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SC20 Series

Hardware Design

Smart Module Series

Version: 3.0.0

Date: 2021-07-30

Status: Preliminary

Summary of content (138 pages)

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SC20 Series Hardware Design Smart Module Series Version: 3.0.
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Smart Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
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Smart Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.
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Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
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Smart Module Series About the Document Revision History Version Date Author Description 1.0 2016-04-12 Tony GAO Initial 1.1 2016-05-04 Mark ZHANG 1. Updated RF Receiving Sensitivity 2. Updated Operation Temperature 1.2 2016-07-22 Sea BAI Added Chapters 2.4, 3.6–3.22, 4, 5 and 9 1.3 2016-08-19 Sea BAI Updated Charging Parameters in Table 41 1. 2. 3. 4. 1.4 2017-10-17 Sea BAI/ Beny ZHU/ Jenson WU 5. 6. 7. 8. 9. 1.5 2018-09-27 Camphor DUAN/ Ted ZHOU SC20_Series_Hardware_Design 1.
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Smart Module Series 3. Added the description that the GPIO_68 and GPIO_88 cannot be pulled up during start-up in Table 9 and Chapter 3.14. 4. Updated the turning on timing of the module (Figure 8). 5. Added the description for SPI interface in Chapter 3.14. 6. Added the description that the effective resolution of ADC interfaces is 12 bits in Chapter 3.16. 7. Added the current consumption of SC20-EU in Table 55. 8. Updated the RF receiving sensitivity of SC20-A, SC20-AU and SC20-J in Table 59, 60 and 61.
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Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents .......................................................................................................................................................
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Smart Module Series 3.21. Sensor Interfaces..................................................................................................................... 63 3.22. Audio Interfaces ....................................................................................................................... 64 3.22.1. Reference Circuit Design for Microphone Interface....................................................... 65 3.22.2. Reference Circuit Design for Earpiece Interface .............................
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Smart Module Series 9 Storage, Manufacturing and Packaging ........................................................................................ 127 9.1. Storage Conditions ................................................................................................................ 127 9.2. Manufacturing and Soldering ................................................................................................ 128 9.3. Packaging Specification.......................................................
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Smart Module Series Table Index Table 1: SC20-CE R1.1/-CEL R1.1 Frequency Bands .............................................................................. 14 Table 2: SC20-E/-EL/-EX Frequency Bands .............................................................................................. 15 Table 3: SC20-A/-AL/-AX Frequency Bands .............................................................................................. 15 Table 4: SC20-AU/-AUL Frequency Bands ...................................
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Smart Module Series Table 42: Wi-Fi/Bluetooth Frequency ......................................................................................................... 80 Table 43: Pin Definition of GNSS Antenna Interface ................................................................................. 81 Table 44: GNSS Frequency ....................................................................................................................... 82 Table 45: Antenna Requirements ...............................
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Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 21 Figure 2: Pin Assignment (Top View) ......................................................................................................... 23 Figure 3: Voltage Drop Sample ..................................................................................................................
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Smart Module Series Figure 42: Module Top and Side Dimensions .......................................................................................... 123 Figure 43: Module Bottom Dimensions (Top View).................................................................................. 124 Figure 44: Recommended Footprint (Top View) ...................................................................................... 125 Figure 45: Top and Bottom Views of the Module ........................................
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Smart Module Series 1 Introduction This document defines SC20 series module and its air interfaces and hardware interfaces which are related to your application. This document helps you quickly understand module interface specifications, electrical and mechanical details as well as other related information of the module. Associated with application notes and user guides, you can use the module to design and set up mobile applications easily. Hereby, [Quectel Wireless Solutions Co., Ltd.
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Smart Module Series 2 Product Overview 2.1. General Description SC20 is a series of Smart LTE modules based on Android/Linux operating systems, which provide industrial grade performance. Its general features are listed below:        Supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and Bluetooth 4.2 LE.
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Smart Module Series GSM 900/1800 MHz Wi-Fi 802.11a/b/g/n 2400–2482 MHz 5180–5825 MHz Bluetooth 2402–2480 MHz GNSS GPS/Galileo: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Table 2: SC20-E/-EL/-EX Frequency Bands Mode Frequency LTE-FDD B1/B3/B5/B7/B8/B20 LTE-TDD B38/B40/B41 WCDMA B1/B5/B8 GSM 850/900/1800/1900 MHz Wi-Fi 802.11a/b/g/n 2400–2482 MHz 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GNSS GPS: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.
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Smart Module Series BeiDou: 1561.098 ±2.046 MHz Table 4: SC20-AU/-AUL Frequency Bands Mode Frequency LTE-FDD B1/B3/B5/B7/B8/B28 LTE-TDD B40 WCDMA B1/B2/B5/B8 GSM 850/900/1800/1900 MHz Wi-Fi 802.11a/b/g/n 2400–2482 MHz 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GNSS GPS/Galileo: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Table 5: SC20-J/-JL Frequency Bands Mode Frequency LTE-FDD B1/B3/B8/B18/B19/B26 LTE-TDD B41 WCDMA B1/B6/B8/B19 Wi-Fi 802.
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Smart Module Series Table 6: SC20-EU Frequency Bands Type Frequency LTE-FDD B1/B2/B3/B5/B7/B8/B20/B28A LTE-TDD B38 WCDMA B1/B2/B5/B8 GSM 850/900/1800/1900 MHz Wi-Fi 802.11a/b/g/n 2400–2482 MHz 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GNSS GPS/Galileo: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz SC20 is a series of SMD type modules, which can be embedded into applications through its 210-pin pads including 146 LCC pads and 64 LGA pads.
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Smart Module Series Memory SC20-CE R1.1/-CEL R1.1, SC20-E/-EL, SC20-A/-AL, SC20-AU/-AUL, SC20-J/-JL, SC20-EU: 8 GB eMMC + 1 GB LPDDR3 (default) 16 GB eMMC + 2 GB LPDDR3 (optional) SC20-AX, SC20-EX: 4 Gb NAND + 4 Gb LPDDR2 Operating System Android/Linux Power Supply Supply voltage: 3.5–4.2 V Typical supply voltage: 3.
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Smart Module Series Downlink coding schemes: MCS 1–9 Uplink coding schemes: MCS 1–9 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) WLAN Features Supports 2.4 GHz and 5 GHz frequency bands Supports 802.11a/b/g/n, maximally up to 150 Mbps Supports AP and STA modes Bluetooth Feature Bluetooth 4.2 LE GNSS Features GPS/BeiDou/GLONASS or GPS/BeiDou/Galileo SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default LCM Interface Supports one 4-lane MIPI_DSI, up to 1.
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Smart Module Series  baud rate up to 4 Mbps UART2: 2-wire UART interface used for debugging Motor Drive Interface Drives ERM motor SD Card Interface Supports SD 3.0, 4-bit SDIO Supports SD card hot-plug I2C Interfaces Three I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc.
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Smart Module Series -- I2C interfaces -- ADC interfaces -- LCM (MIPI) interface -- Touch panel (TP) interface -- Camera (MIPI) interfaces -- Audio interfaces Figure 1: Functional Diagram 2.4. EVB To help you develop applications with the module, Quectel supplies the evaluation board (Smart EVB), USB to RS-232 converter cable, USB data cable, power adapter, earphone, antenna and other peripherals to control or test the module. For more details, see document [1].
