 ms. Over th is time, BOO T_CONFIG pins can be pu lled up external ly. BOO T_CONFIG & USB_BOO T Pin s RESET_N 3s STATUS (OD) 12 s UART Inactive Active 13 s USB Inactive Active Figure 12: Timing of Turning on Module NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin.
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LTE Standard Module Series EC25 Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. VBA T 650 ms 29.5 s PWRKEY STATUS (OD) Module Status RUNNING Power-down procedure OFF Figure 13: Timing of Turning off Module 3.7.2.2.
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LTE Standard Module Series EC25 Series Hardware Design Table 8: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N 150–460 ms 4.
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LTE Standard Module Series EC25 Series Hardware Design VBAT 460 ms 150 ms VIH RESET_N VIL Module Status Running 1.3 V 0.5 V Resetting Restart Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported.
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LTE Standard Module Series EC25 Series Hardware Design EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for more details about the command The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 μF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly.
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LTE Standard Module Series EC25 Series Hardware Design Test Points Minimize these stubs Module VDD R3 NM_0R R4 NM_0R MCU ESD Array USB_VBUS L1 USB_DM USB_DM USB_DP USB_DP Close to Module GND GND Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ bps, 230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication. The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No.
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LTE Standard Module Series EC25 Series Hardware Design VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8 V UART interface. A level translator should be used if customers’ application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA 120K VCCB 10K 0.1 μF VDD_MCU 0.
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LTE Standard Module Series EC25 Series Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 3.12.
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LTE Standard Module Series EC25 Series Hardware Design 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8 V power domain PCM_OUT 25 DO PCM data output 1.
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LTE Standard Module Series EC25 Series Hardware Design PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT DAC PCM_DIN ADC I2C_SCL SCL I2C_SDA SDA INP INN BIAS MICBIAS Module 4.7K 4.7K LOUTP LOUTN Codec 1.8 V Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.13.
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LTE Standard Module Series EC25 Series Hardware Design SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8/2.85 V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8 V power domain. If unused, keep it open. The following figure shows a reference design of SD card.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 Ω (±10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15 pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1 mm and the total routing length less than 50 mm.
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LTE Standard Module Series EC25 Series Hardware Design COEX_UART_RX 137 DI LTE/WLAN & BT coexistence signal 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. COEX_UART_TX 138 DO LTE/WLAN & BT coexistence signal WLAN_SLP_CLK 118 DO WLAN sleep clock BT Part BT_RTS 37 DI BT UART request to send 1.8 V power domain BT_TXD 38 DO BT UART transmit data 1.
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LTE Standard Module Series EC25 Series Hardware Design Module FC20 Module PM_ENABL E DCDC/LDO VDD_3V3 POWER VDD_EXT SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 WLAN SDIO_CLK SDC1_CMD SDIO_CMD WLAN_EN WLAN_EN WLAN_SLP_CLK 32KHZ_IN WAKE_ON_WIREL ESS COEX_UART_RX LTE_UART_TXD COEX_UART_TX LTE_UART_RXD BT_EN BT_RTS Bluetooth SDIO_D0 SDC1_CLK WAKE_ON_WIREL ESS COEX VIO BT_EN BT_UART_RTS BT_CTS BT_UART_CTS BT_TXD BT_UART_RXD BT_RXD BT_UART_TXD PCM_IN
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 Ω ±10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1 mm and total routing length less than 50 mm.
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LTE Standard Module Series EC25 Series Hardware Design ADC1 44 General-purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. ADC0 Voltage Range ADC1 Voltage Range Max. Unit 0.3 VBAT_BB V 0.3 VBAT_BB V ADC Resolution Typ. 15 bits NOTES 1. 2. 3. ADC input voltage must not exceed that of VBAT_BB. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed.
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LTE Standard Module Series EC25 Series Hardware Design EPHY_RST_N 119 DO Ethernet PHY reset 1.8/2.85 V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8 V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8/2.85 V power domain SGMII_MCLK 122 DO SGMII MDIO (Management Data Input/Output) clock 1.8/2.85 V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8/2.85 V power domain.
