EM060K-GL&EM120K-GL Hardware Design LTE-A Cat 12 M.2 Module Version: 1.0.
LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
LTE-A Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”).
LTE-A Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
LTE-A Module Series About the Document Revision History Version - 1.0.
LTE-A Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents .......................................................................................................................................................
LTE-A Module Series 4.4.1. W_DISABLE1# ............................................................................................................... 42 4.4.2. W_DISABLE2# ............................................................................................................... 43 4.4.3. WWAN_LED#................................................................................................................. 44 4.4.4. WAKE_ON_WAN# .......................................................................
LTE-A Module Series 7.4.2. 8 Packaging Process ........................................................................................................ 77 Appendix References ........................................................................................................................
LTE-A Module Series Table Index Table 1: Special Marks ............................................................................................................................... 14 Table 2: Frequency Bands and GNSS Types of EM060K-GL and EM120K-GL ...................................... 15 Table 3: Key Features ................................................................................................................................ 16 Table 4: Definition of I/O Parameters.........................
LTE-A Module Series Table 42: 3.3 V Digital I/O Requirements .................................................................................................. 68 Table 43: (U)SIM 1.8 V I/O Requirements ................................................................................................. 68 Table 44: (U)SIM 3.0 V I/O Requirements .................................................................................................
LTE-A Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 18 Figure 2: Pin Assignment ........................................................................................................................... 19 Figure 3: DRX Run Time and Power Consumption in Sleep Mode...........................................................
LTE-A Module Series 1 Introduction The hardware design defines the air and hardware interfaces of EM060K-GL and EM120K-GL which are connected to your applications. This document can help you quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM060K-GL and EM120K-GL. Besides, Reference design will be offered to facilitate their applications in diverse fields.
LTE-A Module Series must not exceed: Operating Band WCDMA BAND II 8.00 8.00 WCDMA BAND IV 8.00 8.00 WCDMA BAND V 5.00 5.00 LTE BAND 2 8.00 8.00 LTE BAND 4 8.00 8.00 LTE BAND 5 5.00 5.00 LTE BAND 7 8.00 8.0 LTE BAND 12 5.00 5.00 LTE BAND 13, 14, 17, 71 5.00 5.00 LTE BAND 25 8.00 8.00 LTE BAND 26(814-824) 8.00 NA LTE BAND 26(824-849) 5.00 5.00 LTE BAND 30, 38, 41 8.00 8.00 LTE BAND 66 8.00 8.00 5.
LTE-A Module Series that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
LTE-A Module Series Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
LTE-A Module Series 2 Product Overview 2.1. Frequency Bands and Functions EM060K-GL and EM120K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard WWAN M.2 Key-B modules. For more details, see PCI Express M.2 Specification Revision 2.0, Version 1.2.
LTE-A Module Series Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features Table 3: Key Features Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.135–4.4 V Typical supply voltage: 3.7 V (U)SIM Interface Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 requirements Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby eSIM eSIM function is optional Compliant with USB 3.
LTE-A Module Series - Supports up to UL Cat 6 - Supports up to DL CA Cat 6 LTE-FDD: Max. 300 Mbps (DL)/50 Mbps (UL) LTE-TDD: Max. 226 Mbps (DL)/28 Mbps (UL) Supports UL QPSK and 16QAM modulation Supports DL QPSK, 16QAM and 64QAM EM120K-GL Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports up to UL CA Cat 13 Supports up to DL CA Cat 12 LTE-FDD: Max. 600 Mbps (DL)/150 Mbps (UL) LTE-TDD: Max.
LTE-A Module Series RoHS Storage temperature range: -40 to +90 °C All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a functional diagram of EM060K-GL and EM120K-GL. _ Power management Baseband LPDDR2 SDRAM+NAND Flash Radio frequency M.
LTE-A Module Series 2.4. Pin Assignment The following figure shows the pin assignment of the module. The top side contains module and antenna connectors. No.
LTE-A Module Series 2.5. Pin Description Table 4: Definition of I/O Parameters Type Description AI Analog Input AO Analog Output AIO Analog Input/Output DI Digital Input DO Digital Output DIO Digital Input/Output OD Open Drain PI Power Input PO Power Output PU Pull Up PD Pull Down Table 5: Pin Description Pin No. Pin Name I/O Description 1 DO Not connected internally CONFIG_3 2 VCC 3 GND 4 VCC 5 GND PI Power supply DC Characteristic Comment Vmin = 3.
