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EC200T-AU Series

Hardware Design

LTE Standard Module Series

Version: 1.1

Date: 2020-08-10

Status: Released

www.quectel.com

Summary of content (102 pages)

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EC200T-AU Series Hardware Design LTE Standard Module Series Version: 1.1 Date: 2020-08-10 Status: Released www.quectel.
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LTE Standard Module Series EC200T Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm.
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LTE Standard Module Series EC200T Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2019-09-12 Jaye SANG/ Niko WU Initial 1. 2. 3. 4. 5. 6. 7. 1.1 2020-08-10 Jaye SANG/ Owen WEI 8. 9. 10. 11. EC200T_Series_Hardware_Design Added related information of EC200T-AU. Deleted B5 of EC200T-EU. Updated the storage of SMS (Table 2) Updated the pin assignment diagram (Figure 2). Updated the pin description (Table 5).
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LTE Standard Module Series EC200T Series Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ...........................................................................................................................
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LTE Standard Module Series EC200T Series Hardware Design 3.17. Behaviors of the MAIN_RI..................................................................................................... 55 3.18. FORCE_USB_BOOT Interface ............................................................................................. 55 4 Antenna Interfaces .......................................................................................................................... 58 4.1. Main/Rx-diversity Antenna Interfaces ..
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LTE Standard Module Series EC200T Series Hardware Design Table Index Table 1: Frequency Bands of EC200T-CN Module .................................................................................. 14 Table 2: Frequency Bands of EC200T-EU Module .................................................................................. 14 Table 3: Frequency Bands of EC200T-AU* Module................................................................................. 15 Table 4: Key Features of EC200T series Module ....
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LTE Standard Module Series EC200T Series Hardware Design Table 40: EC200T-CN Conducted RF Receiving Sensitivity .................................................................... 81 Table 41: EC200T-EU Conducted RF Receiving Sensitivity .................................................................... 82 Table 42: EC200T-AU* Conducted RF Receiving Sensitivity ..................................................................
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LTE Standard Module Series EC200T Series Hardware Design Figure Index Figure 2: EC200T Series Module Pin Assignment (Top View) ................................................................. 20 Figure 3: Sleep Mode Application via UART............................................................................................ 30 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 31 Figure 5: Sleep Mode Application with MAIN_RI .......
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LTE Standard Module Series EC200T Series Hardware Design Figure 43: Tape Specifications................................................................................................................. 92 Figure 44: Reel Specifications ................................................................................................................. 92 Figure 45: Tape and Reel Directions .......................................................................................................
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LTE Standard Module Series EC200T Series Hardware Design 1 Introduction This document defines the EC200T series module and describes its air interface and hardware interfaces which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC200T series module.
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LTE Standard Module Series EC200T Series Hardware Design ❒ WCDMA Band II/LTE Band2/ LTE Band 7 :≤8.000dBi ❒ WCDMA Band IV/ LTE Band 4 / LTE Band 66:≤5.000dBi ❒ WCDMA Band V / LTE Band 5:≤9.541dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
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LTE Standard Module Series EC200T Series Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
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LTE Standard Module Series EC200T Series Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC200T series module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product.
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LTE Standard Module Series EC200T Series Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders.
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LTE Standard Module Series EC200T Series Hardware Design 2 Product Concept 2.1. General Description EC200T is a series of LTE-FDD, LTE-TDD, WCDMA and GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD, LTE-TDD, HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS networks. It also provides voice functionality for your specific applications. EC200T series contains 3 variants: EC200T-CN, EC200T-EU and EC200T-AU*.
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LTE Standard Module Series EC200T Series Hardware Design Table 3: Frequency Bands of EC200T-AU* Module Network Type Bands LTE-FDD (with Rx-diversity)1) B1/B2/B3/B4/B5/B7/B8/B28/B66 LTE-TDD (with Rx-diversity)1) B40 WCDMA B1/B2/B4/B5/B8 GSM 850/900/1800/1900 MHz With a compact profile of 29.0 mm × 32.0 mm × 2.