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Smart Module Series 3 Application Interfaces 3.1. General Description SC20 is a series of SMD type modules with 146 LCC pads and 64 LGA pads. The following chapters provide the detailed description of pins/interfaces listed below.
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Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of SC20 series. Figure 2: Pin Assignment (Top View) NOTE As for SC20-AX/EX, pins 105, 116, 117, 118, 119 are GPIO_15, GPIO_3, GPIO_2, GPIO_1 and GPIO_0 respectively.
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Smart Module Series 3.3. Pin Description Table 8: I/O Parameters Definition Type Description AI Analog Input AO Analog Output AIO Analog Input/Output DI Digital Input DO Digital Output DIO Digital Input/Output OD Open drain PI Power Input PO Power Output PIO Power Input/Output The following table shows the pin definition and electrical characteristics of SC20 series. Table 9: Pin Description Power Supply Pin Name Pin No.
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Smart Module Series LDO5_1V8 LDO6_1V8 LDO17_2V85 111 125 129 PO PO PO 1.8 V output 1.8 V output 2.85 V output Vnom = 1.8 V IOmax = 20 mA Power supply for external GPIO’s pull-up and level shift circuits. Vnom = 1.8 V IOmax = 100 mA Power supply for peripherals. If it is used, connect an external 2.2–4.7 μF capacitor to this pin in parallel. If it is not used, keep it open. Vnom = 2.85 V IOmax = 300 mA Power supply for peripherals. If it is used, connect an external 2.2–4.
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Smart Module Series SPKP 10 AO Speaker output (+) SPKN 11 AO Speaker output (-) HPH_R 136 AO Headphone right channel output HPH_GND 137 AI Headphone reference ground HPH_L 138 AO Headphone left channel output HS_DET 139 AI Headset hot-plug detect Pin Name Pin No. I/O Description DC Characteristics USB_VBUS 141, 142 PI USB 5 V power input and USB insertion detection Vmax = 6.3 V Vmin = 4.35 V Vnom = 5.0 V USB_DM 13 AIO USB 2.
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Smart Module Series USIM2_DATA USIM2_VDD 20 21 DIO PO (U)SIM2 card data (U)SIM2 card power supply USIM1_DETECT 22 DI (U)SIM1 card hot-plug detect USIM1_RST 23 DO (U)SIM1 card reset USIM1_CLK 24 DO (U)SIM1 card clock USIM1_DATA USIM1_VDD 25 26 DIO PO (U)SIM1 card data (U)SIM1 card power supply VILmax = 0.2 × USIM2_VDD VIHmin = 0.7 × USIM2_VDD VOLmax = 0.4 V VOHmin = 0.8 × USIM2_VDD For 1.8 V (U)SIM: Vmax = 1.85 V Vmin = 1.75 V For 2.95 V (U)SIM: Vmax = 3.1V Vmin = 2.
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Smart Module Series UART1_RX UART1_CTS UART1_RTS 35 36 37 VILmax = 0.63 V VIHmin = 1.17 V If unused, keep these pins open. VILmax = 0.63 V VIHmin = 1.17 V Connect to DTE’S CTS; 1.8 V power domain. If unused, keep these pins open. DO DTE request to send signal to DCE VOLmax = 0.45 V VOHmin = 1.35 V Connect to DTE’S RTS; 1.8 V power domain. If unused, keep these pins open. VILmax = 0.63 V VIHmin = 1.
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Smart Module Series 2.95 V SD card: VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V SD_DATA2 43 DIO SDIO data bit 2 SD_DATA3 44 DIO SDIO data bit 3 SD_DET 45 DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel (TP) Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT 30 DI TP interrupt VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Active low.
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Smart Module Series MIPI_DSI_LN1P 57 AO LCD MIPI data 1 (+) MIPI_DSI_LN2N 58 AO LCD MIPI data 2 (-) MIPI_DSI_LN2P 59 AO LCD MIPI data 2 (+) MIPI_DSI_LN3N 60 AO LCD MIPI data 3 (-) MIPI_DSI_LN3P 61 AO LCD MIPI data 3 (+) Pin Name Pin No.
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Smart Module Series CAM1_RST 81 DO Reset of front camera CAM1_PWD 82 DO Power down of front camera CAM_I2C_SCL 83 OD I2C clock of camera 1.8 V power domain. CAM_I2C_SDA 84 OD I2C data of camera 1.8 V power domain. Pin Name Pin No. I/O Description PWRKEY 114 DI Turns on/off the module KEY_VOL_UP 95 DI Volume up KEY_VOL_DOWN 96 DI Volume down Keypad Interfaces DC Characteristics Comment Internally pulled up to 1.8 V. Active low. VILmax = 0.63 V VIHmin = 1.
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Smart Module Series Pin Name Pin No. I/O Description ANT_MAIN 87 AIO Main antenna interface ANT_DRX 131 AI Rx-diversity antenna interface ANT_GNSS 121 AI GNSS antenna interface ANT_WIFI/BT 77 AIO Wi-Fi/Bluetooth antenna interface Pin Name Pin No.
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Smart Module Series GPIO_98 106 DIO General-purpose input/output GPIO_94 107 DIO General-purpose input/output GPIO_36 108 DIO General-purpose input/output GPIO_65 109 DIO General-purpose input/output GPIO_96 110 DIO General-purpose input/output GPIO_58 112 DIO General-purpose input/output GPIO_99 113 DIO General-purpose input/output GPIO_95 115 DIO General-purpose input/output 116 3 DIO General-purpose input/output 117 3 DIO General-purpose input/output 118 3 DIO Gen
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Smart Module Series RESET_N USB_BOOT CHARGE_SEL 179 46 127 DI DI DI Resets the module Disabled by default and can be enabled through software configuration. Forces the module to enter emergency download mode You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. Charger select If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. Reserved Pins Pin Name Pin No.
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Smart Module Series below 3.1 V. Figure 3: Voltage Drop Sample To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip capacitor (MLCC) should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins.
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Smart Module Series 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of module largely depends on the power source. The power supply of SC20 series should be able to provide enough current of at least 3 A. If the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply power for the module.
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Smart Module Series Figure 6: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Using Keystroke The turning on scenario is illustrated in the following figure.
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Smart Module Series Figure 8: Timing of Turning on Module NOTE 1. When the module is powered on for the first time, its timing of turning on will be 45 ms longer than that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY pin. The recommended time between them is no less than 30 ms. PWRKEY pin cannot be pulled down all the time. 3.5.2. Turn off Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up.
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Smart Module Series Figure 9: Timing of Turning off Module 3.6. VRTC Interface The RTC can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be a capacitor or rechargeable battery (such as coil cells) according to application demands. The following are some reference circuit designs when an external battery or capacitor is utilized for powering RTC.
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Smart Module Series If RTC is ineffective, it can be synchronized through network after the module is powered on.     The input voltage range is 2.0–3.25 V and the typical value is 3.0 V for VRTC. When VBAT is disconnected, the average consumption is about 5 μA. When powered by VBAT, the RTC error is 50 ppm. When powered by VRTC, the RTC error is 200 ppm. If a rechargeable battery is used, the ESR of the battery should be less than 2 kΩ, and it is recommended to use the MS621FE-FL11E of SEIKO.
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Smart Module Series    Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.8 V and 3.2 V, the charging current can be set to 450 mA maximally. Constant current mode (CC mode): When the battery is increased to between 3.2 V and 4.2 V, the system will switch to CC mode. The maximum charging current is 1.