LTE-A Module Series 6 FULL_CARD_ POWER_OFF# DI, PD Turn on/off the module. High level: Turn on Low level: Turn off 7 USB_DP AIO USB differential data (+) 8 W_DISABLE1#* DI, PU Airplane mode control. Active LOW. 9 USB_DM AIO USB differential data (-) 10 WWAN_LED#* OD RF status indication LED. Active LOW.
LTE-A Module Series 28 PCM_SYNC* DIO, PD PCM data frame sync 29 USB_SS_TX_M AO USB 3.0 super-speed transmit (-) 30 USIM1_RST DO, PD (U)SIM1 card reset 31 USB_SS_TX_P AO USB 3.0 super-speed transmit (+) 32 USIM1_CLK DO, PD (U)SIM1 card clock 33 GND 34 USIM1_DATA 35 USB_SS_RX_M AI USB 3.0 super-speed receive (-) 36 USIM1_VDD (U)SIM1 card power supply 37 USB_SS_RX_P AI USB 3.
LTE-A Module Series 49 NC Not connected 50 NC Not connected 51 GND Ground 52 NC Not connected 53 NC Not connected 54 NC Not connected 55 NC Not connected 56 RFFE_CLK 7* 57 GND 58 RFFE_DATA 7 * DIO, PD Used for external MIPI IC control 1.8 V 59 ANTCTL0* DO, PD Antenna GPIO control 1.8 V 60 WLAN_PA_EN* DI, PD Self-protection of QLN control 1.8 V 61 ANTCTL1* DO, PD Antenna GPIO control 1.8 V 62 COEX_RXD* DI, PD LTE/WLAN coexistence 1.
LTE-A Module Series 70 VCC 71 GND 72 VCC 73 GND PI Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Ground PI Power supply Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Ground 74 VCC PI Power supply 75 CONFIG_2 DO Not connected internally Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V NOTE Keep all NC, reserved and unused pins unconnected. 2.6.
LTE-A Module Series 3 Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the module. Table 6: Overview of Operating Modes Mode Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Voice*/Data Network connected. In this mode, the power consumption is decided by network setting and data transfer rate.
Power Consumption LTE-A Module Series DRX OFF ON OFF ON OFF ON OFF ON OFF Run Time Figure 3: DRX Run Time and Power Consumption in Sleep Mode The following part of this section describes the power saving procedure and sleep mode entrance of the module. If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be realized to bring the module into sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. See document [4] for more details.
LTE-A Module Series 3.3. Airplane Mode The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. See Chapter 4.4 for more details 3.4. Communication Interface with the Host The module supports communicate through USB interfaces: USB Mode Supports all USB 2.0/3.0 features Supports MBIM/QMI/QRTR/AT USB is the default communication interface between the module and the host. It is suggested that USB 2.0 interface be reserved for firmware upgrade. 3.5.
LTE-A Module Series PWR_IN D1 TVS L1 H 1.5 μ U1 + C2 C3 C1 470 μF 100 nF 33 pF PWR_EN R2 80.6K VFB R3 10K R7 4.
LTE-A Module Series 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC. Module VCC (3.7 V Typ.) VCC + C2 220 μF C4 1 μF 2, 4 C6 C8 C10 100 nF 33 pF 10 pF APT GND 3, 5, 11 VCC D1 5.1 V + C1 220 μF C3 1 μF C5 C7 100 nF 33 pF 70, 72, 74 C9 10 pF GND PMU 27, 33, 39, 45, 51, 57, 71, 73 Figure 7: Reference Circuit for the VCC 3.6. Turn on FULL_CARD_POWER_OFF# is used to turn on/off the module. When the input signal is de-asserted high (≥ 1.
LTE-A Module Series Host Module 1.8 V or 3.3 V PMU D FULL_CARD_POWER_OFF# GPIO 6 G S R4 100K NOTE: The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. Figure 8: Turn on the Module with a Host GPIO The timing of turn-on scenario is illustrated in the following figure. System turn-on and booting VCC FULL_CARD_POWER_OFF # USB 2.0 or USB 3.
LTE-A Module Series VCC FULL_CARD_ POWER_OFF# Module Status Running Turn-off procedure OFF T1 Figure 10: Turn-off Timing through FULL_CARD_POWER_OFF# Table 10: Turn-off Timing of the Module Symbol Min. Typ. Max. Comment T1 6.5 s 6.6 s - Module system turn-off time. 3.8. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# low for 250–600 ms. Table 11: Pin Definition of RESET# Pin No.
