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SC200R&SC262R Series

Hardware Design

Smart Module Series

Version: 1.2

Date: 2022-05-23

Status: Released

Summary of content (127 pages)

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SC200R&SC262R Series Hardware Design Smart Module Series Version: 1.
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Smart Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
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Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.
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Smart Module Series About the Document Revision History Version Date Author Description 1.0 2019-12-30 Arsene TONG Initial 1.1 2020-09-09 Jasper LAI/ Jamie SHI 1. Updated SC200R-EM frequency bands (Chapter 2.1/6.1): Added B4 in LTE-FDD Deleted B39 in LTE-TDD Added B4 in WCDMA 2. Added Galileo in supported GNSS (Chapter 2.1/2.2/5/6.3). 3. Added a note for the wakeup of LDO6_1V8 during sleep mode (Chapter 3.3). 4. Updated Wi-Fi output power and added Wi-Fi receiving sensitivity (Chapter 4.1.1). 5.
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Smart Module Series 3. 4. 5. 6. 1.3 2022-5-23 Winston SC200R-CE/-EM/-NA. Chapter 7.5: Added RF output power of SC200R-EM. Chapter 7.6: Updated RF receiving sensitivity of SC200R-CE/-EM/-NA. Chapter 9.1: Updated notes for the storage conditions. Chapter 9.2: Updated the recommended reflow soldering thermal profile parameters. 1.
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Smart Module Series Contents Safety Information ....................................................................................................................................... 2 About the Document ................................................................................................................................... 3 Contents .......................................................................................................................................................
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Smart Module Series 3.22. Audio Interfaces ....................................................................................................................... 70 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 71 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 72 3.22.3. Reference Circuit Design for Headset Interface .......................................................
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Smart Module Series 9.2. 9.3. Manufacturing and Soldering ................................................................................................ 116 Packaging .............................................................................................................................. 118 10 Appendix References ......................................................................................................................
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Smart Module Series Table Index Table 1: Special Mark ................................................................................................................................. 16 Table 2: SC200R-CE Frequency Bands .................................................................................................... 17 Table 3: SC200R-EM Frequency Bands .................................................................................................... 18 Table 4: SC200R-NA Frequency Bands............
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Smart Module Series Table 42: GNSS Frequency ....................................................................................................................... 86 Table 43: Antenna Requirements ............................................................................................................... 90 Table 44: Absolute Maximum Ratings ........................................................................................................ 93 Table 45: Power Supply Ratings .......................
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Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 23 Figure 2: Pin Assignment (Top View) ......................................................................................................... 25 Figure 3: Voltage Drop Sample ..................................................................................................................
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Smart Module Series Figure 42: Bottom Dimensions (Bottom View) ......................................................................................... 112 Figure 43: Recommended Footprint (Top View) ...................................................................................... 113 Figure 44: Top and Bottom Views of the Module ..................................................................................... 114 Figure 45: Recommended Reflow Soldering Thermal Profile ...........................
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Smart Module Series 1 Introduction This document, describing SC200R series module and its air and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications.
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Smart Module Series 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e.
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Smart Module Series Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
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Smart Module Series l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2022SC262R”.
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Smart Module Series d’inclinaison nécessaires pour rester conforme à l’exigence de la p.i.r.e. applicable au masque d’élévation, énoncée à la section 6.2.2.3, doivent être clairement indiqués. i. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit ii.
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Smart Module Series 2 Product Concept 2.1. General Description SC200R is a series of 4G Smart LTE module based on Android operating system, and provides industrial grade performance. Its general features are listed below: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Supports worldwide LTE-FDD, LTE-TDD, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, EVDO/CDMA, EDGE and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n and Bluetooth 4.2 LE.
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Smart Module Series GNSS GPS: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Galileo: 1575.42 ±1.023 MHz Table 3: SC200R-EM Frequency Bands Mode Frequency LTE-FDD B1/B2/B3/B4/B5/B7/B8/B20/B28 LTE-TDD B38/B40/B41 WCDMA B1/B2/B4/B5/B8 GSM 850/900/1800/1900 MHz Wi-Fi 802.11a/b/g/n 2412–2472 MHz 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GNSS GPS: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Galileo: 1575.42 ±1.
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Smart Module Series Table 5: SC200R-JP* Frequency Bands Mode Frequency LTE-FDD B1/B3/B5/B8/B11/B18/B19/B21/B26/B28 LTE-TDD B41 WCDMA B1/B6/B8/B19 Wi-Fi 802.11a/b/g/n 2402–2482 MHz 5180–5825 MHz Bluetooth 4.2 LE 2402–2480 MHz GNSS GPS: 1575.42 ±1.023 MHz GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Galileo: 1575.42 ±1.023 MHz Table 6: SC200R-WF Frequency Bands Mode Frequency Wi-Fi 802.11a/b/g/n 2412–2472 MHz 5180–5825 MHz Bluetooth 4.
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Smart Module Series SC200R is a series of SMD type modules, which can be embedded into applications through its 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm × 40.5 mm × 2.8 mm, the module can meet almost all requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. 2.2.
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Smart Module Series LTE Features Supports 3GPP R10 Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth ⚫ FDD: Max. 150 Mbps (DL)/Max. 50 Mbps (UL) ⚫ TDD: Max. 130 Mbps (DL)/Max. 30 Mbps (UL) UMTS Features Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Supports 16-QAM, 64-QAM and QPSK modulations ⚫ DC-HSDPA: Max. 42 Mbps ⚫ DC-HSUPA: Max. 11.2 Mbps ⚫ WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) CDMA2000 Features Supports 3GPP2 CDMA2000 1X Advanced, CDMA2000 1xEV-DO Rev.
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Smart Module Series Audio Interfaces Audio inputs: ⚫ Three single-ended microphone inputs Audio outputs: ⚫ Class AB stereo headphone output ⚫ Class AB earpiece differential output ⚫ Class D speaker differential amplifier output Audio Codec ⚫ ⚫ ⚫ ⚫ EVRC, EVRC-B, EVRC-WB; G.711, G.729A, and G.729AB; GSM-FR, GSM-EFR, GSM-HR; AMR-NB, AMR-WB, eAMR, BeAMR ⚫ ⚫ ⚫ ⚫ Compliant with USB 2.