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Smart Module Series 3.9. USB Interface SC20 series contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin Name Pin No.
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Smart Module Series 7 6 GND GND 9 GND 8 GND The following are two USB interface reference designs for you to choose from. Figure 13: USB Interface Reference Design (OTG is not Supported) Figure 14: USB Interface Reference Design (OTG is Supported) SC20 series supports OTG protocol. If OTG function is needed, see the above figure for the reference design. AW3605DNR is a high efficiency DC-DC chip manufactured by AWINIC, and you can also choose a suitable one according to your own demands.
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Smart Module Series In order to ensure USB performance, comply with the following principles while designing USB interface.     Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace is 90 Ω. Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2 pF.
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Smart Module Series If unused, keep these pins open. UART2_RX 93 DI UART2 receive; Debug port by default UART2_TX 94 DO UART2 transmit; Debug port by default 1.8 V power domain. If it is unused, keep it open. UART1 provides 1.8 V logic level. A level translator should be used if your application is equipped with a 3.3 V UART interface. A level translator TXS0104PWR provided by Texas Instruments is recommended. The following figure shows the reference design.
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Smart Module Series NOTE UART2 is similar to UART1. For the reference design, see that of UART1. 3.11. (U)SIM Interfaces SC20 series provides two (U)SIM interfaces which meet ETSI and IMT-2000 requirements. Dual SIM Card Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM card is powered by the internal power supply of the module. Table 14: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Active low.
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Smart Module Series SC20 series supports (U)SIM card hot-plug via the USIM_DETECT pin. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 17: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If there is no need to use USIM_DETECT for (U)SIM card hot-plug, keep it open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector.
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Smart Module Series    To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50 pF. 22 Ω resistors should be added in series between the module and (U)SIM card to suppress EMI spurious transmission and enhance ESD protection.
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Smart Module Series A reference circuit for SD card interface is shown below. Figure 19: Reference Circuit for SD Card Interface SD_LDO11 is the power supply for the external SD card. The maximum drive current is about 600 mA. Because of the high drive current, it is recommended that the trace width is 0.6 mm or more. In order to ensure the stability of drive power, a 2.2 μF capacitor should be added in parallel near the SD card connector.
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Smart Module Series 43 SD_DATA2 14.53 44 SD_DATA3 14.57 3.13. GPIO Interfaces SC20 series has abundant GPIO interfaces with logic level of 1.8 V. The pin definition is listed below. Table 17: Pin Definition of GPIO Interfaces 4 Pin No. Pin Name GPIO No.
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Smart Module Series 79 CAM0_RST GPIO_35 B-PD: nppukp Wakeup 80 CAM0_PWD GPIO_34 B-PD: nppukp Wakeup 81 CAM1_RST GPIO_28 B-PD: nppukp Wakeup 82 CAM1_PWD GPIO_33 B-PD: nppukp 83 CAM_I2C_SCL GPIO_30 B-PD: nppukp 84 CAM_I2C_SDA GPIO_29 B-PD: nppukp 90 GPIO_32 GPIO_32 B-PD: nppukp 91 SENSOR_I2C_SCL GPIO_7 B-PD: nppukp 92 SENSOR_I2C_SDA GPIO_6 B-PD: nppukp 93 UART2_RX GPIO_5 B-PD: nppukp 94 UART2_TX GPIO_4 B-PD: nppukp 95 KEY_VOL_UP GPIO_90 B-PD: nppukp Wakeup
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Smart Module Series GPIO_15 GPIO_15 106 GPIO_98 GPIO_98 B-PD: nppukp Wakeup 107 GPIO_94 GPIO_94 B-PD: nppukp Wakeup 108 GPIO_36 GPIO_36 B-PD: nppukp Wakeup 109 GPIO_65 GPIO_65 B-PD: nppukp Wakeup 110 GPIO_96 GPIO_96 B-PD: nppukp Wakeup 112 GPIO_58 GPIO_58 B-PD: nppukp Wakeup 113 GPIO_99 GPIO_99 B-PD: nppukp 115 GPIO_95 GPIO_95 B-PD: nppukp GPIO_11 GPIO_11 116 7 117 Wakeup Wakeup B-PD: nppukp GPIO_3 GPIO_3 GPIO_10 GPIO_10 GPIO_2 GPIO_2 GPIO_9 GPIO_9 7 B-
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Smart Module Series master mode. Table 18: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment IO SPI master-out slave-in Can be multiplexed into SPI_MOSI. 118 8 IO SPI master-in slave-out Can be multiplexed into SPI_MISO. 117 8 DO SPI chip select Can be multiplexed into SPI_CS_N. 116 8 DO SPI clock Can be multiplexed into SPI_CLK. GPIO_8 119 8 GPIO_0 GPIO_9 GPIO_1 GPIO_10 GPIO_2 GPIO_11 GPIO_3 3.15.
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Smart Module Series SENSOR_I2C_SCL SENSOR_I2C_SDA 91 92 OD I2C clock signal for external sensor OD I2C data signal for external sensor Used for external sensor 3.16. ADC Interfaces SC20 series provides three analog-to-digital converter (ADC) interfaces, and the pin definition is shown below. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC 128 AI General purpose ADC Maximum input voltage: 1.7 V.
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Smart Module Series Table 21: Pin Definition of Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV 28 PO Motor drive Connect it to the negative pole of the motor. The motor is driven by an exclusive circuit, and the reference circuit design is shown below. Figure 20: Reference Circuit for Motor Connection When the motor stops, the redundant electricity can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18.
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Smart Module Series LCD_RST 49 DO LCD reset 1.8 V power domain. Active low. LCD_TE 50 DI LCD tearing effect 1.8 V power domain.
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Smart Module Series Figure 21: Reference Circuit Design for LCM Interface MIPI are high speed signal lines. It is recommended that common-mode filters should be added in series near the LCM connector, to improve protection against electromagnetic radiation interference. ICMEF112P900MFR from ICT is recommended.
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Smart Module Series 3.19. Touch Panel Interface SC20 series provides an I2C interface for connection with Touch Panel (TP), and it also provides the corresponding power supply and interrupt pins. The pin definition of TP interface is illustrated below. Table 23: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment Vnom = 1.8 V IOmax = 100 mA LDO6_1V8 125 PO 1.8 V output power supply for TP I/O power domain and I2C pull-up circuit LDO17_2V85 129 PO 2.
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Smart Module Series 3.20. Camera Interfaces Based on standard MIPI_CSI video input interface, SC20 series supports two cameras (2-lane + 1-lane), and the maximum pixel of the rear camera can be up to 8 MP. The video and photo quality are determined by various factors such as the camera sensor, camera lens quality, etc. It is recommended to select a proper camera model, according to the specification of cameras verified and recommended by Quectel.
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Smart Module Series CAM0_RST 79 DO Reset of rear camera CAM0_PWD 80 DO Power down of rear camera CAM_I2C_SCL 83 OD I2C clock of camera CAM_I2C_SDA 84 OD I2C data of camera 6 6 6 5 5 5 The following is a reference circuit design for rear camera interface, by taking the connection with T4KA3 camera as an example. Figure 24: Reference Circuit Design for Rear Camera Interface NOTE DVDD_1V2 is used to power the rear camera core, and VDD_AF_2V8 is used to power the rear camera AF circuit.