LTE-A Module Series Host Module 1.8 V RESET# Reset pulse GPIO R2 1K R4 10K 67 R1 1K Q1 NPN R3 100K Reset Logic 250–600 ms Figure 11: Reference Circuit for the RESET# with NPN Driver Circuit Module Reset Logic 1.8 V RESET# R4 10K 67 R1 S1 TVS 1K C1 33 pF 250–600 ms NOTE: The capacitor C1 is recommended to be less than 47 pF. Figure 12: Reference Circuit for the RESET# with a Button The timing of reset scenario is illustrated in the following figure.
LTE-A Module Series VCC RESET# Module Status Running Restarting Resetting T Figure 13: Reset Timing of the Module Table 12: Reset Timing of the Module Symbol T Min. 250 ms Typ. 500 ms Max. Comment 600 ms RESET# should be pulled down for 250–600 ms. An asserting time of less than 200 ms is unreliable, while that of higher than 600 ms will cause repeated reset.
LTE-A Module Series 4 Application Interfaces 4.1. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and Dual SIM Single Standby function is supported. 4.1.1. Pin definition of (U)SIM Table 13: Pin Definition of (U)SIM Interfaces Pin No. Pin Name I/O Description Comments 36 USIM1_VDD PO (U)SIM1 card power supply 1.8/3.
LTE-A Module Series software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. See document [4] for more details about the AT command mentioned above. 4.1.2. (U)SIM Hot-Plug The module supports (U)SIM card hot-plug via (U)SIM card hot-plug detection pins (USIM1_DET and USIM2_DET). (U)SIM card insertion is detected by high/low level, and (U)SIM card hot-plug is disabled by default. The following commands enables (U)SIM card hot-plug function.
LTE-A Module Series NOTE 1. 2. 3. Hot-plug function is invalid if the configured value of is inconsistent with hardware design. The underlined value is the default parameter value. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. 4.1.3.
LTE-A Module Series When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at high level. When the (U)SIM is inserted, CD1 is short-circuited to ground and USIM_DET is at low level. The following figure shows a reference design of (U)SIM interface with a normally open (U)SIM card connector.
LTE-A Module Series 4.1.6. (U)SIM2 Card Connector The module provides two (U)SIM interfaces. (U)SIM1 interface is used for external (U)SIM card only, and (U)SIM2 interface is used for external (U)SIM card or internal eSIM card. It should be noted that when the (U)SIM2 interface is used for an external (U)SIM card, the circuits are the same as those of (U)SIM1 interface. When the (U)SIM2 interface is used for the internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open.
LTE-A Module Series 4.2. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0 and 2.0 specifications and supports super speed (5 Gbps) on USB 3.0 and high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade (USB 2.0 only), and voice over USB*. Table 14: Pin Definition of USB Interface Pin No.
LTE-A Module Series AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on your schematic and PCB. To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close to the module, and the stubs must be minimized in PCB layout. Please follow the principles below when designing for the USB interface to meet USB 3.0 and 2.
LTE-A Module Series relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. 125 μs PCM_CLK 1 2 255 256 PCM_SYNC MSB LSB MSB MSB LSB MSB PCM_DOUT PCM_DIN Figure 19: Primary Mode Timing 125 μs 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_DOUT PCM_DIN Figure 20: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No.
LTE-A Module Series 24 PCM_DOUT DO, PD PCM data output 1.8 V 28 PCM_SYNC DIO, PD PCM data frame sync 1.8 V The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See document [4] for details about AT+QDAI command. 4.4. Control and Indication Interfaces* Table 16: Pin Definition of Control and Indication Interfaces Pin No.
LTE-A Module Series Table 17: RF Function Status W_DISABLE# Logic Level High Level Low Level AT Command RF Function Status Operating Modes AT+CFUN=1 Enabled Full functionality mode AT+CFUN=0 Disabled Minimum functionality mode AT+CFUN=4 Disabled Airplane mode AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Airplane mode 4.4.2. W_DISABLE2# The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default.