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Smart Module Series NOTES 1. 2. 1) 2) SC200R-WF/SC262R-WF does not support GNSS. Within the operating temperature range, the module is 3GPP compliant. 2.3. Functional Diagram The following figure shows a block diagram of SC200R series module and illustrates the major functional parts.
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Smart Module Series 3 Application Interfaces 3.1. General Description SC200R is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following chapters provide the detailed description of pins/interfaces listed below.
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Smart Module Series 3.2.
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Smart Module Series 3.3. Pin Description Table 8: I/O Parameters Definition Type Description AI Analog input AO Analog output AIO Analog input/output DI Digital input DO Digital output DIO Digital input/output OD Open drain PI Power input PO Power output PIO Power input/output The following table shows the pin definition and electrical characteristics of the module. Table 9: Pin Description Power Supply Pin Name Pin No.
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Smart Module Series LDO5_1V8 LDO6_1V8 1) LDO10_2V85 LDO17_2V85 LDO16_2V8 111 125 156 129 193 PO PO PO PO PO 1.8 V output power supply 1.8 V output power supply 2.85 V output power supply 2.85 V output power supply 2.8 V output power supply Vnom = 1.8 V IOmax = 20 mA Power supply for external GPIO’s pull-up and level shift circuits. Vnom = 1.8 V IOmax = 150 mA Power supply for sensors, cameras, and I2C pull-up circuit. If it is used, connect an external 1.0–4.
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Smart Module Series GND 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 149, 162, 171, 172, 176, 187–191, 202–204, 206–224, 226–231, 233–238, 240, 241, 243–245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271–274 Audio Interfaces Pin Name Pin No. I/O Description MIC1_P 4 AI Microphone input for channel 1 (+) DC Characteristics Comment If it is not used, connect it to the ground.
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Smart Module Series USB_VBUS 141, 142 PI Charging power input; USB 5 V power input; USB/adaptor insertion detection USB_DM 13 AIO USB 2.0 differential data (-) USB_DP 14 AIO USB 2.0 differential data (+) USB_ID 16 DI USB ID detect Pin No. I/O Description Vmax = 6.2 V Vmin = 4.35 V Vnom = 5.0 V USB 2.0 standard compliant. 90 Ω differential impedance. High level by default. (U)SIM Interfaces Pin Name DC Characteristics Comment Active low. Externally pull it up to 1.8 V.
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Smart Module Series IOmax = 55 mA USIM2_VDD 21 PO (U)SIM2 card power supply For 1.8 V (U)SIM: Vmax = 1.85 V Vmin = 1.75 V Either 1.8 V or 2.95 V (U)SIM card is supported. For 2.95 V (U)SIM: Vmax = 3.1 V Vmin = 2.8 V USIM1_DET 22 DI (U)SIM1 card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V USIM1_RST 23 DO (U)SIM1 card reset USIM1_CLK 24 DO (U)SIM1 card clock VOLmax = 0.4 V VOHmin = 0.8 × USIM1_VDD USIM1_DATA 25 DIO (U)SIM1 card data VILmax = 0.2 × USIM1_VDD VIHmin = 0.
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Smart Module Series UART5_TXD 34 DO UART5 transmit VOLmax = 0.45 V VOHmin = 1.35 V UART5_RXD 35 DI UART5 receive VILmax = 0.63 V VIHmin = 1.17 V UART5_CTS 36 DI UART5 clear to send VILmax = 0.63 V VIHmin = 1.17 V UART5_RTS 37 DO UART5 request to send VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V DBG_RXD 93 DI UART2 receive (debug UART by default) DBG_TXD 94 DO UART2 transmit (debug UART by default) VOLmax = 0.45 V VOHmin = 1.
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Smart Module Series SD_DATA3 44 DIO SDIO data bit 3 2.95 V SD card: VILmax = 0.73 V VIHmin = 1.84 V VOLmax = 0.37 V VOHmin = 2.2 V SD_DET 45 DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_INT 30 DI TP interrupt VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. TP_RST 31 DO TP reset VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. Active low.
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Smart Module Series DSI_LN2_P 59 AO LCD MIPI data 2 (+) DSI_LN3_N 60 AO LCD MIPI data 3 (-) DSI_LN3_P 61 AO LCD MIPI data 3 (+) Pin Name Pin No.
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Smart Module Series CSI0_LN2_N 160 AI Camera MIPI data 2 (-) CSI0_LN2_P 199 AI Camera MIPI data 2 (+) CSI0_LN3_N 161 AI Camera MIPI data 3 (-) CSI0_LN3_P 200 AI Camera MIPI data 3 (+) CAM0_MCLK 74 DO Clock of camera CAM1_MCLK 75 DO Clock of camera CAM0_RST 79 DO Reset of camera VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain.
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Smart Module Series VOL_UP VOL_DOWN 95 96 DI Volume up VILmax = 0.63 V VIHmin = 1.17 V If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. DI Volume down VILmax = 0.63 V VIHmin = 1.17 V If it is not used, keep it open. Cannot be externally pulled up. 1.8 V power domain. I/O Description DC Characteristics Comment SENSOR_I2C Interface Pin Name Pin No. Dedicated for external sensors. Cannot be used for touch panel, NFC, I2C keyboard, etc.
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Smart Module Series CHG_SEL 127 DI Charging select Pin Name Pin No. I/O Description ADC 128 AI General-purpose ADC interface Pin Name Pin No. I/O Description ANT_MAIN 87 AIO Main antenna interface ANT_DRX 131 AI Rx-diversity antenna interface 121 AI GNSS antenna interface 77 AIO Wi-Fi/Bluetooth antenna interface Pin Name Pin No.