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LTE Standard Module Series EC200T Series Hardware Design LTE Features Supports up to non-CA Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports MIMO in DL direction FDD: Max. 150 Mbps (DL), Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL), Max. 30 Mbps (UL) UMTS Features Supports 3GPP R7 HSDPA, HSUPA, HSPA+ and WCDMA Supports QPSK, 16-QAM modulation HSPA+: Max. 21 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL), Max.
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LTE Standard Module Series EC200T Series Hardware Design UART Interfaces Supports USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1–4.14, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART: Used for AT command communication and data transmission Baud rates reach up to 1 Mbps, 115200 bps by default Supports RTS and CTS hardware flow control Debug UART: Used for the output of partial logs 115200 bps baud rate SD Card Interface Supports SD 3.0 protocol WLAN Interface* Supports SDIO 3.
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LTE Standard Module Series EC200T Series Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EC200T series and illustrates the major functional parts.      Power management Baseband Flash Radio frequency Peripheral interfaces 2.4. Evaluation Board In order to help you develop applications with EC200T series, Quectel provides an evaluation board (UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.
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LTE Standard Module Series EC200T Series Hardware Design 3 Application Interfaces 3.1. General Description EC200T series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces.
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LTE Standard Module Series EC200T Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC200T series module. Figure 1: EC200T Series Module Pin Assignment (Top View) NOTES 1. 2. 3. 4. 1) Pin FORCE_USB_BOOT cannot be pulled up before startup. Other unused and RESERVED pins are kept open, and all GND pins are connected to the ground network. GND pins 85–112 should be connected to ground in the design.
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LTE Standard Module Series EC200T Series Hardware Design 3.3. Pin Description The following tables show the pin definition of EC200T series module. Table 5: I/O Parameters Definition Type Description AI Analog Input AO Analog Output DI Digital Input DO Digital Output IO Bidirectional OD Open Drain PI Power Input PO Power Output Table 6: Pin Description Power Supply Input Pin Name VBAT_BB Pin No.
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LTE Standard Module Series EC200T Series Hardware Design Pin Name VDD_EXT Pin No. 7 I/O Description DC Characteristics Comment Power supply for external GPIO’s pull-up circuits. If unused, keep it open. PO Provide 1.8 V for external circuit Vnorm = 1.8 V IOmax = 50 mA Power on/off Pin Name Pin No. I/O Description DC Characteristics Comment RESET_N 20 DI Reset the module VILmax = 0.5 V If unused, keep it open. PWRKEY 21 DI Turn on/off the module VILmax = 0.5 V VBAT power domain.
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LTE Standard Module Series EC200T Series Hardware Design (U)SIM Interface Pin Name Pin No. USIM_GND 10 USIM_DET 13 I/O Description DC Characteristics Connect (U)SIM card connector GND. Specified ground for (U)SIM DI (U)SIM card hot-plug detect Comment VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. IOmax = 50 mA USIM_VDD 14 PO (U)SIM card power supply For 1.8 V (U)SIM: Vmax = 1.9 V Vmin = 1.7 V For 3.0 V (U)SIM: Vmax= 3.
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LTE Standard Module Series EC200T Series Hardware Design Main UART Interface Pin Name MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS Pin No. 62 63 64 65 I/O Description DC Characteristics Comment DO Main UART ring indication VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. DO Main UART clear to send VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain.
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LTE Standard Module Series EC200T Series Hardware Design ADC0 45 AI General-purpose ADC interface Voltage range: 0 V to VBAT_BB If unused, keep it open. I/O Description DC Characteristics Comment PCM data input VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. PCM data output VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.
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LTE Standard Module Series EC200T Series Hardware Design open. SD Card Interface Pin Name SD_DET* SD_SDIO_ DATA3 SD_SDIO_ DATA2 SD_SDIO_ DATA1 SD_SDIO_ DATA0 SD_SDIO_ CLK SD_SDIO_ CMD SD_SDIO_ VDD Pin No. 23 28 29 30 31 32 33 34 I/O Description DC Characteristics Comment SD card detect 1.8/2.8 V power domain. If unused, keep it open. SD card SDIO data bit 3 1.8/2.8 V power domain. If unused, keep it open. SD card SDIO data bit 2 1.8/2.8 V power domain. If unused, keep it open.