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Smart Module Series The pin definition of front camera interface is shown below. Table 25: Pin Definition of Front Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO 1.8 V output power supply for DOVDD of camera Vnom = 1.8 V IOmax = 100 mA LDO17_2V85 129 PO 2.85 V output power supply for AVDD of camera Vnom = 2.
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Smart Module Series Figure 25: Reference Circuit Design for Front Camera Interface 3.20.3. Design Considerations     Special attention should be paid to the definition of video device interfaces in schematic design. Different video devices will have varied definitions for their corresponding connectors. Ensure the device and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate of up to 1.5 Gbps.
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Smart Module Series Table 26: MIPI Trace Length Inside the Module Pin No. Pin Name Length (mm) 52 MIPI_DSI_CLKN 7.08 53 MIPI_DSI_CLKP 6.45 54 MIPI_DSI_LN0N 6.15 Length Difference (P-N) -0.63 -0.30 55 MIPI_DSI_LN0P 5.85 56 MIPI_DSI_LN1N 6.64 57 MIPI_DSI_LN1P 6.60 58 MIPI_DSI_LN2N 8.20 -0.04 0.74 59 MIPI_DSI_LN2P 8.94 60 MIPI_DSI_LN3N 9.28 61 MIPI_DSI_LN3P 10.24 63 MIPI_CSI0_CLKN 10.55 0.96 0.54 64 MIPI_CSI0_CLKP 11.09 65 MIPI_CSI0_LN0N 12.
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Smart Module Series gravity sensor, and gyroscopic sensors. Verified sensor models by Quectel include: BST-BMA223, STK3311-WV, MPU-6881 and MMC35240PJ. Table 27: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor 1.8 V power domain. SENSOR_I2C_SDA 92 OD I2C data for external sensor 1.8 V power domain.
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Smart Module Series SPKP 10 AO Speaker output (+) SPKN 11 AO Speaker output (-) HPH_R 136 AO Headphone right channel output HPH_GND 137 AI Headphone reference ground HPH_L 138 AO Headphone left channel output HS_DET 139 AI Headset hot-plug detect     High level by default. The module offers two audio input channels which are both single-ended channels. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well.
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Smart Module Series 3.22.2. Reference Circuit Design for Earpiece Interface C2 33 pF F1 EARP C1 0R 33 pF F2 EARN 0R C3 Module D1 D2 33 pF Figure 27: Reference Circuit Design for Earpiece Interface 3.22.3.
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Smart Module Series 3.22.4. Reference Circuit Design for Loudspeaker Interface Figure 29: Reference Circuit Design for Loudspeaker Interface 3.22.5. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900.
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Smart Module Series 3.23. Emergency Download Interface USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO5_1V8 during power-up. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design.
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Smart Module Series 4 Wi-Fi and Bluetooth SC20 series provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance is 50 Ω. External antennas such as PCB antenna, sucker antenna and ceramic antenna can be connected to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi Overview SC20 series module supports 2.4 GHz and 5 GHz dual-band WLAN wireless communication based on IEEE 802.11a/b/g/n standard protocols.
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Smart Module Series 802.11n HT20 MCS7 13 dBm ±2.5 dB 802.11n HT40 MCS0 14 dBm ±2.5 dB 802.11n HT40 MCS7 13 dBm ±2.5 dB WLAN 5.2GHz WLAN 5.3GHz WLAN 5.3GHz WLAN 5.8GHz Mode Output Power 802.11a 11 dBm ±2 dB 802.11n-HT20 12 dBm ±2 dB 802.11n-HT40 11 dBm ±2.5 dB 802.11a 11 dBm ±2.5 dB 802.11n-HT20 12 dBm ±2 dB 802.11n-HT40 11 dBm ±2.5 dB 802.11a 11 dBm ±2 dB 802.11n-HT20 11 dBm ±2.5 dB 802.11n-HT40 10 dBm ±2.5 dB 802.11a 10 dBm ±2.5 dB 802.11n-HT20 10 dBm ±2 dB 802.
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Smart Module Series 802.11n HT20 MCS7 -72 dBm 802.11n HT40 MCS0 -87 dBm 802.11n HT40 MCS7 -68 dBm 802.11a 6 Mbps -90 dBm 802.11a 54 Mbps -71 dBm 802.11n HT20 MCS0 -88 dBm 802.11n HT20 MCS7 -69 dBm 802.11n HT40 MCS0 -86 dBm 802.11n HT40 MCS7 -66 dBm 5 GHz Referenced specifications are listed below:   IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.
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Smart Module Series 2.0 + EDR 3 Mbit/s > 80 kbit/s 3.0 + HS 24 Mbit/s Reference 3.0 + HS 4.2 24 Mbit/s Reference 4.2 LE Referenced specifications are listed below:   Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.2.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC20 series.
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Smart Module Series 5 GNSS SC20 series integrates a IZat™ GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS/BeiDou/GLONASS or GPS/BeiDou/Galileo. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the SC20 series in conduction mode. Table 33: GNSS Performance Parameter Sensitivity TTFF Static Drift Description Typ.
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Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:      Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference.
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Smart Module Series 6 Antenna Interfaces SC20 series provides four antenna interfaces for the main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/Bluetooth antenna, respectively. The antenna ports have an impedance of 50 Ω. 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No.
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Smart Module Series LTE-FDD B1 2110–2170 1920–1980 MHz LTE-FDD B3 1805–1880 1710–1785 MHz LTE-FDD B5 869–894 824–849 MHz LTE-FDD B8 925–960 880–915 MHz LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B39 1880–1920 1880–1920 MHz LTE-TDD B40 2300–2400 2300–2400 MHz 2555–2655 2555–2655 MHz LTE-TDD B41 9 Table 36: SC20-E/-EL/-EX Operating Frequencies 9 3GPP Band Receive Transmit Unit GSM850 869–894 824–849 MHz EGSM900 925–960 880–915 MHz DCS1800 1805–1880 1710–1785
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Smart Module Series LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B40 2300–2400 2300–2400 MHz 2555–2655 2555–2655 MHz LTE-TDD B41 10 Table 37: SC20-A/-AL/-AX Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869–894 824–849 MHz PCS1900 1930–1990 1850–1910 MHz WCDMA B1 2110–2170 1920–1980 MHz WCDMA B2 1930–1990 1850–1910 MHz WCDMA B4 2110–2155 1710–1755 MHz WCDMA B5 869–894 824–849 MHz WCDMA B8 925–960 880–915 MHz LTE-FDD B2 1930–1990 1850–1910 MHz L
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Smart Module Series Table 38: SC20-AU/-AUL Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869–894 824–849 MHz EGSM900 925–960 880–915 MHz DCS1800 1805–1880 1710–1785 MHz PCS1900 1930–1990 1850–1910 MHz WCDMA B1 2110–2170 1920–1980 MHz WCDMA B2 1930–1990 1850–1910 MHz WCDMA B5 869–894 824–849 MHz WCDMA B8 925–960 880–915 MHz LTE-FDD B1 2110–2170 1920–1980 MHz LTE-FDD B3 1805–1880 1710–1785 MHz LTE-FDD B5 869–894 824–849 MHz LTE-FDD B7 2620–2690
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Smart Module Series LTE-FDD B8 925–960 880–915 MHz LTE-FDD B18 860–875 815–830 MHz LTE-FDD B19 875–890 830–845 MHz LTE-FDD B26 859–894 814–849 MHz 2545–2655 2545–2655 MHz LTE-TDD B41 11 Table 40: SC20-EU Module Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869–894 824–849 MHz EGSM900 925–960 880–915 MHz DCS1800 1805–1880 1710–1785 MHz PCS1900 1930–1990 1850–1910 MHz WCDMA B1 2110–2170 1920–1980 MHz WCDMA B2 1930–1990 1850–1910 MHz WCDMA B5 86
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Smart Module Series 6.1.2. Main and Rx-diversity Antenna Interfaces Reference Design A reference circuit design for main and Rx-diversity antenna interfaces is shown below. Reserve a π-type matching circuit for each antenna to achieve better RF performance, and place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 Ω.