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Smart Module Series GPIO_13 102 DIO General-purpose input/output GPIO_95 103 DIO General-purpose input/output GPIO_94 104 DIO General-purpose input/output GPIO_87 105 DIO General-purpose input/output GPIO_66 106 DIO General-purpose input/output GPIO_43 107 DIO General-purpose input/output GPIO_63 108 DIO General-purpose input/output GPIO_44 109 DIO General-purpose input/output GPIO_42 110 DIO General-purpose input/output GPIO_93 112 DIO General-purpose input/output G
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Smart Module Series GPIO_34 170 DIO General-purpose input/output GPIO_90 177 DIO General-purpose input/output GPIO_39 201 DIO General-purpose input/output GPIO_86 239 DIO General-purpose input/output GPIO_88 264 DIO General-purpose input/output GPIO_85 265 DIO General-purpose input/output GPIO_61 267 DIO General-purpose input/output I/O Description 194 DIO External GNSS LNA enable Pin Name Pin No.
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Smart Module Series Pin Name I/O Description DC Characteristics Comment 28 PO Vibration motor driver output control VO = 1.2–3.1 V IOmax = 175 mA Connect it to the negative pole of the motor. Pin No. I/O Description DC Characteristics Comment 195 AO Indicates the module's charging status IOmax = 5 mA Pin Name Pin No. I/O Description DC Characteristics NFC_CLK 181 DO NFC clock NFC_CLK_REQ 182 DI NFC clock request VIB_DRV_N Pin No.
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Smart Module Series 3.4. Power Supply 3.4.1. Power Supply Pins SC200R series module provides two VBAT_RF pins and two VBAT_BB pins for connection with the external power supply. The VBAT_RF pins are used for the RF part of the module and the VBAT_BB pins are used for the baseband part of the module. 3.4.2. Decrease Voltage Drop The power supply range of the module is 3.55–4.2 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc.
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Smart Module Series VBAT VBAT_RF VBAT_BB + C1 D1 100 μF C2 C3 + C9 D2 C5 C4 4.7 μF 100 nF 33 pF 10 pF C6 C7 C8 100 μF 100 nF 33 pF 10 pF GND Module Figure 3: Star Structure of the Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of SC200R series module should be able to provide sufficient current of at least 3 A.
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Smart Module Series NOTES 1. 2. It is recommended to switch off the power supply when the module is in abnormal state, and then switch on the power to restart the module. The module supports battery charging by default. If the above power supply design is adopted, make sure the charging function is disabled by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply chip. 3.5. Turn on and off Scenarios 3.5.1.
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Smart Module Series The other way to control PWRKEY is by using a button directly. You must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. S1 PWRKEY 1K TVS Close to S1 Figure 6: Turn on the Module Using Keystroke The turning-on scenario is illustrated in the following figure. VBAT(Typ. 3.8 V) Note2 PWRKEY > 1.
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Smart Module Series NOTES 1. When the module is powered on for the first time, its timing of turning on may be different from that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT to be stable at 3.8 V for at least 30 ms before pulling down PWRKEY. Additionally, PWRKEY cannot be kept pulled down all the time. 3.5.2.
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Smart Module Series VRTC RTC Core Coin Cell Module Figure 9: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is powered on. The recommended input voltage range for VRTC is 2.0–3.25 V and the recommended typical value is 3.0 V. 3.7. Power Output SC200R series module supports output of regulated voltages for peripheral circuits.
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Smart Module Series NOTE 1) When the module is in sleep mode, LDO6_1V8 wakes up periodically or randomly. Considering the actual requirement for power consumption during sleep mode, you can use either LDO6_1V8 or an external LDO for power supply. If you require lower power consumption during sleep mode, use an external LDO for power supply. 3.8. Battery Charging and Management SC200R series module supports battery charging.
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Smart Module Series CHG_SEL 127 DI If you use an internal charging chip, keep this pin open. If you use an external charging chip, connect it to GND. Charging select SC200R series module supports battery temperature detection in the condition that the battery integrates a thermistor (47 kΩ 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin.
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Smart Module Series 3.9. USB Interface SC200R series module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 12: Pin Definition of USB Interface Pin Name Pin No.
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Smart Module Series L1 1 VOUT VOUT EN NC R1 10K 22 μF/ 10 V 9 GND 8 GND VBAT C2 6 2 3 9 U1 7 8 GPIO 1 VUSB 2 USB_DM 3 USB_DP 4 USB_ID 5 GND USB_VBUS USB_DM USB_DP USB_ID Module D4 D1 ESD ESD ESD ESD 6 GND D2 D3 C3 100 nF GND GND C1 10 μF SW VIN 7 4 5 1.0 μH AGND PGND PGND VBAT Figure 12: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface.
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Smart Module Series 3.10. UART Interfaces SC200R series module provides three UART interfaces and supports up to 4 Mbps: ⚫ ⚫ ⚫ UART5: 4-wire UART interface, and hardware flow control is supported UART2 (debug UART): 2-wire UART interface, used for debugging by default UART1: 2-wire UART interface Table 14: Pin Definition of UART Interfaces Pin Name Pin No.
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Smart Module Series The following figure is an example of connection between the module and PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and PC. The following figure shows the reference design. 1.8 V OE VCCA UART5_TXD UART5_RTS TXD_1.8V RTS_1.8V 3.3 V VCCB TXD_3.3V RTS_3.3V UART5_RXD RXD_1.8V RXD_3.3V UART5_CTS CTS_1.8V CTS_3.
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Smart Module Series USIM2_RST 18 DO (U)SIM2 card reset USIM2_CLK 19 DO (U)SIM2 card clock USIM2_DATA 20 DIO (U)SIM2 card data USIM2_VDD 21 PO (U)SIM2 card power supply Either 1.8 V or 2.95 V (U)SIM card is supported. Active low. Externally pull it up to 1.8 V. If it is not used, keep it open. This function is disabled by default via software. Cannot be multiplexed into a generic GPIO. Cannot be multiplexed into generic GPIOs.