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LTE Standard Module Series EC200T Series Hardware Design WLAN_PWR_ EN WLAN_SDIO_ DATA3 WLAN_SDIO_ DATA2 WLAN_SDIO_ DATA1 WLAN_SDIO_ DATA0 WLAN_SDIO_ CLK WLAN_SDIO_ CMD WLAN_WAKE WLAN_EN 127 129 130 131 132 133 134 135 136 WLAN power supply enable control VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. WLAN SDIO data bit 3 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain.
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LTE Standard Module Series EC200T Series Hardware Design RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment 50 Ω impedance. If unused, keep it open. 50 Ω impedance. ANT_DIV 35 AI Diversity antenna interface ANT_MAIN 49 IO Main antenna interface I/O Description DC Characteristics Comment Wake up the module VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. Application processor ready VILmin = -0.
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LTE Standard Module Series EC200T Series Hardware Design NOTE “*” means under development. 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 7: Overview of Operating Modes Modes Normal Operation Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing.
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LTE Standard Module Series EC200T Series Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to let the module enter sleep mode.   Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host.
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LTE Standard Module Series EC200T Series Hardware Design Figure 3: Sleep Mode Application with USB Remote Wakeup   Sending data to EC200T series through USB will wake up the module. When EC200T series has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. 3.5.1.3.
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LTE Standard Module Series EC200T Series Hardware Design 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB Suspend function, please disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode.    Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host.
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LTE Standard Module Series EC200T Series Hardware Design Software: AT+CFUN= command provides the choice of the functionality level through setting into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode; both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. 3.6. Power Supply 3.6.1. Power Supply Pins EC200T series provides four VBAT pins dedicated to connecting with the external power supply.
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LTE Standard Module Series EC200T Series Hardware Design Figure 6: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins.
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LTE Standard Module Series EC200T Series Hardware Design The following figure shows a reference design for +5 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 8: Reference Circuit of Power Supply 3.7. Power-on/off/Reset Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 9: Pin Description of PWRKEY Pin Name Pin No.
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LTE Standard Module Series EC200T Series Hardware Design Figure 9: Reference Circuit of Turing on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure.
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LTE Standard Module Series EC200T Series Hardware Design The timing of turning on the module is illustrated in the following figure. NOTE 1 VBAT ≥ 500 ms PWRKEY VIL ≤ 0.5 V About 5 ms VDD_EXT ≥ 100 ms. After this time, the pin can be set high level by an external circuit. FORCE_USB_BOOT About 22 ms RESET_N ≥ 10 s STATUS (OD) ≥ 10 s UART I nactive Active ≥ 10 s USB Inactive Active Figure 11: Timing of Turning on Module NOTES 1. 2.
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LTE Standard Module Series EC200T Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. Figure 12: Timing of Turning off Module 3.7.2.2.
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LTE Standard Module Series EC200T Series Hardware Design Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N ≥ 300 ms 4.
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LTE Standard Module Series EC200T Series Hardware Design The timing of resetting module is illustrated in the following figure. Figure 15: Timing of Resetting Module NOTES 1. 2. 3. Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY and RESET_N pins. RESET_N only resets the internal baseband chip of the module and does not reset the power management chip. It is recommended to use RESET_N only when failing to turn off the module by AT+QPOWD command or PWRKEY pin.
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LTE Standard Module Series EC200T Series Hardware Design USIM_DATA 15 IO (U)SIM card data USIM_CLK 16 DO (U)SIM card clock USIM_RST 17 DO (U)SIM card reset EC200T series supports (U)SIM card hot-plug via the USIM_DET pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command.
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LTE Standard Module Series EC200T Series Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
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LTE Standard Module Series EC200T Series Hardware Design 3.9. USB Interface EC200T series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface.