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LTE Standard Module Series EC25 Series Hardware Design Module R1 10K R2 1.5K VDD_EXT AR8033 USIM2_VDD EPHY_INT_N INT EPHY_RST_N RSTN Control SGMII_MDATA MDIO SGMII_MCLK MDC USIM2_VDD USIM2_VDD SGMII_RX_P C1 0.1uF SGMII_RX_M C2 0.1uF Close to Module SOP SON SGMII Data SGMII_TX_P 0.1uF C3 SIP SGMII_TX_M 0.
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LTE Standard Module Series EC25 Series Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment 1.8 V power domain Cannot be pulled up before startup 1.
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LTE Standard Module Series EC25 Series Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series EC25 Series Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120 ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command.
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LTE Standard Module Series EC25 Series Hardware Design Module VDD_EXT Test points USB_BOOT 4.7K Close to test points TVS Figure 31: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT ≥ 500 ms VH = 0.8 V PWRKEY VDD_EXT VIL≤ 0.5 V About 100 ms USB_BOOT can be pulled up to 1.8 V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2.
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LTE Standard Module Series EC25 Series Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command.
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LTE Standard Module Series EC25 Series Hardware Design Hot start @ open sky Accuracy (GNSS) CEP-50 Autonomous 2.5 s XTRA enabled 1.8 s Autonomous @ open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.
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LTE Standard Module Series EC25 Series Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50 Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA B2 1850–1910 1930–1990 MHz WCDMA B4 1710–1755 2110–2155 MHz WCDMA B5 824–849 869–894 MHz WCDMA B6 830–840 875–885 MHz WCDMA B8 880–915 925– 960 MHz WCDMA B19 830–845 875–890 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B2 1850–1910 1930–1990 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B4 1710–1755 2110–2155 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–91
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B71 663–698 617–652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Main Antenna Module R1 0R ANT_MAIN C1 C2 NM NM Diversity Antenna R2 0R ANT_DIV C3 C4 NM NM Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3.
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LTE Standard Module Series EC25 Series Hardware Design .
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LTE Standard Module Series EC25 Series Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC25 Series Hardware Design Table 29: GNSS Frequency Type Frequency Unit GPS 1575.42 ±1.023 MHz GLONASS 1597.5–1605.8 MHz Galileo 1575.42 ±2.046 MHz BeiDou (Compass) 1561.098 ±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. VDD 0.1 μF 10R Module GNSS Antenna 47nH 100 pF 0R ANT_GNSS NM NM Figure 38: Reference Circuit of GNSS Antenna NOTES 1. 2.
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LTE Standard Module Series EC25 Series Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.
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LTE Standard Module Series EC25 Series Hardware Design Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.
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LTE Standard Module Series EC25 Series Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
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LTE Standard Module Series EC25 Series Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC25 Series Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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LTE Standard Module Series EC25 Series Hardware Design 3. operating temperature levels, the module will meet 3GPP specifications again. “*” means under development. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX = 2 (USB disconnected) 2.74 mA GSM DRX = 9 (USB disconnected) 2.
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LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) LTE-TDD PF = 64 (USB connected) 32.0 mA EGSM900 4DL/1UL @ 33.22 dBm 271.0 mA EGSM900 3DL/2UL @ 33.0 dBm 464.0 mA EGSM900 2DL/3UL @ 30.86 dBm 524.0 mA EGSM900 1DL/4UL @ 29.58 dBm 600.0 mA DCS1800 4DL/1UL @ 29.92 dBm 192.0 mA DCS1800 3DL/2UL @ 29.84 dBm 311.0 mA DCS1800 2DL/3UL @ 29.67 dBm 424.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @ 22.83 dBm 762.0 mA LTE-FDD B7 @ 23.37 dBm 842.0 mA LTE-FDD B8 @ 23.48 dBm 720.0 mA LTE-FDD B20 @ 22.75 dBm 714.0 mA LTE-TDD B38 @ 23.05 dBm 481.0 mA LTE-TDD B40 @ 23.17 dBm 431.8 mA LTE-TDD B41 @ 23.02 dBm 480.0 mA EGSM900 PCL = 5 @ 33.08 dBm 264.0 mA DCS1800 PCL = 0 @ 29.75 dBm 190.0 mA WCDMA B1 @ 23.22 dBm 680.0 mA WCDMA B5 @ 23.18 dBm 677.0 mA WCDMA B8 @ 23.54 dBm 618.