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Smart Module Series If you do not need to use USIM_DET, keep this pin open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector.
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Smart Module Series 3.12. SD Card Interface SD Card interface of SC200R series module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 16: Pin Definition of SD Card Interface Pin Name Pin No.
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Smart Module Series SD_LDO11 is the power supply for the SD card and can provide up to 800 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. In order to ensure stability of output current, add a 4.7 μF and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines.
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Smart Module Series 3.13. GPIO Interfaces SC200R series module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 18: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO No.
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Smart Module Series GPIO_59 100 GPIO_59 B-PD:nppukp Wakeup GPIO_61 267 GPIO_61 B-PD:nppukp Wakeup GPIO_62 123 GPIO_62 B-PD:nppukp Wakeup GPIO_63 108 GPIO_63 B-PD:nppukp Wakeup GPIO_66 106 GPIO_66 B-PD:nppukp GPIO_85 265 GPIO_85 B-PD:nppukp GPIO_86 239 GPIO_86 B-PD:nppukp GPIO_87 105 GPIO_87 B-PD:nppukp GPIO_88 264 GPIO_88 B-PD:nppukp GPIO_89 115 GPIO_89 B-PD:nppukp GPIO_90 177 GPIO_90 B-PD:nppukp Wakeup GPIO_93 112 GPIO_93 B-PD:nppukp Wakeup GPIO_94 10
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Smart Module Series CAM0_RST 79 GPIO_128 B-PD:nppukp Wakeup CAM0_PWDN 80 GPIO_126 B-PD:nppukp Wakeup CAM1_RST 81 GPIO_129 B-PD:nppukp CAM1_PWDN 82 GPIO_125 B-PD:nppukp CAM2_MCLK 165 GPIO_27 B-PD:nppukp CAM2_RST 164 GPIO_38 B-PD:nppukp Wakeup CAM2_PWDN 163 GPIO_41 B-PD:nppukp Wakeup VOL_UP 95 GPIO_91 B-PD:nppukp Wakeup VOL_DOWN 96 GPIO_50 B-PD:nppukp Wakeup UART5_TXD 34 GPIO_16 B-PD:nppukp UART5_RXD 35 GPIO_17 B-PD:nppukp UART5_CTS 36 GPIO_18 B-PD:nppukp
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Smart Module Series 3.14. I2C Interfaces SC200R series module provides four I2C interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The SENSOR_I2C interface only supports sensors of ADSP architecture. CAM_I2C and DCAM_I2C signals are controlled by Linux Kernel code and support connection with devices related to video output. Table 19: Pin Definition of I2C Interfaces Pin Name Pin No.
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Smart Module Series UART5_CTS 36 DO SPI5 chip select Can be multiplexed into SPI5_CS GPIO_22 117 DO SPI6 chip select Can be multiplexed into SPI6_CS GPIO_23 116 DO SPI6 clock Can be multiplexed into SPI6_CLK GPIO_20 119 DO SPI6 data output Can be multiplexed into SPI6_MOSI GPIO_21 118 DI SPI6 data input Can be multiplexed into SPI6_MISO GPIO_87 105 DO SPI7 chip select Can be multiplexed into SPI7_CS GPIO_85 265 DO SPI7 data output Can be multiplexed into SPI7_MOSI GPIO_88
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Smart Module Series The motor is driven by an exclusive circuit, and a reference circuit is shown below. 3V3 1 C1 C2 1 μF NM VIB+ D1 4 VIB_DRV_N VIBMotor Module Figure 18: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_N is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.18.
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Smart Module Series DSI_LN0_N 54 AO LCD MIPI data 0 (-) DSI_LN0_P 55 AO LCD MIPI data 0 (+) DSI_LN1_N 56 AO LCD MIPI data 1 (-) DSI_LN1_P 57 AO LCD MIPI data 1 (+) DSI_LN2_N 58 AO LCD MIPI data 2 (-) DSI_LN2_P 59 AO LCD MIPI data 2 (+) DSI_LN3_N 60 AO LCD MIPI data 3 (-) DSI_LN3_P 61 AO LCD MIPI data 3 (+) A reference circuit for the LCM interface is shown below. 1 μF 1.
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Smart Module Series MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens.
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Smart Module Series TP_INT 30 DI TP interrupt 1.8 V voltage domain. TP_RST 31 DO TP reset 1.8 V voltage domain. Active low. TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data Externally pull them up to 1.8 V. Can be used for other I2C devices. A reference circuit for the TP interface is shown below. LDO 6_1V8 R1 LDO17_2V85 R2 2.2K 2.2K 1 2 3 4 5 6 TP_I2C_SDA TP_I2C_SCL TP_RST TP_INT D1 D2 D3 D4 C1 GND C2 SCL 1.8 V RESET 1.8 V INT 1.8 V GND VDD 2.85 V D5 4.
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Smart Module Series 3.20. Camera Interfaces Based on MIPI_CSI standard, SC200R series module supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 13 MP. The video and photo quality is determined by various factors such as the camera sensor, camera lens quality, etc. Table 25: Pin Definition of Camera Interface Pin Name Pin No. I/O Description Comment LDO6_1V8 125 PO 1.
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Smart Module Series CSI0_LN2_N 160 AI Camera MIPI data 2 (-) CSI0_LN2_P 199 AI Camera MIPI data 2 (+) CSI0_LN3_N 161 AI Camera MIPI data 3 (-) CSI0_LN3_P 200 AI Camera MIPI data 3 (+) CAM0_MCLK 74 DO Clock of camera CAM1_MCLK 75 DO Clock of camera CAM0_RST 79 DO Reset of camera CAM0_PWDN 80 DO Power down of camera CAM1_RST 81 DO Reset of camera CAM1_PWDN 82 DO Power down of camera CAM_I2C_SCL 83 OD I2C clock of camera CAM_I2C_SDA 84 OD I2C data of camera CAM2
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Smart Module Series The following is a reference circuit design for 3-camera applications. 1 μF LDO VBAT GPIO IN OUT EN GND AF_VDD 4.7μF 4.7μF 1 μF 1 μF LDO17_2V85 1 μF OUT AVDD EN GND DVDD EMI EMI EMI EMI EMI 1 μF DOVDD AVDD 4.7 μF DVDD 1μF CSI1_LN0_P EMI CSI1_LN0_N CSI1_LN1_P CSI1_LN1_N EMI CSI1_LN2_P CSI1_LN2_N CSI1_LN3_P CSI1_LN3_N CAM1_RST CAM1_PWDN CAM1_MCLK CAM_I2C_SDA _ CAM_I2C_SCL camera0 connector CAM0_ RST CAM0_ PWDN CAM0_ MCLK CSI1_ CLK_P CSI1_ CLK_N LDO6_1V8 2.