LTE-A Module Series H ost M odule V C C _IO _H O S T R5 10K V D D 1.8 V R2 100K R6 10K G P IO G P IO W _D IS A B LE 2# 26 W _D IS A B LE 1# 8 R3 100K BB N O T E : T he voltage levelof V C C _IO _H O S T could be 1.8 V or 3.3 V typically. Figure 21: W_DISABLE1# and W_DISABLE2# Reference Circuit 4.4.3. WWAN_LED# The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA.
LTE-A Module Series RF function is turned off if any of the following occurs: The (U)SIM card is not powered. W_DISABLE1# is at low level (airplane mode enabled). AT+CFUN=4 (RF function disabled). High Level (LED Off) 4.4.4. WAKE_ON_WAN# The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC returns, a 1 s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown below.
LTE-A Module Series Table 21: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT backoff. Low Max transmitting power backoff by SAR efs file configure. 4.4.6. WLAN_PA_EN QLN enables self-protection circuit (integrated inside QLN) when WLAN_PA_EN is at HIGH level. In LTE mode, WLAN_PA_EN is set to 0 (low level) by default. When WLAN_PA_EN is set to 1 (high level), the LNA will be in self-protection mode. Table 22: Pin definition of WLAN_PA_EN Pin No.
LTE-A Module Series 4.6. Configuration Pins Table 24: List of EM060K-GL and EM120K-GLConfiguration Pins Config_0 (Pin 21) Config_1 (Pin 69) Config_2 (Pin 75) Config_3 (Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC WWAN–USB3.0 2 Table 25: Pin Definition of EM060K-GL and EM120K-GL Configuration Pins Pin No.
LTE-A Module Series 5 Antenna Interfaces 5.1. Cellular Network 5.1.1. Antenna Interfaces & Frequency Bands The module provides Main, Rx-diversity/GNSS antenna connectors which are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 Ω.
LTE-A Module Series 61 ANTCTL1 DO, PD 1.8 V 63 ANTCTL2 DO, PD 1.8 V 65 ANTCTL3 DO, PD 1.8 V 5.1.2.2. Antenna Tuner Control Interface through RFFE Table 28: Pin Definition of Antenna Tuner Control Interface through RFFE Pin No. Pin Name I/O Description Comment 56 RFFE_CLK DO, PD Used for external MIPI IC control 1.8 V 58 RFFE_DATA DIO, PD Used for external MIPI IC control 1.8 V NOTE If RFFE_CLK and RFFE_DATA is required, please contact Quectel for more details. 5.1.3.
LTE-A Module Series LTE-FDD B2 1850–1910 1930–1990 MHz LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B4 1710–1755 2110–2155 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B7 2500–2570 2620–2690 MHz LTE-FDD B8 880–915 925–960 MHz LTE-FDD B12 699–716 729–746 MHz LTE-FDD B13 777–787 746–756 MHz LTE-FDD B14 788–798 758–768 MHz LTE-FDD B17 704–716 734–746 MHz LTE-FDD B18 815–830 860–875 MHz LTE-FDD B19 830–845 875–890 MHz LTE-FDD B20 832–862 791–821 MHz LTE-FDD B25 1
LTE-A Module Series LTE-TDD B41 2496–2690 2496–2690 MHz LTE-TDD B42 3400–3600 3400–3600 MHz LTE-TDD B43 3600–3800 3600–3800 MHz - 5150–5925 MHz 3550–3700 3550–3700 MHz LTE-TDD B46 9 LTE-TDD B48 5.1.4. Tx Power Table 30: EM060K-Gl and EM120K-GL Tx Power Frequency Bands Modulation Max. Min. Comment WCDMA BPSK 23 dBm ±2 dB < -50 dBm - LTE-FDD QPSK 23 dBm ±2 dB < -40 dBm 10 MHz, 1RB LTE-TDD QPSK 23 dBm ±2 dB < -40 dBm 10 MHz, 1RB 5.1.5.
LTE-A Module Series WCDMA B19 -110.5 -111 -113 -106.7 LTE-FDD B1 -96.5 -98 -100 -96.3 10 MHz LTE-FDD B2 -97 -97.5 -100 -94.3 10 MHz LTE-FDD B3 -98 -97.5 -100.5 -93.3 10 MHz LTE-FDD B4 -97 -97 -99.5 -96.3 10 MHz LTE-FDD B5 -99 -99 -101.5 -94.3 10 MHz LTE-FDD B7 -96.5 -97.5 -99.5 -94.3 10 MHz LTE-FDD B8 -99 -99 -101.5 -93.3 10 MHz LTE-FDD B12 -98.5 -99.5 -102 -93.3 10 MHz LTE-FDD B13 -99 -99.5 -102 -93.3 10 MHz LTE-FDD B14 -99 -99.5 -102 -93.