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LTE Standard Module Series EC25 Series Hardware Design LTE-TDD PF = 64 (USB disconnected) 1.95 mA LTE-TDD PF = 128 (USB disconnected) 1.39 mA GSM DRX = 5 (USB disconnected) 15.37 mA GSM DRX = 5 (USB connected) 24.83 mA WCDMA PF = 64 (USB disconnected) 15.68 mA WCDMA PF = 64 (USB connected) 25.02 mA LTE-FDD PF = 64 (USB disconnected) 14.71 mA LTE-FDD PF = 64 (USB connected) 23.87 mA LTE-TDD PF = 64 (USB disconnected) 14.66 mA LTE-TDD PF = 64 (USB connected) 23.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 1DL/4UL PCL = 2 @ 21.32 dBm 444.3 mA WCDMA B1 HSDPA @ 22.08 dBm 504.0 mA WCDMA B1 HSUPA @ 21.46 dBm 498.4 mA WCDMA B5 HSDPA @ 22.65 dBm 531.9 mA WCDMA B5 HSUPA @ 22.36 dBm 500.4 mA WCDMA B8 HSDPA @ 22.13 dBm 544.5 mA WCDMA B8 HSUPA @ 21.12 dBm 504.1 mA LTE-FDD B1 @ 22.38 dBm 622.8 mA LTE-FDD B3 @ 22.31 dBm 666.
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LTE Standard Module Series EC25 Series Hardware Design Sleep state AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF = 64 (USB disconnected) 1.8 mA WCDMA PF = 128 (USB disconnected) 1.5 mA LTE-FDD PF = 64 (USB disconnected) 2.2 mA LTE-FDD PF = 128 (USB disconnected) 1.6 mA WCDMA PF = 64 (USB disconnected) 21.0 mA WCDMA PF = 64 (USB connected) 31.0 mA LTE-FDD PF = 64 (USB disconnected) 21.0 mA LTE-FDD PF = 64 (USB connected) 31.0 mA WCDMA B2 HSDPA @ 21.9 dBm 591.
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LTE Standard Module Series EC25 Series Hardware Design Sleep state AT+CFUN=0 (USB disconnected) 0.85 mA LTE-FDD PF = 64 (USB disconnected) 2.0 mA LTE-FDD PF = 128 (USB disconnected) 1.5 mA LTE-FDD PF = 64 (USB disconnected) 20.0 mA LTE-FDD PF = 64 (USB connected) 31.0 mA LTE-FDD B4 @ 23.14 dBm 770.0 mA LTE-FDD B13 @ 23.48 dBm 531.0 mA Idle state LTE data transfer (GNSS OFF) Table 38: EC25-J Current Consumption Parameter Description Conditions Typ.
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LTE Standard Module Series EC25 Series Hardware Design transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B1 HSUPA @ 21.79 dBm 533.0 mA WCDMA B6 HSDPA @ 22.64 dBm 515.0 mA WCDMA B6 HSUPA @ 22.33 dBm 520.0 mA WCDMA B19 HSDPA @ 22.67 dBm 516.0 mA WCDMA B19 HSUPA @ 22.33 dBm 521.0 mA LTE-FDD B1 @ 23.16 dBm 685.0 mA LTE-FDD B3 @ 23.22 dBm 765.0 mA LTE-FDD B8 @ 23.22 dBm 640.0 mA LTE-FDD B18 @ 23.35 dBm 660.0 mA LTE-FDD B19 @ 23.16 dBm 676.