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Smart Module Series NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as CLK_P and CLK_N of camera1, CSI1_LN2_P and CSI1_LN2_N are used as the LN_P and LN_N of camera1. 3.20.1. Design Considerations ⚫ ⚫ ⚫ ⚫ Special attention should be paid to the pin definition of LCM/camera connectors. Make sure the module and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate of up to 2.1 Gbps. The differential impedance should be controlled to 100 Ω.
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Smart Module Series 61 DSI_LN3_P 12.35 63 CSI1_CLK_N 18.10 64 CSI1_CLK_P 18.05 65 CSI1_LN0_N 18.05 66 CSI1_LN0_P 18.10 67 CSI1_LN1_N 18.15 -0.05 0.05 0.05 68 CSI1_LN1_P 18.20 70 CSI1_LN3_N 18.10 71 CSI1_LN3_P 18.20 72 CSI1_LN2_N 18.05 0.10 0.05 73 CSI1_LN2_P 18.10 157 CSI0_CLK_N 22.60 196 CSI0_CLK_P 22.55 158 CSI0_LN0_N 22.55 -0.05 -0.05 197 CSI0_LN0_P 22.50 159 CSI0_LN1_N 20.25 198 CSI0_LN1_P 20.30 160 CSI0_LN2_N 20.50 0.05 0.
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Smart Module Series 3.21. Sensor Interfaces SC200R series module supports communication with sensors via I2C interfaces, and it supports ALS/PS, compass, accelerometer, gyroscope, etc. Table 27: Pin Definition of Sensor Interfaces Pin Name Pin No.
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Smart Module Series MIC3_P 148 AI Microphone input for channel 2 (+) MIC_BIAS1 147 AO Microphone bias voltage 1 EAR_P 8 AO Earpiece output (+) EAR_N 9 AO Earpiece output (-) SPK_P 10 AO Speaker output (+) SPK_N 11 AO Speaker output (-) HPH_R 136 AO Headphone right channel output HPH_REF 137 AO Headphone reference ground HPH_L 138 AO Headphone left channel output HS_DET 139 AI Headset hot-plug detect ⚫ ⚫ ⚫ ⚫ ⚫ VO = 1.6–2.85 V High level by default.
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Smart Module Series C4 F1 MIC_BIAS1 100nF R1 MIC_ GND 2 3 0R C1 33 pF R2 Module GND OUT 4 MIC3_P 0R 1 VDD GND C2 D1 MEMS MIC 33 pF Figure 24: Reference Circuit Design for MEMS Microphone Interface 3.22.2.
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Smart Module Series 3.22.3. Reference Circuit Design for Headset Interface R1 MIC_GND 0R MIC2_P F1 HPH_L HS_DET R2 20K F3 HPH_R HPH_REF C3 Module 1 5 4 3 6 2 F2 C4 F4 C5 D1 D2 D3 D4 R3 33 pF 33 pF 33 pF 0R ESD Figure 26: Reference Circuit Design for Headphone Interface 3.22.4. Reference Circuit Design for Loudspeaker Interface F1 SPK_P EARP F2 EA SPK_N RN C1 C2 33 pF 33 pF D1 D2 Module Figure 27: Reference Circuit Design for Loudspeaker Interface 3.22.5.
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Smart Module Series technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results.
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Smart Module Series 4 Wi-Fi and Bluetooth SC200R series module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 Ω. You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. 4.1. Wi-Fi Overview SC200R series module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n standard protocols.
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Smart Module Series 802.11n HT20 MCS7 13 dBm ±2.5 dB 802.11n HT40 MCS0 14 dBm ±2.5 dB 802.11n HT40 MCS7 13 dBm ±2.5 dB 802.11a 6 Mbps 15 dBm ±2.5 dB 802.11a 54 Mbps 13 dBm ±2.5 dB 802.11n HT20 MCS0 14 dBm ±2.5 dB 802.11n HT20 MCS7 13 dBm ±2.5 dB 802.11n HT40 MCS0 14 dBm ±2.5 dB 802.11n HT40 MCS7 13 dBm ±2.5 dB Standard Rate Sensitivity 802.11b 1 Mbps -96 802.11b 11 Mbps -87 802.11g 6 Mbps -90 802.11g 54 Mbps -73 802.11n HT20 MCS0 -89 802.
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Smart Module Series 802.11n HT40 MCS7 -70 Reference specifications are listed below: ⚫ ⚫ IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth Overview SC200R series module supports Bluetooth 4.2 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK modulation modes. ⚫ ⚫ ⚫ Maximally supports up to 7 wireless connections.
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Smart Module Series 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of SC200R series module. Table 32: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 10.0 10.0 9.
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Smart Module Series 5 GNSS SC200R series module integrates a IZat™ GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Table 33: GNSS Performance Parameter Sensitivity TTFF Static Drift Description Typ.
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Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below: ⚫ ⚫ ⚫ ⚫ ⚫ Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference.
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Smart Module Series 6 Antenna Interfaces SC200R series module provides four antenna interfaces for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna respectively. The impedance of the antenna ports should be controlled to 50 Ω. 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No.