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LTE Standard Module Series EC200T Series Hardware Design A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
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LTE Standard Module Series EC200T Series Hardware Design MAIN_RTS 65 DI Main UART request to send MAIN_DTR 66 DI Main UART data terminal ready MAIN_TXD 67 DO Main UART transmit MAIN_RXD 68 DI Main UART receive Table 14: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD 11 DI Debug UART receive DBG_TXD 12 DO Debug UART transmit 1.8 V power domain. If unused, keep it open. The logic levels are described in the following table.
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LTE Standard Module Series EC200T Series Hardware Design Figure 19: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits in dotted lines, see that of the circuits in solid lines, but please pay attention to the direction of connection. Figure 20: Reference Circuit with Transistor Circuit NOTES 1. 2.
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LTE Standard Module Series EC200T Series Hardware Design 3.11. PCM and I2C Interfaces EC200T series provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and EC200T series works as both master and slave. EC200T series works as a master device pertaining to I2C interface. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB.
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LTE Standard Module Series EC200T Series Hardware Design Table 16: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 24 DI PCM data input 1.8 V power domain. If unused, keep it open. PCM_DOUT 25 DO PCM data output 1.8 V power domain. If unused, keep it open. PCM data frame sync 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. PCM clock 1.8 V power domain.
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LTE Standard Module Series EC200T Series Hardware Design NOTE It is recommended to reserve an RC (R=22 Ω, C=22 pF) circuit on the PCM lines, especially for PCM_CLK. 3.12. SD Card Interface EC200T series provides an SD card interface, which complies with SD 3.0 specification. The following table shows the pin definition of SD card interface. Table 17: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_DET* 23 DI SD card detect 1.8/2.8 V power domain.
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LTE Standard Module Series EC200T Series Hardware Design Figure 23: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:        The voltage range of SD card power supply VDD_3V is 2.7–3.6 V and a sufficient current up to 0.8 A should be provided.
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LTE Standard Module Series EC200T Series Hardware Design 3.13. WLAN Interface*① EC200T series supports a SDIO 3.0 interface for WLAN. The following table shows the pin definition of WLAN interface Table 18: Pin Definition of WLAN Interface Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open.
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LTE Standard Module Series EC200T Series Hardware Design  Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. NOTE “*” means under development. “①”means only QuecOpen scheme support 3.14. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 can be used to read the voltage value on ADC0 pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin.
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LTE Standard Module Series EC200T Series Hardware Design 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS for network status indication. The following tables describe pin definition and logic level changes in different network status. Table 21: Pin Definition of Network Connection Status/Activity Indication Pin Name NET_MODE NET_STATUS Pin No.
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LTE Standard Module Series EC200T Series Hardware Design Figure 24: Reference Circuit of Network Status Indication 3.16. STATUS The STATUS pin is an open drain output for module’s operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 23: Pin Definition of STATUS Pin Name STATUS Pin No.
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LTE Standard Module Series EC200T Series Hardware Design NOTE The status pin cannot be used as indication of module shutdown status when VBAT is removed. 3.17. Behaviors of the MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. NOTE The URC can be outputted via UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG command. The default port is USB AT port.
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LTE Standard Module Series EC200T Series Hardware Design Table 25: Pin Definition of FORCE_USB_BOOT Interface Pin Name FORCE_ USB_BOOT Pin No. 115 I/O DI Description Comment Force the module into emergency download mode 1.8 V power domain. Active high. It is recommended to reserve test points. The following figure shows a reference circuit of FORCE_USB_BOOT interface. Figure 26: Reference Circuit of FORCE_USB_BOOT Interface NOTE 1 VBAT ≥ 500 ms PWRKEY VIL ≤ 0.
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LTE Standard Module Series EC200T Series Hardware Design NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up FORCE_USB_BOOT to 1.8 V before powering up VBAT.
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LTE Standard Module Series EC200T Series Hardware Design 4 Antenna Interfaces EC200T series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect. The antenna ports have an impedance of 50 Ω. 4.1. Main/Rx-diversity Antenna Interfaces 4.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below.