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LTE Standard Module Series EC25 Series Hardware Design LTE data transfer (GNSS OFF) LTE-FDD PF = 64 (USB connected) 32.0 mA LTE-TDD PF = 64 (USB disconnected) 21.0 mA LTE-TDD PF = 64 (USB connected) 32.0 mA LTE-FDD B1 @ 23.16 dBm 685.0 mA LTE-FDD B3 @ 23.22 dBm 765.0 mA LTE-FDD B8 @ 23.22 dBm 640.0 mA LTE-FDD B18 @ 23.35 dBm 660.0 mA LTE-FDD B19 @ 23.16 dBm 676.0 mA LTE-FDD B26 @ 22.87 dBm 689.0 mA LTE-TDD B41 @ 22.52 dBm 438.
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LTE Standard Module Series EC25 Series Hardware Design LTE-TDD PF = 128 (USB disconnected) 1.6 mA EGSM900 DRX = 5 (USB disconnected) 22.0 mA EGSM900 DRX = 5 (USB connected) 34.0 mA WCDMA PF = 64 (USB disconnected) 22.0 mA WCDMA PF = 64 (USB connected) 33.0 mA LTE-FDD PF = 64 (USB disconnected) 24.0 mA LTE-FDD PF = 64 (USB connected) 35.0 mA GSM850 1UL/4DL @ 32.53 dBm 232.0 mA GSM850 2UL/3DL @ 32.34 dBm 384.0 mA GSM850 3UL/2DL @ 30.28 dBm 441.0 mA GSM850 4UL/1DL @ 29.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM850 3UL/2DL @ 26.64 dBm 328.0 mA GSM850 4UL/1DL @ 26.53 dBm 416.0 mA EGSM900 1UL/4DL @ 26.64 dBm 157.0 mA EGSM900 2UL/3DL @ 26.95 dBm 251.0 mA EGSM900 3UL/2DL @ 26.57 dBm 340.0 mA EGSM900 4UL/1DL @ 26.39 dBm 431.0 mA DCS1800 1UL/4DL @ 26.03 dBm 152.0 mA DCS1800 2UL/3DL @ 25.62 dBm 240.0 mA DCS1800 3UL/2DL @ 25.42 dBm 325.0 mA DCS1800 4UL/1DL @ 25.21 dBm 415.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-FDD B4 @ 22.9 dBm 774.0 mA LTE-FDD B5 @ 23.45 dBm 687.0 mA LTE-FDD B7 @ 22.84 dBm 843.0 mA LTE-FDD B8 @ 22.92 dBm 689.0 mA LTE-FDD B28 @ 23.23 dBm 804.0 mA LTE-TDD B40 @ 23.3 dBm 429.0 mA GSM850 PCL5 @ 32.66 dBm 228.0 mA EGSM900 PCL5 @ 32.59 dBm 235.0 mA DCS1800 PCL0 @ 29.72 dBm 178.0 mA PCS1900 PCL0 @ 29.82 dBm 170.0 mA WCDMA B1 @ 23.27 dBm 687.0 mA WCDMA B2 @ 23.38 dBm 668.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD PF = 64 (USB connected) 29.0 mA WCDMA B1 HSDPA @ 22.24 dBm 500.0 mA WCDMA B1 HSUPA @ 22.05 dBm 499.0 mA WCDMA B5 HSDPA @ 22.39 dBm 418.0 mA WCDMA B5 HSUPA @ 22 dBm 486.0 mA LTE-FDD B1 @ 23.28 dBm 707.0 mA LTE-FDD B3 @ 23.36 dBm 782.0 mA LTE-FDD B5 @ 23.32 dBm 588.0 mA LTE-FDD B7 @ 23.08 dBm 692.0 mA LTE-FDD B28A @ 23.37 dBm 752.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD PF = 64 (USB connected) 29.4 mA WCDMA B2 HSDPA @ 22.63 dBm 560.0 mA WCDMA B2 HSUPA @ 22.49 dBm 564.0 mA WCDMA B4 HSDPA @ 22.45 dBm 601.0 mA WCDMA B4 HSUPA @ 22.57 dBm 610.0 mA WCDMA B5 HSDPA @ 22.49 dBm 603.0 mA WCDMA B5 HSUPA @ 22.43 dBm 617.0 mA LTE-FDD B2 @ 22.92 dBm 698.0 mA LTE-FDD B4 @ 23.12 dBm 710.0 mA LTE-FDD B5 @ 22.98 dBm 650.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA PF = 256 (USB disconnected) 1.07 mA WCDMA PF = 512 (USB disconnected) 1.00 mA LTE-FDD PF = 32 (USB disconnected) 2.97 mA LTE-FDD PF = 64 (USB disconnected) 1.93 mA LTE-FDD PF = 128 (USB disconnected) 1.43 mA LTE-FDD PF = 256 (USB disconnected) 1.17 mA WCDMA PF = 64 (USB disconnected) 14.9 mA WCDMA PF = 64 (USB connected) 34.2 mA LTE-FDD PF = 64 (USB disconnected) 15.2 mA LTE-FDD PF = 64 (USB connected) 34.