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Smart Module Series 5180–5825 Bluetooth 4.2 LE 2402–2480 MHz NOTE The supported Wi-Fi frequencies of SC20-J/-JL are 2400–2496 MHz and 5180–5825 MHz. A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. A π-type matching circuit should be reserved for better RF performance. The π-type matching components (R1, C1, C2) should be placed as close to the antenna as possible and are mounted according to the actual debugging.
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Smart Module Series Table 44: GNSS Frequency Type Frequency Unit GPS/Galileo 1575.42 ±1.023 MHz GLONASS 1597.5–1605.8 MHz BeiDou 1561.098 ±2.046 MHz 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below.
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Smart Module Series Figure 34: Reference Circuit Design for GNSS Active Antenna 6.4. Reference Design for RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
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Smart Module Series Figure 36: Coplanar Waveguide Design on a 2-layer PCB Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) SC20_Series_Hardware_Design 84 / 133
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Smart Module Series In order to ensure RF performance and reliability, follow the principles below in RF layout design:       Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. Keep the distance between the RF pins and the RF connector as short as possible. Change all the right-angle traces to curved ones and the recommended trace angle is 135°.
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Smart Module Series Cable Insertion Loss: < 1 dB (GSM850, EGSM900, WCDMA B5/B6/B8/B19, EVDO/CDMA BC0, LTE-FDD B5/B8/B12/B13/B18/B19/B20/B26/B28) Cable Insertion Loss: < 1.5 dB (DCS1800, PCS1900, WCDMA B1/B2/B4, TD-SCDMA B34/B39, LTE-FDD B1/B2/B3/B4/B25, LTE-TDD B39) Cable Insertion Loss: < 2 dB (LTE-FDD B7, LTE-TDD B38/B40/B41) Wi-Fi/Bluetooth GNSS 12 VSWR: ≤ 2 Gain: Bluetooth/WLAN 2.4G Antenna:0.47dBi WLAN 5.2G Antenna: -0.67 dBi WLAN 5.3G Antenna: -0.19 dBi WLAN 5.5G Antenna: 1.28 dBi WLAN 5.
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Smart Module Series Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of the mated connector.
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Smart Module Series Figure 41: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.
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Smart Module Series 7 Reliability, Radio and Electrical Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 46: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT -0.5 6 V USB_VBUS -0.5 16 V Peak Current of VBAT 0 3 A Voltage on Digital Pins -0.3 2.3 V 7.2.
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Smart Module Series IVBAT Peak supply current (during transmission slot) USB_VBUS VRTC Maximum power control level at EGSM900. - 1.8 3.0 A USB detection 4.35 5.0 6.3 V Power supply voltage of the backup battery 2.0 3.0 3.25 V 7.3. Charging Performance Specifications Table 48: Charging Performance Specifications Parameter Min. Typ. Max. Unit Trickle charging-A current 81 90 99 mA Trickle charging-A threshold voltage range (15.62 mV steps) 2.5 2.796 2.
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Smart Module Series 7.4. Operating and Storage Temperatures The operating temperature is listed in the following table. Table 49: Operating and Storage Temperatures Parameter Operating temperature range 13 Storage Temperature Range Min. Typ. Max. Unit -35 +25 +75 ºC -40 - +90 ºC 7.5. Power Consumption The values of current consumption are shown below. Table 50: SC20-CE R1.1/-CEL R1.1 Current Consumption Description Conditions Typ.
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Smart Module Series supply current LTE-TDD supply current GSM voice call EVDO/CDMA voice call @ DRX = 5 Sleep (USB disconnected) @ DRX = 6 3.83 mA Sleep (USB disconnected) @ DRX = 7 3.02 mA Sleep (USB disconnected) @ DRX = 8 2.65 mA Sleep (USB disconnected) @ DRX = 5 5.49 mA Sleep (USB disconnected) @ DRX = 6 3.87 mA Sleep (USB disconnected) @ DRX = 7 3.05 mA Sleep (USB disconnected) @ DRX = 8 2.67 mA EGSM900 PCL = 5 @ 31.84 dBm 290 mA EGSM900 PCL = 12 @ 18.
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Smart Module Series EVDO/CDMA data transfer WCDMA data transfer DCS1800 (2UL/3DL) @ 24.74 dBm 270 mA DCS1800 (3UL/2DL) @ 24.54 dBm 360 mA DCS1800 (4UL/1DL) @ 24.44 dBm 450 mA BC0 (max power) @ 23.68 dBm 560 mA B1 (HSDPA) @ 21.64 dBm 540 mA B8 (HSDPA) @ 21.61 dBm 540 mA B1 (HSUPA) @ 21.36 dBm 560 mA B8 (HSUPA) @ 21.56 dBm 550 mA LTE-FDD B1 @ 22.96 dBm 750 mA LTE-FDD B3 @ 22.95 dBm 700 mA LTE-FDD B5 @ 22.90 dBm 680 mA LTE-FDD B8 @ 23.17 dBm 680 mA LTE-TDD B38 @ 22.
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Smart Module Series LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) @ DRX = 7 2.35 mA Sleep (USB disconnected) @ DRX = 8 2.01 mA Sleep (USB disconnected) @ DRX = 9 1.85 mA Sleep (USB disconnected) @ DRX = 5 5.51 mA Sleep (USB disconnected) @ DRX = 6 3.56 mA Sleep (USB disconnected) @ DRX = 7 2.62 mA Sleep (USB disconnected) @ DRX = 8 2.14 mA Sleep (USB disconnected) @ DRX = 5 5.93 mA Sleep (USB disconnected) @ DRX = 6 3.
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Smart Module Series WCDMA voice call PCS1900 PCL = 7 @ 16.72 dBm 151.3 mA PCS1900 PCL = 15 @ 0.98 dBm 130.0 mA B1 (max power) @ 23.18 dBm 544.1 mA B5 (max power) @ 23.22 dBm 513.5 mA B8 (max power) @ 23.29 dBm 522.7 mA GSM850 (1UL/4DL) @ 33.12 dBm 265.9 mA GSM850 (2UL/3DL) @ 33.02 dBm 435.1 mA GSM850 (3UL/2DL) @ 30.50 dBm 478.8 mA GSM850 (4UL/1DL) @ 29.49 dBm 564.0 mA EGSM900 (1UL/4DL) @ 33.10 dBm 272.7 mA EGSM900 (2UL/3DL) @ 33.00 dBm 445.0 mA EGSM900 (3UL/2DL) @ 30.