LTE-A Module Series LTE-TDD B38 -97.5 -97.5 -99.5 -96.3 10 MHz LTE-TDD B39 -97.5 -97 -99.5 -96.3 10 MHz LTE-TDD B40 -95.5 -95.5 -98.5 -96.3 10 MHz LTE-TDD B41 -97 -97 -99.5 -94.3 10 MHz LTE-TDD B42 -97.5 -98.5 -100.5 -95.0 10 MHz LTE-TDD B43 -97.5 -98.5 -100.5 -95.0 10 MHz LTE-TDD B46 12 -93 -92 -95.5 -88.5 20 MHz LTE-TDD B48 -97.5 -98 -100.5 -95.
LTE-A Module Series LTE-FDD B5 -99 -99 -101.5 -94.3 10 MHz LTE-FDD B7 -96.5 -97.5 -99.5 -94.3 10 MHz LTE-FDD B8 -99 -99 -101.5 -93.3 10 MHz LTE-FDD B12 -98.5 -99.5 -102 -93.3 10 MHz LTE-FDD B13 -99 -99.5 -102 -93.3 10 MHz LTE-FDD B14 -99 -99.5 -102 -93.3 10 MHz LTE-FDD B17 -98.5 -99.5 -101.5 -93.3 10 MHz LTE-FDD B18 -98.5 -99 -101.5 -96.3 10 MHz LTE-FDD B19 -98.5 -99 -101.5 -96.3 10 MHz LTE-FDD B20 -99 -98 -101 -93.3 10 MHz LTE-FDD B25 -97 -97.
LTE-A Module Series LTE-TDD B46 12 -93 -92 -95 -88.5 20 MHz LTE-TDD B48 -97.5 -98 -100.5 -95.0 10 MHz 5.2. GNSS 5.2.1. General Description The module includes a fully integrated global navigation satellite system solution. The module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is switched off. It has to be switched on via AT command.
LTE-A Module Series (GNSS) @ open sky Warm start @ open sky Hot start @ open sky Accuracy (GNSS) CEP-50 XTRA enabled 13 s Autonomous 23 s XTRA enabled 3 s Autonomous 2 s XTRA enabled 2 s Autonomous @ open sky 2 m NOTE 1. 2. 3. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).
LTE-A Module Series Figure 25: Dimensions of the Receptacle (Unit: mm) Table 35: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Ω Temperature Rating -40 to +85 °C Voltage Standing Wave Ratio (VSWR) Meet the requirements of: Max. 1.3 (DC–3 GHz) Max. 1.
LTE-A Module Series 5.3.2. Antenna Connector Location The antenna connector locations are shown below. Figure 26: Antenna Connectors on the EM060K-GL and EM120K-GL 5.3.3. Antenna Connector Installation The 2 mm × 2 mm connector dimensions are illustrated below: Figure 27: EM060K-Gl and EM120K-GL RF Connector Dimensions (Unit: mm) The receptacle RF connector used in conjunction with the module will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a Ø 0.
LTE-A Module Series 1.45 mm utilizing a Ø 1.13 mm coaxial cable. The following figure shows the specifications of mating plugs using Ø 0.81 mm coaxial cables. Figure 28: Dimensions of Mated Plugs (Ø0.81 mm Coaxial Cables) (Unit: mm)/ The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a Ø 0.81 mm coaxial cable. Figure 29: Space Factor of Mated Connectors (Ø0.
LTE-A Module Series The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a Ø 1.13 mm coaxial cable. Figure 30: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm) 5.3.4.
LTE-A Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module is listed in the following table. Table 37: Absolute Maximum Ratings Parameter Min. Typ. Max. Unit VCC -0.3 - 4.7 V 6.2. Power Supply Requirements The typical input voltage of the module is 3.7 V. The following table shows the power supply requirements of the module.