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LTE Standard Module Series EC25 Series Hardware Design call WCDMA B4 @ 22.74 dBm 581.0 mA WCDMA B5 @ 22.6 dBm 561.0 mA Table 44: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 μA AT+CFUN=0 (USB disconnected) 1.82 mA GSM DRX = 2 (USB disconnected) 2.74 mA GSM DRX = 9 (USB disconnected) 2.0 mA WCDMA PF = 64 (USB disconnected) 2.15 mA WCDMA PF = 128 (USB disconnected) 1.67 mA LTE-FDD PF = 64 (USB disconnected) 2.
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LTE Standard Module Series EC25 Series Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 2DL/3UL @ 29.73 dBm 453.0 mA EGSM900 1DL/4UL @ 28.5 dBm 522 mA DCS1800 4DL/1UL @ 30.49 dBm 172.0 mA DCS1800 3DL/2UL @ 29.24 dBm 274.0 mA DCS1800 2DL/3UL @ 27.15 dBm 337.0 mA DCS1800 1DL/4UL @ 25.88 dBm 406.0 mA EGSM900 4DL/1UL PCL = 8 @ 26.60 dBm 142.0 mA EGSM900 3DL/2UL PCL = 8 @ 25.43 dBm 229.0 mA EGSM900 2DL/3UL PCL = 8 @ 23.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-TDD B40 @ 23.43 dBm 355.0 mA LTE-TDD B41 @ 23.46 dBm 451.0 mA EGSM900 PCL = 5 @ 33.25 dBm 258.0 mA DCS1800 PCL = 0 @ 30.23 dBm 178.0 mA WCDMA B1 @ 23.88 dBm 548.0 mA WCDMA B8 @ 23.8 dBm 615.0 mA Table 45: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 μA AT+CFUN=0 (USB disconnected) 0.9 mA GSM DRX = 2 (USB disconnected) 1.
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LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) LTE-TDD PF = 64 (USB disconnected) 15.0 mA LTE-TDD PF = 64 (USB connected) 36.5 mA EGSM900 4DL/1UL @ 33.02 dBm 270.7 mA EGSM900 3DL/2UL @ 32.24 dBm 444.3 mA EGSM900 2DL/3UL @ 30.08 dBm 509.8 mA EGSM900 1DL/4UL @ 29.50 dBm 629.3 mA DCS1800 4DL/1UL @ 29.63 dBm 157.4 mA DCS1800 3DL/2UL @ 28.96 dBm 246.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-FDD B8 @ 23.49 dBm 607.3 mA LTE-FDD B20 @ 23.01 dBm 711.0 mA LTE-FDD B28A @ 23.18 dBm 788.2 mA LTE-TDD B38 @ 23.38 dBm 446.6 mA LTE-TDD B40 @ 23.56 dBm 344.4 mA LTE-TDD B41 @ 23.17 dBm 483.2 mA EGSM900 PCL = 5 @ 32.81 dBm 262.2 mA DCS1800 PCL = 0 @ 29.62 dBm 151.2 mA WCDMA B1 @ 23.09 dBm 594.2 mA WCDMA B8 @ 23.18 dBm 504.