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LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B3 1710–1785 1805–1880 MHz LTE-FDD B5 824–849 869–894 MHz LTE-FDD B8 880–915 925–960 MHz LTE-TDD B34 2010–2025 2010–2025 MHz LTE-TDD B38 2570–2620 2570–2620 MHz LTE-TDD B39 1880–1920 1880–1920 MHz LTE-TDD B40 2300–2400 2300–2400 MHz LTE-TDD B41 2555–2655 2555–2655 MHz Table 28: EC200T-EU Operating Frequencies 3GPP Band Transmit Receive Unit EGSM900 880–915 925–960 MHz DCS1800 1710–1785 1805–1880 MHz
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LTE Standard Module Series EC200T Series Hardware Design Table 29: EC200T-AU* Operating Frequencies 3GPP Band Transmit Receive Unit EGSM900 880–915 925–960 MHz GSM850 824–849 869–894 MHz DCS1800 1710–1785 1805–1880 MHz PCS1900 1850–1910 1930–1990 MHz WCDMA B1 1920–1980 2110–2170 MHz WCDMA B2 1850–1910 1930–1990 MHz WCDMA B4 1710–1755 2110–2155 MHz WCDMA B5 824–849 869–894 MHz WCDMA B8 880–915 925–960 MHz LTE-FDD B1 1920–1980 2110–2170 MHz LTE-FDD B2 1850–1910 1
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LTE Standard Module Series EC200T Series Hardware Design 4.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 28: Reference Circuit of RF Antenna Interface NOTES 1. 2. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity.
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LTE Standard Module Series EC200T Series Hardware Design .
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LTE Standard Module Series EC200T Series Hardware Design Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:      Use impedance simulation tool to control the characteristic impedance of RF traces as 50 Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
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LTE Standard Module Series EC200T Series Hardware Design Input impedance: 50 Ω Cable insertion loss: < 1 dB (EGSM900, WCDMA B5, WCDMA B8, LTE-FDD B5/B8/B20/B28) Cable insertion loss: < 1.5 dB (DCS1800, WCDMA B1, LTE B1/B3/B34/B39) Cable insertion loss: < 2 dB (LTE-TDD B7/B38/B40/B41) 4.2.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.
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LTE Standard Module Series EC200T Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.
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LTE Standard Module Series EC200T Series Hardware Design 5 Electrical, Reliability and Radio Characteristics 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 6.0 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.
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LTE Standard Module Series EC200T Series Hardware Design 5.2. Power Supply Ratings Table 32: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.4 3.8 4.5 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.
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LTE Standard Module Series EC200T Series Hardware Design NOTES 1. 2. 1) Within operating temperature range, the module is 3GPP compliant. Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances.
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LTE Standard Module Series EC200T Series Hardware Design WCDMA @ PF = 512 (USB disconnected) 1.75 mA LTE-FDD @ PF = 32 (USB disconnected) 4.21 mA LTE-FDD @ PF = 64 (USB disconnected) 2.59 mA LTE-FDD @ PF = 64 (USB suspend) 2.79 mA LTE-FDD @ PF = 128 (USB disconnected) 1.78 mA LTE-FDD @ PF = 256 (USB disconnected) 1.49 mA LTE-TDD @ PF = 32 (USB disconnected) 4.99 mA LTE-TDD @ PF = 64 (USB disconnected) 3.26 mA LTE-TDD @ PF = 64 (USB suspend) 3.
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LTE Standard Module Series EC200T Series Hardware Design EDGE data transfer WCDMA data transfer LTE data transfer DCS1800 2DL/3UL @ 28.45 dBm 445.9 mA DCS1800 1DL/4UL @ 26.53 dBm 470.3 mA EGSM900 4DL/1UL @ 28.21 dBm 221.8 mA EGSM900 3DL/2UL @ 27.51 dBm 351.8 mA EGSM900 2DL/3UL @ 25.46 dBm 470.2 mA EGSM900 1DL/4UL @ 23.28 dBm 582.1 mA DCS1800 4DL/1UL @ 27.31 dBm 195.8 mA DCS1800 3DL/2UL @ 26.84 dBm 301.1 mA DCS1800 2DL/3UL @ 25.56 dBm 393.9 mA DCS1800 1DL/4UL @ 22.87 dBm 476.