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Smart Module Series LTE-FDD B1 2110–2170 1920–1980 MHz LTE-FDD B3 1805–1880 1710–1785 MHz LTE-FDD B5 869–894 824–849 MHz LTE-FDD B8 925–960 880–915 MHz LTE-TDD B34 2010–2025 2010–2025 MHz LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B39 1880–1920 1880–1920 MHz LTE-TDD B40 2300–2400 2300–2400 MHz LTE-TDD B41 2535–2675 2535–2675 MHz Table 36: SC200R-EM Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869–894 824–849 MHz EGSM900 925–960 880–915 MHz DC
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Smart Module Series LTE-FDD B5 869–894 824–849 MHz LTE-FDD B7 2620–2690 2500–2570 MHz LTE-FDD B8 925–960 880–915 MHz LTE-FDD B20 791–821 832–862 MHz LTE-FDD B28 (A + B) 758–803 703–748 MHz LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B40 2300–2400 2300–2400 MHz LTE-TDD B41 2496–2690 2496–2690 MHz Table 37: SC200R-NA Operating Frequencies 3GPP Band Receive Transmit Unit WCDMA B2 1930–1990 1850–1910 MHz WCDMA B4 2110–2155 1710–1755 MHz WCDMA B5 869–894 824–849 MH
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Smart Module Series LTE-FDD B71 663–698 617–652 MHz LTE-TDD B41 2496–2690 2496–2690 MHz Table 38: SC200R-JP* Operating Frequencies 3GPP Band Receive Transmit Unit WCDMA B1 2110–2170 1920–1980 MHz WCDMA B6 875–885 830–840 MHz WCDMA B8 925–960 880–915 MHz WCDAM B19 875–890 830–845 MHz LTE-FDD B1 2110–2170 1920–1980 MHz LTE-FDD B3 1805–1880 1710–1785 MHz LTE-FDD B5 869–894 824–849 MHz LTE-FDD B8 925–960 880–915 MHz LTE-FDD B11 1428–1447 1475–1495 MHz LTE-FDD B18
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Smart Module Series Main antenna R1 0R ANT_MAIN C1 C2 NM NM DRX antenna R2 0R ANT_DRX Module C3 C4 NM NM Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 39: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No.
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Smart Module Series A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 Ω. R1 Wi-Fi/ Bluetooth antenna 0R ANT_WIFI/BT C1 C2 NM NM Module Figure 30: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 41: Pin Definition of GNSS Antenna Interface Pin Name Pin No.
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Smart Module Series 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below.
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Smart Module Series 6.4. Reference Design for RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance.
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Smart Module Series Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground.
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Smart Module Series 6.5. Antenna Installation 6.5.1. Antenna Requirements The following table shows the requirement on the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna and GNSS antenna.
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Smart Module Series NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.5.2. Recommended RF Connector for Antenna Installation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 37: Dimensions of the U.
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Smart Module Series U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 38: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connectors. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.
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Smart Module Series 7 Electrical, Reliability and Radio Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 44: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT -0.5 6 V USB_VBUS -0.5 16 V Peak Current of VBAT 0 3 A Voltage on Digital Pins -0.3 2.16 V 7.2.
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Smart Module Series IVBAT Peak supply current (during transmission slot) USB_VBUS USB power supply VRTC Power supply voltage of the backup battery Maximum power control level at EGSM900 1.8 3.0 A 4.35 5.0 6.2 V 2.0 3.0 3.25 V 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 46: Operating and Storage Temperatures Parameter Min. Typ. Max.
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Smart Module Series supply current WCDMA supply current CDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep (USB disconnected) @ DRX = 5 4.82 mA Sleep (USB disconnected) @ DRX = 9 4.55 mA Sleep (USB disconnected) @ DRX = 6 4.60 mA Sleep (USB disconnected) @ DRX = 7 4.55 mA Sleep (USB disconnected) @ DRX = 8 3.70 mA Sleep (USB disconnected) @ DRX = 9 3.60 mA BC0 CH283 @ Slot Cycle Index = 1 4.80 mA BC0 CH283 @ Slot Cycle Index = 7 5.
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Smart Module Series EGSM900 (2UL/3DL) @ PCL 5 380.1 mA EGSM900 (3UL/2DL) @ PCL 5 455 mA EGSM900 (4UL/1DL) @ PCL 5 555.6 mA DCS1800 (1UL/4DL) @ PCL 0 175.1 mA DCS1800 (2UL/3DL) @ PCL 0 266.2 mA DCS1800 (3UL/2DL) @ PCL0 338.4 mA DCS1800 (4UL/1DL) @ PCL 0 427.5 mA EGSM900 (1UL/4DL) @ PCL 8 181.9 mA EGSM900 (2UL/3DL) @ PCL 8 305.6 mA EGSM900 (3UL/2DL) @ PCL 8 421.4 mA EGSM900 (4UL/1DL) @ PCL 8 562.5 mA DCS1800 (1UL/4DL) @ PCL 2 163.2 mA DCS1800 (2UL/3DL) @ PCL 2 274.
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Smart Module Series LTE-TDD B38 @ max. power 380.3 mA LTE-TDD B39 @ max. power 382.1 mA LTE-TDD B40 @ max. power 439.3 mA LTE-TDD B41 @ max. power 436.5 mA Table 48: SC200R-EM Current Consumption Description Conditions Typ. Unit OFF state Power down 20 μA Sleep (USB disconnected) @ DRX = 2 3.9 mA Sleep (USB disconnected) @ DRX = 5 2.9 mA Sleep (USB disconnected) @ DRX = 9 2.6 mA Sleep (USB disconnected) @ DRX = 6 4.1 mA Sleep (USB disconnected) @ DRX = 8 3.
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Smart Module Series WCDMA voice call GPRS data transfer EGSM900 @ PCL 19 94.6 mA DCS1800 @ PCL 0 201.7 mA DCS1800 @ PCL 7 155.4 mA DCS1800 @ PCL 15 150.3 mA PCS1900 @ PCL 0 200.3 mA PCS1900 @ PCL 7 155.4 mA PCS1900 @ PCL 15 151.1 mA B1 @ max. power 559.4 mA B2 @ max. power 583 mA B4 @ max. power 587.6 mA B5 @ max. power 511.9 mA B8 @ max. power 558.7 mA GSM850 (1UL/4DL) @ PCL 5 278.8 mA GSM850 (2UL/3DL) @ PCL 5 414.2 mA GSM850 (3UL/2DL) @ PCL 5 495.