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LTE Standard Module Series EC25 Series Hardware Design IVBAT LTE data transfer (GNSS OFF) WCDMA voice call WCDMA B4 HSDPA @ 22.5 dBm 578.0 mA WCDMA B4 HSUPA @ 22.5 dBm 571.0 mA WCDMA B5 HSDPA @ 22.4 dBm 499.0 mA WCDMA B5 HSUPA @ 22.17 dBm 515.0 mA LTE-FDD B2 @ 23.2 dBm 685.0 mA LTE-FDD B4 @ 23.4 dBm 744.0 mA LTE-FDD B5 @ 23.2 dBm 578.0 mA LTE-FDD B7 @ 24.3 dBm 868.0 mA LTE-FDD B28 @ 23.45 dBm 631.0 mA LTE-FDD B66 @ 22.68 dBm 781.0 mA WCDMA B2 @ 23.47 dBm 643.
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LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer (GNSS OFF) EDGE data transfer (GNSS OFF) LTE-FDD PF = 64 (USB disconnected) 18.3 mA LTE-FDD PF = 64 (USB connected) 35.1 mA LTE-TDD PF = 64 (USB disconnected) 18.4 mA LTE-TDD PF = 64 (USB connected) 35.1 mA GSM850 4DL/1UL @ 32.48 dBm 240.1 mA GSM850 3DL/2UL @ 31.59 dBm 384.8 mA GSM850 2DL/3UL @ 29.51 dBm 452.1 mA GSM850 1DL/4UL @ 28.41 dBm 542.1 mA EGSM900 4DL/1UL @ 33.27 dBm 272.
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LTE Standard Module Series EC25 Series Hardware Design WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) EGSM900 3DL/2UL @ 26.03 dBm 289.6 mA EGSM900 2DL/3UL @ 23.97 dBm 390.7 mA EGSM900 1DL/4UL @ 22.68 dBm 502.1 mA DCS1800 4DL/1UL @ 26.01 dBm 141.0 mA DCS1800 3DL/2UL @ 25.02 dBm 227.5 mA DCS1800 2DL/3UL @ 23.04 dBm 316.3 mA DCS1800 1DL/4UL @ 22.11 dBm 411.0 mA PCS1900 4DL/1UL @ 26.24 dBm 143.3 mA PCS1900 3DL/2UL @ 25.46 dBm 231.4 mA PCS1900 2DL/3UL @ 23.45 dBm 316.
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LTE Standard Module Series EC25 Series Hardware Design GSM voice call WCDMA voice call LTE-FDD B5 @ 23.12 dBm 563.1 mA LTE-FDD B7 @ 22.95 dBm 702.9 mA LTE-FDD B8 @ 23.55 dBm 728.8 mA LTE-FDD B28 @ 23.23 dBm 769.3 mA LTE-TDD B40 @ 23.54 dBm 335.5 mA GSM850 PCL5 @ 32.36 dBm 240.3 mA EGSM900 PCL5 @ 33.15 dBm 260.9 mA DCS1800 PCL0 @ 29.38 dBm 153.0 mA PCS1900 PCL0 @ 29.47 dBm 160.3 mA WCDMA B1 @ 23.13 dBm 568.9 mA WCDMA B2 @ 22.99 dBm 628.4 mA WCDMA B4 @ 22.90 dBm 506.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD PF = 128 (USB disconnected) 1.68 mA LTE-FDD PF = 256 (USB disconnected) 1.13 mA LTE-FDD PF = 64 (USB disconnected) 18.71 mA LTE-FDD PF = 64 (USB active) 27.74 mA LTE-FDD B2 @ 23.23 dBm 683.1 mA LTE-FDD B4@ 23.67 dBm 725.0 mA LTE-FDD B5 @ 23.39 dBm 582.8 mA LTE-FDD B12 @ 23.55 dBm 667.2 mA LTE-FDD B66 @ 22.94 dBm 729.6 mA LTE-FDD B71 @ 23.03 dBm 712.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B13 @ 22.92 dBm 690.0 mA LTE-FDD B14 @ 23.42 dBm 685.0 mA LTE-FDD B66 @ 23.35 dBm 715.0 mA LTE-FDD B71 @ 23.39 dBm 689.0 mA Conditions Typ. Unit Cold start @ Passive Antenna 54.0 mA Lost state @ Passive Antenna 53.9 mA Instrument Environment 30.5 mA Open Sky @ Passive Antenna 33.2 mA Open Sky @ Active Antenna 40.