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Smart Module Series WCDMA data transfer LTE data transfer EGSM900 (1UL/4DL) @ 27.05 dBm 182 mA EGSM900 (2UL/3DL) @ 27.13 dBm 177.4 mA EGSM900 (3UL/2DL) @ 27.28 dBm 278.3 mA EGSM900 (4UL/1DL) @ 27.19 dBm 371.0 mA DCS1800 (1UL/4DL) @ 26.04 dBm 170.6 mA DCS1800 (2UL/3DL) @ 25.98 dBm 260.5 mA DCS1800 (3UL/2DL) @ 25.71 dBm 349.8 mA DCS1800 (4UL/1DL) @ 25.46 dBm 440.2 mA PCS1900 (1UL/4DL) @ 26.14 dBm 171.0 mA PCS1900 (2UL/3DL) @ 26.11 dBm 260.5 mA PCS1900 (3UL/2DL) @ 26.
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Smart Module Series LTE-TDD B40 @ 23.17 dBm 427 mA LTE-TDD B41 @ 23.19 dBm 455 mA Table 52: SC20-EX Current Consumption Description Conditions Typ. Unit OFF state Power down 7 μA Sleep (USB disconnected) @ DRX = 2 4.524 mA Sleep (USB disconnected) @ DRX = 5 3.212 mA Sleep (USB disconnected) @ DRX = 9 2.873 mA Sleep (USB disconnected) @ DRX = 6 4.211 mA Sleep (USB disconnected) @ DRX = 7 3.195 mA Sleep (USB disconnected) @ DRX = 8 2.
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Smart Module Series WCDMA voice call GPRS data transfer GSM850 PCL = 12 @ 19.15 dBm 166.5 mA GSM850 PCL = 19 @ 5.31 dBm 114.67 mA EGSM900 PCL = 5 @ 33.07 dBm 327.32 mA EGSM900 PCL = 12 @ 19.53 dBm 168.33 mA EGSM900 PCL = 19 @ 5.59 dBm 115.63 mA DCS1800 PCL = 0 @ 30.00 dBm 235.97 mA DCS1800 PCL = 7 @ 16.45 dBm 198.38 mA DCS1800 PCL = 15 @ 0.67 dBm 181.44 mA PCS1900 PCL = 0 @ 29.72 dBm 273.92 mA PCS1900 PCL = 7 @ 16.72 dBm 232.21 mA PCS1900 PCL = 15 @ 0.98 dBm 231.
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Smart Module Series DCS1800 (2UL/3DL) @ 29.86 dBm 299.56 mA DCS1800 (3UL/2DL) @ 29.73 dBm 373.98 mA DCS1800 (4UL/1DL) @ 29.63 dBm 450.69 mA PCS1900 (1UL/4DL) @ 29.77 dBm 219 mA PCS1900 (2UL/3DL) @ 29.64 dBm 303.21 mA PCS1900 (3UL/2DL) @ 29.54 dBm 366.81 mA PCS1900 (4UL/1DL) @ 29.34 dBm 451.51 mA GSM850 (1UL/4DL) @ 26.75 dBm 235.97 mA GSM850 (2UL/3DL) @ 27.13 dBm 350.43 mA GSM850 (3UL/2DL) @ 26.63 dBm 458.69 mA GSM850 (4UL/1DL) @ 26.54 dBm 575.9 mA EGSM900 (1UL/4DL) @ 27.
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Smart Module Series LTE data transfer B8 (HSDPA) @ 22.24 dBm 533.04 mA B1 (HSUPA) @ 22.30 dBm 593.77 mA B5 (HSUPA) @ 21.93 dBm 535.61 mA B8 (HSUPA) @ 21.90 dBm 542.95 mA LTE-FDD B1 @ 23.29 dBm 778.16 mA LTE-FDD B3 @ 23.29 dBm 808.09 mA LTE-FDD B5 @ 23.44 dBm 622.64 mA LTE-FDD B7 @ 23.28 dBm 862.03 mA LTE-FDD B8 @ 23.44 dBm 621.15 mA LTE-FDD B20 @ 23.36 dBm 824.42 mA LTE-TDD B38 @ 23.19 dBm 504.64 mA LTE-TDD B40 @ 23.17 dBm 440.76 mA LTE-TDD B41 @ 23.19 dBm 492.
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Smart Module Series LTE-FDD supply current GSM voice call WCDMA voice call Sleep (USB disconnected) @ DRX = 5 6.60 mA Sleep (USB disconnected) @ DRX = 6 4.24 mA Sleep (USB disconnected) @ DRX = 7 3.11 mA Sleep (USB disconnected) @ DRX = 8 2.77 mA GSM850 PCL = 5 @ 32.23 dBm 254.60 mA GSM850 PCL = 12 @ 18.34 dBm 136.30 mA GSM850 PCL = 19 @ 4.87 dBm 111.30 mA PCS1900 PCL = 0 @ 29.14 dBm 196.60 mA PCS1900 PCL = 7 @ 16.23 dBm 158.40 mA PCS1900 PCL = 15 @ 0.62 dBm 135.
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Smart Module Series GSM850 (1UL/4DL) @ 26.39 dBm 186.00 mA GSM850 (2UL/3DL) @ 26.30 dBm 280.00 mA GSM850 (3UL/2DL) @ 26.30 dBm 368.00 mA GSM850 (4UL/1DL) @ 26.07 dBm 456.00 mA PCS1900 (1UL/4DL) @ 25.70 dBm 184.40 mA PCS1900 (2UL/3DL) @ 25.55 dBm 276.60 mA PCS1900 (3UL/2DL) @ 25.39 dBm 365.20 mA PCS1900 (4UL/1DL) @ 25.17 dBm 456.50 mA B1 (HSDPA) @ 22.24 dBm 506.35 mA B2 (HSDPA) @ 22.44 dBm 535.10 mA B4 (HSDPA) @ 22.23 dBm 523.07 mA B5 (HSDPA) @ 22.38 dBm 513.
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Smart Module Series LTE-FDD B26 @ 23.57 dBm 718.75 mA Table 54: SC20-AX Current Consumption Description Conditions Typ. Unit OFF state Power down 20 μA Sleep USB disconnected) @ DRX = 2 4 mA Sleep (USB disconnected) @ DRX = 5 3.1 mA Sleep (USB disconnected) @ DRX = 9 2.7 mA Sleep (USB disconnected) @ DRX = 6 3.7 mA Sleep (USB disconnected) @ DRX = 7 3.1 mA Sleep (USB disconnected) @ DRX = 8 2.8 mA Sleep (USB disconnected) @ DRX = 9 2.
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Smart Module Series WCDMA voice call B1 (max power) @ 23.41 dBm 611.94 mA B2 (max power) @ 23.27 dBm 625.14 mA B4 (max power) @ 23.44 dBm 567.13 mA B5 (max power) @ 23.4 dBm 583.06 mA B8 (max power) @ 23.32 dBm 556.48 mA GSM850 (1UL/4DL) @ 33.34 dBm 295.23 mA GSM850 (2UL/3DL) @ 32.68 dBm 448.25 mA GSM850 (3UL/2DL) @ 30.19 dBm 495.96 mA GSM850 (4UL/1DL) @ 28.96 dBm 568.51 mA PCS1900 (1UL/4DL) @ 30.49 dBm 230.49 mA PCS1900 (2UL/3DL) @ 29.87 dBm 334.