LTE-A Module Series 6.3. Power consumption Table 39: EM060K-GL Power Consumption (3.7 V Power Supply) Description Conditions Typ. Unit OFF state Power down 72 μA AT+CFUN=0 @ USB Suspend 1.5 mA AT+CFUN=0 @ USB Suspend 1.65 mA AT+CFUN=4 @ USB Suspend 1.5 mA AT+CFUN=4 @ USB Suspend 1.67 mA WCDMA PF = 64 @ USB Suspend 2.63 mA WCDMA PF = 64 @ USB Suspend 2.74 mA LTE-FDD PF = 64 @ USB Suspend 2.9 mA LTE-FDD PF = 64 @ USB Suspend 2.9 mA LTE-TDD PF = 64 @ USB Suspend 3.
LTE-A Module Series LTE Data Transfer (GNSS Off) WCDMA B3 HSDPA CH1338 @ 22.2 dBm 590 mA WCDMA B3 HSUPA CH1338 @ 20 dBm 470 mA WCDMA B4 HSDPA CH1638 @ 22.1 dBm 560 mA WCDMA B4 HSUPA CH1638 @ 20.3 dBm 460 mA WCDMA B5 HSDPA CH4407 @ 22.2 dBm 590 mA WCDMA B5 HSUPA CH4407 @ 22.2 dBm 580 mA WCDMA B6 HSDPA CH4400 @ 22.2 dBm 570 mA WCDMA B6 HSUPA CH4400 @ 22.3 dBm 580 mA WCDMA B8 HSDPA CH3012 @ 22 dBm 550 mA WCDMA B8 HSUPA CH3012 @ 21.
LTE-A Module Series WCDMA Voice* Call LTE-FDD B20 CH6300 @ 23.17 dBm 575 mA LTE-FDD B25 CH8365 @ 23.21 dBm 700 mA LTE-FDD B26 CH8865@ 23.14 dBm 710 mA LTE-FDD B28A CH9360 @ 22.95 dBm 615 mA LTE-FDD B28B CH9510 @ 22.84 dBm 615 mA LTE-FDD B30 CH9820 @ 23.03 dBm 1070 mA LTE-FDD B66 CH66886 @ 23.15 dBm 690 mA LTE-FDD B71 CH68786 @ 23.05 dBm 670 mA LTE-TDD B34 CH36275@ 23.10 dBm 350 mA LTE-TDD B38 CH38000 @ 23.14 dBm 485 mA LTE-TDD B39 CH38450 @ 23.
LTE-A Module Series Table 40: EM120K-GL Power Consumption (3.7 V Power Supply) Description Conditions Typ. Unit OFF state Power down 72 μA AT+CFUN=0 @ USB Suspend 1.37 mA AT+CFUN=0 @ USB Suspend 1.35 mA AT+CFUN=4 @ USB Suspend 1.40 mA AT+CFUN=4 @ USB Suspend 1.42 mA WCDMA PF = 64 @ USB Suspend 2.04 mA WCDMA PF = 64 @ USB Suspend 2.04 mA LTE-FDD PF = 64 @ USB Suspend 2.22 mA LTE-FDD PF = 64 @ USB Suspend 2.32 mA LTE-TDD PF = 64 @ USB Suspend 3.
LTE-A Module Series LTE Data Transfer (GNSS Off) WCDMA B4 HSDPA CH1638 @ 22.1 dBm 560 mA WCDMA B4 HSUPA CH1638 @ 20.3 dBm 460 mA WCDMA B5 HSDPA CH4407 @ 22.2 dBm 590 mA WCDMA B5 HSUPA CH4407 @ 22.2 dBm 580 mA WCDMA B6 HSDPA CH4400 @ 22.2 dBm 570 mA WCDMA B6 HSUPA CH4400 @ 22.3 dBm 580 mA WCDMA B8 HSDPA CH3012 @ 22 dBm 550 mA WCDMA B8 HSUPA CH3012 @ 21.5 dBm 560 mA WCDMA B19 HSDPA CH738 @ 22 dBm 520 mA WCDMA B19 HSUPA CH738 @ 22.5 dBm 580 mA LTE-FDD B1 CH300 @ 23.
LTE-A Module Series WCDMA Voice* Call LTE-FDD B26 CH8865@ 23.15 dBm 710 mA LTE-FDD B28A CH9360 @ 23.05 dBm 615 mA LTE-FDD B28B CH9510 @ 22.97 dBm 615 mA LTE-FDD B30 CH9820 @ 23.24 dBm 1070 mA LTE-FDD B66 CH66886 @ 23.10 dBm 690 mA LTE-FDD B71 CH68786 @ 23.36 dBm 670 mA LTE-TDD B34 CH36275 @ 23.11 dBm 350 mA LTE-TDD B38 CH38000 @ 23.13 dBm 485 mA LTE-TDD B39 CH38450 @ 23.05 dBm 360 mA LTE-TDD B40 CH39150 @ 23.21 dBm 460 mA LTE-TDD B41 CH40740 @ 23.