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LTE Standard Module Series EC25 Series Hardware Design LTE-TDD bands 23 dBm ±2 dB < -39 dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module.
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LTE Standard Module Series EC25 Series Hardware Design Table 53: EC25-A Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0 dBm / / -104.7 dBm WCDMA B4 -110.0 dBm / / -106.7 dBm WCDMA B5 -110.5 dBm / / -104.7 dBm LTE-FDD B2 (10 MHz) -98.0 dBm -98.0 dBm -101.0 dBm -94.3 dBm LTE-FDD B4 (10 MHz) -97.5 dBm -99.0 dBm -101.0 dBm -96.3 dBm LTE-FDD B12 (10 MHz) -97.2 dBm -98.0 dBm -101.0 dBm -93.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B26 (10 MHz) -99.5 dBm -99.0 dBm -101.5 dBm -93.8 dBm LTE-TDD B41 (10 MHz) -95.0 dBm -95.7 dBm -99.0 dBm -94.3 dBm Table 56: EC25-JL Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B1 (10 MHz) -97.5 dBm -98.7 dBm -100.2 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -97.1 dBm -100.5 dBm -93.3 dBm LTE-FDD B8 (10 MHz) -98.4 dBm -99.0 dBm -101.2 dBm -93.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B3 (10 MHz) -98.7 dBm -98.6 dBm -102.2 dBm -93.3 dBm LTE-FDD B4 (10 MHz) -97.7 dBm -97.4 dBm -100.2 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.2 dBm -101.0 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97.7 dBm -97.7 dBm -101.2 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -99.2 dBm -98.2 dBm -102.2 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.6 dBm -98.7 dBm -102.0 dBm -94.8 dBm LTE-TDD B40 (10 MHz) -97.2 dBm -98.4 dBm -101.
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LTE Standard Module Series EC25 Series Hardware Design Table 60: EC25-AF Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -109.5 dBm -110 dBm -110.4 dBm -104.7 dBm WCDMA B4 -109.6 dBm -110 dBm -110.6 dBm -106.7 dBm WCDMA B5 -110 dBm -110 dBm -110.7 dBm -104.7 dBm LTE-FDD B2 (10 MHz) -98.0 dBm -98.5 dBm -100.5 dBm -94.3 dBm LTE-FDD B4 (10 MHz) -97.5 dBm -98.2 dBm -99.5 dBm -96.3 dBm LTE-FDD B5 (10 MHz) -98.0 dBm -98.5 dBm -100.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B66 (10 MHz) -97.5 dBm -98.5 dBm -99.6 dBm -95.8 dBm LTE-FDD B71 (10 MHz) -98.6 dBm -99.5 dBm -100 dBm -93.5 dBm Table 62: EC25-EU Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -108.5 dBm / / -102.0 dBm DCS1800 -108.5 dBm / / -102.0dbm WCDMA B1 -109.5 dBm -109.5 dBm / -106.7 dBm WCDMA B8 -110.0 dBm -111.5 dBm / -103.7 dBm LTE-FDD B1 (10 MHz) -98.5 dBm -99.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B3 (10 MHz) -96.5 dBm -98.5 dBm -99.5 dBm -93.3 dBm LTE-FDD B7 (10 MHz) -97.0 dBm -94.5 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -97.0 dBm -97.0 dBm -100.0 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97.5 dBm -99.0 dBm -101.5 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.6 dBm -98.7 dBm -101.0 dBm -94.8 dBm LTE-TDD B38 (10 MHz) -96.3 dBm -97 dBm -98.5 dBm -96.3 dBm LTE-TDD B40 (10 MHz) -96.9 dBm -98.0 dBm -99.1 dBm -96.