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Smart Module Series B8 (HSDPA) @ 23.1 dBm 540.98 mA B1 (HSUPA) @ 22.66 dBm 616.34 mA B2 (HSUPA) @ 22.38 dBm 654.26 mA B4 (HSUPA) @ 21.56 dBm 594.59 mA B5 (HSUPA) @ 22.25 dBm 575.03 mA B8 (HSUPA) @ 22.34 dBm 549.07 mA LTE-FDD B2 @ 23.11 dBm 790.67 mA LTE-FDD B4 @ 23.44 dBm 749.6 mA LTE-FDD B5 @ 23.61 dBm 702.76 mA LTE-FDD B7 @ 23.50 dBm 866.24 mA LTE-FDD B12 @ 23.16 dBm 649.1 mA LTE-FDD B13 @ 23.04 dBm 684.23 mA LTE-FDD B25 @ 23.30 dBm 813.32 mA LTE-FDD B26 @ 23.
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Smart Module Series LTE-FDD supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) @ DRX = 9 1.75 mA Sleep (USB disconnected) @ DRX = 5 5.29 mA Sleep (USB disconnected) @ DRX = 6 3.59 mA Sleep (USB disconnected) @ DRX = 7 2.76 mA Sleep (USB disconnected) @ DRX = 8 2.24 mA Sleep (USB disconnected) @ DRX = 5 5.52 mA Sleep (USB disconnected) @ DRX = 6 3.71 mA Sleep (USB disconnected) @ DRX = 7 2.76 mA Sleep (USB disconnected) @ DRX = 8 2.
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Smart Module Series B1 (max power) @ 23.33 dBm 561 mA B2 (max power) @ 23.51 dBm 521 mA B5 (max power) @ 23.37 dBm 551 mA B8 (max power) @ 23.38 dBm 478 mA GSM850 (1UL/4DL) @ 32.91 dBm 267 mA GSM850 (2UL/3DL) @ 32.26 dBm 388 mA GSM850 (3UL/2DL) @ 30.72 dBm 503 mA GSM850 (4UL/1DL) @ 29.38 dBm 574 mA EGSM900 (1UL/4DL) @ 32.92 dBm 266 mA EGSM900 (2UL/3DL) @ 32.74 dBm 396 mA EGSM900 (3UL/2DL) @ 30.85 dBm 509 mA EGSM900 (4UL/1DL) @ 29.58 dBm 583 mA DCS1800 (1UL/4DL) @ 39.
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Smart Module Series WCDMA data transfer EGSM900 (2UL/3DL) @ 27.27 dBm 276 mA EGSM900 (3UL/2DL) @ 26.85 dBm 394 mA EGSM900 (4UL/1DL) @ 26.53 dBm 490 mA DCS1800 (1UL/4DL) @ 25.39 dBm 197 mA DCS1800 (2UL/3DL) @ 25.40 dBm 287 mA DCS1800 (3UL/2DL) @ 25.35 dBm 373 mA DCS1800 (4UL/1DL) @ 25.05 dBm 461 mA PCS1900 (1UL/4DL) @ 26.03 dBm 168 mA PCS1900 (2UL/3DL) @ 26.07 dBm 257 mA PCS1900 (3UL/2DL) @ 25.81 dBm 345 mA PCS1900 (4UL/1DL) @ 25.70 dBm 436 mA B1 (HSDPA) @ 23.
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Smart Module Series LTE-TDD B40 @ 23.24 dBm 388 mA Table 56: SC20-J/-JL Current Consumption Description Conditions Typ. Unit OFF state Power down 20 μA Sleep (USB disconnected) @ DRX = 6 3.07 mA Sleep (USB disconnected) @ DRX = 7 2.41 mA Sleep (USB disconnected) @ DRX = 8 2.11 mA Sleep (USB disconnected) @ DRX = 9 1.95 mA Sleep (USB disconnected) @ DRX = 5 5.17 mA Sleep (USB disconnected) @ DRX = 6 3.50 mA Sleep (USB disconnected) @ DRX = 7 2.
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Smart Module Series LTE data transfer B8 (HSDPA) @ 22.17 dBm 471 mA B19 (HSDPA) @ 22.31 dBm 500 mA B1 (HSUPA) @ 21.4 dBm 494 mA B6 (HSUPA) @ 22.05 dBm 499 mA B8 (HSUPA) @ 21.57 dBm 472 mA B19 (HSUPA) @ 22.14 dBm 496 mA LTE-FDD B1 @ 23.64 dBm 636 mA LTE-FDD B3 @ 23.52 dBm 673 mA LTE-FDD B8 @ 23.40 dBm 637 mA LTE-FDD B18 @ 23.45 dBm 650 mA LTE-FDD B19 @ 23.42 dBm 642 mA LTE-FDD B26 @ 23.36 dBm 645 mA LTE-TDD B41 @ 23.
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Smart Module Series supply current LTE-TDD supply current GSM voice call Sleep (USB disconnected) DRX = 6 3.56 mA Sleep (USB disconnected) DRX = 7 2.62 mA Sleep (USB disconnected) DRX = 8 2.14 mA Sleep (USB disconnected) DRX = 5 5.93 mA Sleep (USB disconnected) DRX = 6 3.74 mA Sleep (USB disconnected) DRX = 7 2.70 mA Sleep (USB disconnected) DRX = 8 2.17 mA GSM850 PCL = 5 @ 32.29 dBm 245 mA GSM850 PCL = 12 @ 19.04 dBm 127 mA GSM850 PCL = 19 @ 5.
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Smart Module Series GPRS data transfer EDGE data transfer GSM850 (1UL/4DL) @ 32.45 dBm 249 mA GSM850 (2UL/3DL) @ 32.27 dBm 408 mA GSM850 (3UL/2DL) @ 30.12 dBm 468 mA GSM850 (4UL/1DL) @ 29.17 dBm 551 mA EGSM900 (1UL/4DL) @ 32.82 dBm 252 mA EGSM900 (2UL/3DL) @ 32.63 dBm 415 mA EGSM900 (3UL/2DL) @ 30.69 dBm 481 mA EGSM900 (4UL/1DL) @ 29.72 dBm 569 mA DCS1800 (1UL/4DL) @ 29.76 dBm 195 mA DCS1800 (2UL/3DL) @ 29.62 dBm 305 mA DCS1800 (3UL/2DL) @ 27.
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Smart Module Series WCDMA data transfer LTE data transfer DCS1800 (2UL/3DL) @ 25.64 dBm 261 mA DCS1800 (3UL/2DL) @ 23.52 dBm 322 mA DCS1800 (4UL/1DL) @ 22.37 dBm 392 mA PCS1900 (1UL/4DL) @ 26.13 dBm 167 mA PCS1900 (2UL/3DL) @ 25.95 dBm 249 mA PCS1900 (3UL/2DL) @ 23.62 dBm 313 mA PCS1900 (4UL/1DL) @ 22.46 dBm 386 mA B1 (HSDPA) @ 22.48 dBm 494 mA B2 (HSDPA) @ 22.45 dBm 490 mA B5 (HSDPA) @ 22.41 dBm 510 mA B8 (HSDPA) @ 22.41 dBm 479 mA B1 (HSUPA) @ 21.
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Smart Module Series 7.6. Tx Power The following table shows the RF output power of the SC20 series. Table 58: RF Output Power Frequency Bands Max. RF Output Power Min.