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Smart Module Series PCS1900 (2UL/3DL) @ PCL 0 279.2 mA PCS1900 (3UL/2DL) @ PCL0 361.2 mA PCS1900 (4UL/1DL) @ PCL 0 453.3 mA GSM850 (1UL/4DL) @ PCL 8 210.64 mA GSM850 (2UL/3DL) @ PCL 8 337.6 mA GSM850 (3UL/2DL) @ PCL 8 454.4 mA GSM850 (4UL/1DL) @ PCL 8 579.1 mA EGSM900 (1UL/4DL) @ PCL 8 209.1 mA EGSM900 (2UL/3DL) @ PCL 8 333.5 mA EGSM900 (3UL/2DL) @ PCL 8 454.2 mA EGSM900 (4UL/1DL) @ PCL 8 578.9 mA DCS1800 (1UL/4DL) @ PCL 2 197.3 mA DCS1800 (2UL/3DL) @ PCL 2 304.
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Smart Module Series B2 (HSUPA) @ max. power 566.8 mA B4 (HSUPA) @ max. power 566.2 mA B5 (HSUPA) @ max. power 493.1 mA B8 (HSUPA) @ max. power 522.3 mA LTE-FDD B1 @ max. power 728.1 mA LTE-FDD B2 @ max. power 723 mA LTE-FDD B3 @ max. power 732.4 mA LTE-FDD B4 @ max. power 758.7 mA LTE-FDD B5 @ max. power 615.5 mA LTE-FDD B7 @ max. power 826.9 mA LTE-FDD B8 @ max. power 642.7 mA LTE-FDD B20 @ max. power 677.9 mA LTE-FDD B28 @ max. power 764.5 mA LTE-TDD B38 @ max.
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Smart Module Series LTE-TDD supply current WCDMA voice call Sleep (USB disconnected) @ DRX = 9 3.011 mA Sleep (USB disconnected) @ DRX = 6 6.954 mA Sleep (USB disconnected) @ DRX = 8 3.611 mA Sleep (USB disconnected) @ DRX = 9 2.897 mA B2 @ max. power 603.0 mA B4 @ max. power 659.3 mA B5 @ max. power 586.1 mA B2 (HSDPA) @ max. power 617.1 mA B4 (HSDPA) @ max. power 608.5 mA B5 (HSDPA) @ max. power 541.7 mA B2 (HSUPA) @ max. power 631.8 mA B4 (HSUPA) @ max. power 608.
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Smart Module Series LTE-TDD B41 @ max. power 469.1 mA Table 50: SC200R-JP* Current Consumption Description Conditions Typ.
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Smart Module Series LTE data transfer B19 (HSUPA) @ max. power TBD mA LTE-FDD B1 @ max. power TBD mA LTE-FDD B3 @ max. power TBD mA LTE-FDD B5 @ max. power TBD mA LTE-FDD B8 @ max. power TBD mA LTE-FDD B11 @ max. power TBD mA LTE-FDD B18 @ max. power TBD mA LTE-FDD B19 @ max. power TBD mA LTE-FDD B21 @ max. power TBD mA LTE-FDD B26 @ max. power TBD mA LTE-FDD B28 @ max. power TBD mA LTE-TDD B41 @ max. power TBD mA 7.5.
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Smart Module Series LTE-FDD B5 23 dBm ±2 dB < -39 dBm LTE-FDD B8 23 dBm ±2 dB < -39 dBm LTE-TDD B34 23 dBm ±2 dB < -39 dBm LTE-TDD B38 23 dBm ±2 dB < -39 dBm LTE-TDD B39 23 dBm ±2 dB < -39 dBm LTE-TDD B40 23 dBm ±2 dB < -39 dBm LTE-TDD B41 23 dBm ±2 dB < -39 dBm Table 52: SC200R-EM RF Output Power Frequency Max. Min.
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Smart Module Series LTE-FDD B8 23 dBm ±2 dB < -39 dBm LTE-FDD B20 23 dBm ±2 dB < -39 dBm LTE-FDD B28 23 dBm ±2 dB < -39 dBm LTE-TDD B38 23 dBm ±2 dB < -39 dBm LTE-TDD B40 23 dBm ±2 dB < -39 dBm LTE-TDD B41 23 dBm ±2 dB < -39 dBm Table 53: SC200R-NA RF Output Power Frequency Max. Min.
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Smart Module Series Table 54: SC200R-JP* RF Output Power Frequency Max. Min. WCDMA B1 TBD TBD WCDMA B6 TBD TBD WCDMA B8 TBD TBD WCDMA B19 TBD TBD LTE-FDD B1 TBD TBD LTE-FDD B3 TBD TBD LTE-FDD B5 TBD TBD LTE-FDD B8 TBD TBD LTE-FDD B11 TBD TBD LTE-FDD B18 TBD TBD LTE-FDD B19 TBD TBD LTE-FDD B21 TBD TBD LTE-FDD B26 TBD TBD LTE-FDD B28 TBD TBD LTE-TDD B41 TBD TBD NOTE In GPRS 4-slot Tx mode, the maximum output power is reduced by 3 dB.
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Smart Module Series Table 55: SC200R-CE RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109 - - -102.4 dBm DCS1800 -109 - - -102.4 dBm WCDMA B1 -109 -109.5 TBD -106.7 dBm WCDMA B8 -110 -110 TBD -103.7 dBm EVDO/CDMA BC0 -109.5 - - -104 dBm LTE-FDD B1 (10 MHz) -97.6 -99 -101.2 -96.3 dBm LTE-FDD B3 (10 MHz) -97.2 -96 -99.2 -93.3 dBm LTE-FDD B5 (10 MHz) -99.2 -100 -102.8 -94.3 dBm LTE-FDD B8 (10 MHz) -97.