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LTE Standard Module Series EC25 Series Hardware Design DCS1800 -109.0 dBm / / -102.0 dBm PCS1900 -109.0 dBm / / -102.0 dBm WCDMA B1 -110.0 dBm -109.5 dBm -112 dBm -106.7 dBm WCDMA B2 -110.5 dBm / / -104.7 dBm WCDMA B4 -110.0 dBm -110 dBm -112 dBm -104.7 dBm WCDMA B5 -111.0 dBm -112 dBm -113 dBm -104.7 dBm WCDMA B8 -111.0 dBm -112 dBm -113 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -97.7 dBm -101.2 dBm -96.3 dBm LTE-FDD B2 (10 MHz) -98.5 dBm / / -94.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B3 (10 MHz) -98.4 dBm / / -93.3 dBm LTE-FDD B5 (10 MHz) -99.0dBm / / -94.3 dBm LTE-FDD B7 (10 MHz) -96.5 dBm / / -94.3 dBm LTE-FDD B8 (10 MHz) -98.8 dBm / / -93.3 dBm LTE-FDD B20 (10 MHz) -98.0 dBm / / -93.3 dBm LTE-TDD B38 (10 MHz) -97.3 dBm / / -96.3 dBm LTE-TDD B40 (10 MHz) -97.3 dBm / / -96.3 dBm LTE-TDD B41 (10 MHz) -97.3 dBm / / -94.
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LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B66 (10 MHz) -97.5 dBm -98.5 dBm -99.6 dBm -95.8 dBm LTE-FDD B71 (10 MHz) -98.6 dBm -99.5 dBm -100 dBm -93.5 dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general.
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LTE Standard Module Series EC25 Series Hardware Design ⚫ ⚫ ⚫ ⚫ ⚫ order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected.
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LTE Standard Module Series EC25 Series Hardware Design NOTES 1. 2. The module offers the best performance when the internal BB chip stays below 105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
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LTE Standard Module Series EC25 Series Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified. 7.1.
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LTE Standard Module Series EC25 Series Hardware Design Figure 45: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. 7.2.
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LTE Standard Module Series EC25 Series Hardware Design Figure 46: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard.
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LTE Standard Module Series EC25 Series Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC25 series module. For authentic appearance, please refer to the module received from Quectel.
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LTE Standard Module Series EC25 Series Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series EC25 Series Hardware Design NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120 ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB.
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LTE Standard Module Series EC25 Series Hardware Design Table 69: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 220 °C) 45–70 s Max temperature 238–246 °C Cooling down slope -1 to -4 °C/s Reflow Cycle Max reflow cycle 1 8.3. Packaging 1 0. 0.35±0.05 29.3±0.15 30.3±0.15 ± 50 1. 44.00±0.3 20.20±0.15 44.00±0.1 2.00±0.1 4.00±0.1 30.3±0.
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LTE Standard Module Series EC25 Series Hardware Design 48.5 Cover tape 13 100 Direction of feed 44.5+0.20 -0.
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LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References Table 70: Related Documents SN Document Name Remark [1] Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.
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LTE Standard Module Series EC25 Series Hardware Design CTS Clear to Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation S
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LTE Standard Module Series EC25 Series Hardware Design MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Inpu
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LTE Standard Module Series EC25 Series Hardware Design Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Outp
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LTE Standard Module Series EC25 Series Hardware Design 10 Appendix B GPRS Coding Schemes Table 72: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC25 Series Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC25 Series Hardware Design 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC25_Series_Hardware_Design 136 / 134
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LTE Standard Module Series EC25 Series Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 74: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot MCS-1 GMSK C 8.80 kbps 17.60 kbps 35.20 kbps MCS-2 GMSK B 11.2 kbps 22.4 kbps 44.8 kbps MCS-3 GMSK A 14.8 kbps 29.6 kbps 59.2 kbps MCS-4 GMSK C 17.6 kbps 35.2 kbps 70.4 kbps MCS-5 8-PSK B 22.4 kbps 44.8 kbps 89.6 kbps MCS-6 8-PSK A 29.6 kbps 59.