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Smart Module Series LTE-FDD B8 23 dBm ±2 dB < -39 dBm LTE-FDD B12 23 dBm ±2 dB < -39 dBm LTE-FDD B13 23 dBm ±2 dB < -39 dBm LTE-FDD B18 23 dBm ±2 dB < -39 dBm LTE-FDD B19 23 dBm ±2 dB < -39 dBm LTE-FDD B20 23 dBm ±2 dB < -39 dBm LTE-FDD B25 23 dBm ±2 dB < -39 dBm LTE-FDD B26 23 dBm ±2 dB < -39 dBm LTE-FDD B28 23 dBm ±2 dB < -39 dBm LTE-TDD B38 23 dBm ±2 dB < -39 dBm LTE-TDD B39 23 dBm ±2 dB < -39 dBm LTE-TDD B40 23 dBm ±2 dB < -39 dBm LTE-TDD B41 23 dBm ±2 dB < -39 dBm
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Smart Module Series DCS1800 -109 dBm - - -102 dBm WCDMA B1 -110 dBm - - -106.7 dBm WCDMA B8 -110 dBm - - -103.7 dBm EVDO-CDMA BC0 -108 dBm - - -104 dBm TD-SCDMA B34 -113 dBm - - -108 dBm TD-SCDMA B39 -113 dBm - - -108 dBm LTE-FDD B1 (10 MHz) -98 dBm -99.1 dBm -100.6 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -98 dBm -98.1 dBm -101 dBm -93.3 dBm LTE-FDD B5 (10 MHz) -98.3 dBm -99.5 dBm -101.7 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98.2 dBm -99 dBm -101 dBm -93.
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Smart Module Series LTE-FDD B1 (10 MHz) -98 dBm -99 dBm -102 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -97 dBm -98 dBm -101 dBm -93.3 dBm LTE-FDD B5 (10 MHz) -99 dBm -98 dBm -102 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97 dBm -97 dBm -102 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98 dBm -98 dBm -101 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -98 dBm -98 dBm -101 dBm -93.3 dBm LTE-TDD B38 (10 MHz) -97 dBm -98 dBm -100 dBm -96.3 dBm LTE-TDD B40 (10 MHz) -97 dBm -98 dBm -100 dBm -96.
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Smart Module Series LTE-FDD B20 (10 MHz) -98.1 dBm -99.4 dBm -101.7 dBm -93.3 dBm LTE-TDD B38 (10 MHz) -95.9 dBm -96.8 dBm -99.1 dBm -96.3 dBm LTE-TDD B40 (10 MHz) -96.5 dBm -97.5 dBm -99.8 dBm -96.3 dBm LTE-TDD B41 (10 MHz) -95.5 dBm -95.1 dBm -98.3 dBm -94.3 dBm Table 62: SC20-A/-AL RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO GSM850 -109.
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Smart Module Series Table 63: SC20-AX RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO GSM850 -110.0dBm - - -102 dBm PCS1900 -108.9 dBm - - -102 dBm WCDMA B1 -109.5 dBm -110.8 dBm -112.8 dBm -106.7 dBm WCDMA B2 -110.2 dBm -110.7 dBm -112.7 dBm -104.7 dBm WCDMA B4 -109.2 dBm -110.0 dBm -112 dBm -106.7 dBm WCDMA B5 -111.0 dBm -112 dBm --114 dBm -104.7 dBm WCDMA B8 -110.0 dBm - - -103.
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Smart Module Series PCS1900 -109 dBm - - -102 dBm WCDMA B1 -110 dBm -110 dBm -113 dBm -106.7 dBm WCDMA B2 -110 dBm - - -104.7 dBm WCDMA B5 -110 dBm -110 dBm -113 dBm -104.7 dBm WCDMA B8 -110 dBm -110 dBm -113 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98 dBm -99 dBm -101 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -97 dBm -98 dBm -101.8 dBm -93.3 dBm LTE-FDD B5 (10 MHz) -99 dBm -100 dBm -103 dBm -94.3 dBm LTE-FDD B7 (10 MHz) -97 dBm -99 dBm -100.6 dBm -94.
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Smart Module Series LTE-TDD B26 (10 MHz) -98 dBm -99 dBm -101.5 dBm -93.8 dBm LTE-TDD B41 (10 MHz) -96 dBm -96.5 dBm -100 dBm -94.3 dBm Table 66: SC20-EU RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO GSM850 -109 dBm - - -102 dBm EGSM900 -109 dBm - - -102 dBm DCS1800 -108 dBm - - -102 dBm PCS1900 -109 dBm - - -102 dBm WCDMA B1 -110 dBm -110 dBm -113 dBm -106.7 dBm WCDMA B2 -110 dBm - - -104.
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Smart Module Series 7.8. ESD The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the electrostatic discharge characteristics of the SC20 series.
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Smart Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are ±0.2 mm. 8.1.
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Smart Module Series Figure 43: Module Bottom Dimensions (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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Smart Module Series 8.2. Recommended Footprint Figure 44: Recommended Footprint (Top View) NOTE 1. 2. For easy maintenance of the module, keep at least 5 mm between the module and other components on the host PCB. All RESERVED pins should be kept open and MUST NOT be connected to ground.
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Smart Module Series 8.3. Top and Bottom Views Figure 45: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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Smart Module Series 9 Storage, Manufacturing and Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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Smart Module Series put in a dry environment such as in a drying oven. NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
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Smart Module Series Table 68: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 217 °C) 40–70 s Max temperature 235 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 NOTE 1. 2. 3.
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Smart Module Series Figure 47: Tape Dimensions Figure 48: Reel Dimensions Table 69: Reel Packaging Model Name SC20 series MOQ for MP Minimum Package: 200 pcs Minimum Package × 4 = 800 pcs 200 pcs Size: 370 mm × 350 mm × 85 mm N.W.: 1.92 kg G.W.: 3.17 kg Size: 380 mm × 365 mm × 365 mm N.W.: 7.68 kg G.W.: 13.
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Smart Module Series 10 Appendix References Table 70: Related Documents Document Name [1] Quectel_Smart_EVB_User_Guide [2] Quectel_SC20_Series_GPIO_Configuration [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note [5] Quectel_SC20_Series_Reference_Design Table 71: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR Adaptive Multi-rate AP Access Point bps Bits per Second CDMA Code Division Multiple Access CS Coding Scheme CS
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Smart Module Series DRX Discontinuous Reception DSI Display Serial Interface DSP Digital Signal Processor EDGE Enhanced Data Rate for GSM Evolution EFR Enhanced Full Rate EGSM Enhanced GSM eSCO Extended Synchronous Connection Oriented ESD Electrostatic Discharge ESR Equivalent Series Resistance FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General Purpose Input/Output GPRS General Packet Radio Service
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Smart Module Series I2C Inter-Integrated Circuit LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LTE Long-Term Evolution MCS Modulation and Coding Scheme MIPI Mobile Industry Processor Interface NTC Negative Temperature Coefficient PCB Printed Circuit Board PDU Protocol Data Unit PWM Pulse Width Modulation PSK Phase Shift Keying QAM Quadrature A
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Smart Module Series SD Card Secure Digital Card SMS Short Message Service SPI Serial Peripheral Interface TDD Time-Division Duplex TP Touch Panel TVS Transient Voltage Suppressor Tx Transmit UART Universal Asynchronous Receiver & Transmitter UMTS Universal Mobile Telecommunications System USB Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module VBAT Voltage at Battery (Pin) Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage VI Voltage Input VIHmin
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Smart Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
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Smart Module Series If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label.
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Smart Module Series interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.