LTE-A Module Series 6.4. Digital I/O Characteristics Table 41: 1.8 V Digital I/O Requirements) Parameter Description Min. Max. Unit VIH Input high voltage 1.65 2.1 V VIL Input low voltage -0.3 0.54 V VOH Output high voltage 1.3 1.8 V VOL Output low voltage 0 0.4 V Table 42: 3.3 V Digital I/O Requirements Parameter Description Min. Max. Unit 3.3 V Power Domain 3.135 3.464 V VIH Input high voltage 2.0 3.6 V VIL Input low voltage -0.5 0.8 V Table 43: (U)SIM 1.
LTE-A Module Series Table 44: (U)SIM 3.0 V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 2.7 3.05 V VIH Input high voltage 0.7 × USIM_VDD USIM_VDD + 0.3 V VIL Input low voltage -0.3 0.2 × USIM_VDD V VOH Output high voltage 0.8 × USIM_VDD USIM_VDD V VOL Output low voltage 0 0.4 V 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative.
LTE-A Module Series 6.6. Operating and Storage Temperatures Table 46: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range 15 -25 +25 +75 ºC Extended Temperature Range 16 -40 - +85 ºC -40 - +90 ºC Storage temperature Range 6.7.
LTE-A Module Series temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.
LTE-A Module Series 6.8. Notification Please follow the principles below in the module application. 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
LTE-A Module Series 7 Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM060K-GL and EM120K-GL. All dimensions are measured in mm, and the tolerances are ±0.15 mm unless otherwise specified. 7.1.
LTE-A Module Series 7.2. Top and Bottom Views Figure 34: EM060K-GL Top and Bottom Views Figure 35: EM120K-GL Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
LTE-A Module Series 7.3. M.2 Connector EM060K-GL and EM120K-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Packaging The module adopts blister tray packaging and details are as follow: 7.4.1.
LTE-A Module Series Figure 36: Blister Tray Dimension Drawing EM060K-GL&EM120K-GL_Hardware_Design 76 / 78
LTE-A Module Series 7.4.2. Packaging Process Each blister tray packs 10 modules. Stack 10 blister trays with modules together, and put 1 empty blister tray on the top. Packing 11 blister trays together and then put blister trays into a conductive bag, seal and pack the conductive bag. Put seal-packed blister trays into a mini box. One mini box can pack 100 modules. Put 4 mini boxes into 1 carton and then seal it. One carton can pack 400 modules.
LTE-A Module Series 8 Appendix References Table 48: Related Documents Document Name [1] Quectel_EM060K-GL_CA_Feature [2] Quectel_EM120K-GL_CA_Feature [3] Quectel_EM060K-GL_AT_Commands_Manual [4] Quectel_5G-M2_EVB_User_Guide [5] Quectel_LTE-A(Q)_GNSS_Application_Note Table 49: Terms and Abbreviations Abbreviation Description BIOS Basic Input/Output System bps Bit(s) per second BPSK Binary Phase Shift Keying CPE Customer-Premise Equipment COEX Coexistence DFOTA Delta Firmware Upgrade Over-The
LTE-A Module Series EIRP Equipment Isotropic Radiated Power ESD Electrostatic Discharge FDD Frequency Division Duplex GLONASS Global Navigation Satellite System (Russia) GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access kbps Kilobits per second LAA License Assisted Access LED Light Emitting Diode LTE Long Term Evolution Mbps Megabits per second ME
LTE-A Module Series PDU Protocol Data Unit PME Power Management Event PPP Point-to-Point Protocol QPSK Quadrature Phase Shift Keying RB Resource Block RF Radio Frequency RFFE RF Front-End RH Relative Humility Rx Receive SAR Specific Absorption Rate SMS Short Message Service TCP Transmission Control Protocol TRx Transmit & Receive Tx Transmit UART Universal Asynchronous Receiver/Transmitter UDP User Datagram Protocol UL Uplink URC Unsolicited Result Code USB Universal Se