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Smart Module Series WCDMA B1 -109.5 -111 TBD -106.7 dBm WCDMA B2 -110 109.5 TBD -104.7 dBm WCDMA B4 -110 -109.5 TBD -106.7 dBm WCDMA B5 -111.5 -111 TBD -104.7 dBm WCDMA B8 -111 -111.5 TBD -103.7 dBm LTE-FDD B1 (10 MHz) -98.2 -99.5 -100.5 -96.3 dBm LTE-FDD B2 (10 MHz) -98.2 -98.2 -100.5 -94.3 dBm LTE-FDD B3 (10 MHz) -97.8 -97.8 -100 -93.3 dBm LTE-FDD B4 (10 MHz) -98.2 -99.5 -101.5 -96.3 dBm LTE-FDD B5 (10 MHz) -100 -100.5 -101.5 -94.
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Smart Module Series LTE-FDD B4 (10 MHz) -98.4 -98.9 -101.4 -96.3 dBm LTE-FDD B5 (10 MHz) -99.8 -100.9 -103.8 -94.3 dBm LTE-FDD B7 (10 MHz) -97.6 -98.9 -101.3 -93.3 dBm LTE-FDD B12 (10 MHz) -98.8 -98.8 -102.2 -93.3 dBm LTE-FDD B13 (10 MHz) -99.8 -99.3 -102.6 -93.3 dBm LTE-FDD B14 (10 MHz) -98.9 -98.8 -101.9 -93.3 dBm LTE-FDD B17 (10 MHz) -97.6 -99 -101.7 -93.3 dBm LTE-FDD B25 (10 MHz) -98.4 -99.3 -101.6 -92.8 dBm LTE-FDD B26 (10 MHz) -99.8 -100.8 -103.6 -93.
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Smart Module Series LTE-FDD B18 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B19 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B21 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B26 (10 MHz) TBD TBD TBD -93.8 dBm LTE-FDD B28 (10 MHz) TBD TBD TBD -94.8 dBm LTE-TDD B41 (10 MHz) TBD TBD TBD -94.3 dBm 7.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general.
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Smart Module Series 8 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are ±0.2 mm. 8.1.
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Smart Module Series Figure 41: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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Smart Module Series 8.2. Recommended Footprint Figure 42: Recommended Footprint (Top View) NOTES 1. 2. For easy maintenance of the module, keep at least 5 mm between the module and other components on the host PCB. All RESERVED pins should be kept open and MUST NOT be connected to ground.
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Smart Module Series 8.3. Top and Bottom Views of the Module Figure 43: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.
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Smart Module Series 9 9.1. Storage, Manufacturing and Packaging Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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Smart Module Series NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. 2.
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Smart Module Series Temp. (°C) Reflow Zone Max slope: 2~3 °C/s 246 235 217 200 B C Cooling down slope: -1.
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Smart Module Series NOTE If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 9.3. Packaging SC200R series module is packaged in tape and reel carriers, and sealed in the vacuum-sealed bag. It is not recommended to open the vacuum package before using the module for actual production. Each reel is 380 mm in diameter and contains 200 modules.
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Smart Module Series Figure 46: Reel Dimensions (Unit: mm) Table 61: Reel Packaging Model Name SC200R series MOQ for MP Minimum Package: 200 pcs Minimum Package × 4 = 800 pcs 200 pcs Size: 405 mm × 390 mm × 83 mm N.W.: 1.9 kg G.W.: 3.7 kg Size: 425 mm × 358 mm × 410 mm N.W.: 7.6 kg G.W.: 15.
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Smart Module Series 10 Appendix References Table 62: Related Documents SN Document Name Description [1] Quectel_Smart_EVB_G2_User_Guide Smart EVB G2 User Guide [2] Quectel_SC200R_Series_Pin_Description_and _GPIO_Configuration SC200R Series Pin Description and GPIO Configuration [3] Quectel_RF_Layout_Application_Note RF Layout Application Note [4] Quectel_Module_Secondary_SMT_Application _Note Module Secondary SMT Application Note [5] Quectel_SC200R_Series_Reference_Design SC200R Series Ref
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Smart Module Series CDMA Code Division Multiple Access CEP Circular Error Probable CMOS Complementary Metal-Oxide-Semiconductor CPE Customer-Premise Equipment CS Coding Scheme CSD Circuit Switched Data CSI Camera Serial Interface CTS Clear to Send DC Dual Carrier DCS Digital Cellular System DL Downlink DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying DRX Discontinuous Reception DSI Display Serial Interface DSP Digital Signal Proc
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Smart Module Series ETSI European Telecommunications Standards Institute EVB Evaluation Board EV-DO/EVDO Evolution-Data Optimized EVRC Enhanced Variable Rate Codec FDD Frequency Division Duplex FEM Front End Module fps Frame per Second FR Full Rate GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General Purpose Input/Output GPRS General Packet Radio Service GP
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Smart Module Series HSUPA High Speed Uplink Packet Access HT High Throughput IC Integrated Circuit IEEE Institute of Electrical and Electronics Engineers I/O Input/Output I2C Inter-Integrated Circuit IMT-2000 International Mobile Telecommunications for the year 2000 IOmax Maximum Output Load Current LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier L
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Smart Module Series MPP Multi Purpose Pin MSL Moisture Sensitivity Levels N.W.
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Smart Module Series RoHS Restriction of Hazardous Substances RTC Real Time Clock RTS Request to Send SAW Surface Acoustic Wave SCO Synchronous Connection Oriented SD Secure Digital SIMO Single Input Multiple Output SMD Surface Mounting Device SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface STA Station TDD Time-Division Duplex TP Touch Panel TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver & T
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Smart Module Series VI Voltage Input VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VO Voltage Output VOmax Maximum Output Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value WAPI WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network XO Crystal Oscillator SC200R&SC262R_