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LTE Standard Module Series EC200T Series Hardware Design GSM voice call WCDMA voice call EGSM900 PCL = 5 @ 32.27 dBm 242.2 mA EGSM900 PCL = 12 @ 19.64 dBm 120.1 mA EGSM900 PCL = 19 @ 5.75 dBm 94.2 mA DCS1800 PCL = 0 @ 29.95 dBm 223.6 mA DCS1800 PCL = 7 @ 16.27 dBm 116.2 mA DCS1800 PCL = 15 @ 1.11 dBm 92.2 mA WCDMA B1 @ 23.57 dBm 646.9 mA WCDMA B5 @ 23.07 dBm 556.1 mA WCDMA B8 @ 23.21 dBm 653.1 mA NOTE “*” means under development.
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LTE Standard Module Series EC200T Series Hardware Design DCS1800 @ DRX = 5（USB suspend） 3.12 mA DCS1800 @ DRX = 9（USB disconnected） 3.38 mA WCDMA @ PF = 64（USB disconnected） 4.18 mA WCDMA @ PF = 64（USB suspend） 3.89 mA WCDMA @ PF = 128（USB disconnected） 2.64 mA WCDMA @ PF = 256（USB disconnected） 2.61 mA WCDMA @ PF = 512（USB disconnected） 4.63 mA LTE-FDD @ PF = 32（USB disconnected） 4.38 mA LTE-FDD @ PF = 64（USB disconnected） 2.99 mA LTE-FDD @ PF = 64（USB suspend） 3.
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LTE Standard Module Series EC200T Series Hardware Design GPRS data transfer EDGE data transfer WCDMA data transfer LTE-FDD @ PF = 64（USB disconnected） 30.20 mA LTE-FDD @ PF = 64（USB connected） 40 mA LTE-TDD @ PF = 64（USB disconnected） 30.6 mA LTE-TDD @ PF = 64（USB connected） 49.83 mA EGSM900 4DL/1UL @ 33.07 dBm 274 mA EGSM900 3DL/2UL @ 33.04 dBm 459 mA EGSM900 2DL/3UL @ 31.29 dBm 529 mA EGSM900 1DL/4UL @ 29.16 dBm 545 mA DCS1800 4DL/1UL @ 31.52 dBm 230 mA DCS1800 3DL/2UL @ 31.
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LTE Standard Module Series EC200T Series Hardware Design LTE data transfer GSM voice call WCDMA voice cal LTE-FDD B1 @ 23.10 dBm 704 mA LTE-FDD B3 @ 23.17 dBm 670 mA LTE-FDD B7 @ 24.41 dBm 890 mA LTE-FDD B8 @ 22.76 dBm 630 mA LTE-FDD B20 @ 24.09 dBm 703 mA LTE-FDD B28 @ 23.9 dBm 738 mA LTE-TDD B38 @ 23.13 dBm 360 mA LTE-TDD B40 @ 23.23 dBm 393 mA LTE-TDD B41 @ 23.81 dBm 391 mA EGSM900 PCL = 5 @ 33.00 dBm 270 mA EGSM900 PCL = 12 @ 19.53 dBm 123 mA EGSM900 PCL = 19 @ 5.
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LTE Standard Module Series EC200T Series Hardware Design Table 36：EC200T-AU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 9 uA AT+CFUN=0（USB disconnected） 1.07 mA EGSM900 @ DRX = 2（USB disconnected） 3.55 mA EGSM900 @ DRX = 5（USB disconnected） 2.45 mA 2.80 mA EGSM900 @ DRX = 9（USB disconnected） 2.87 mA DCS1800 @ DRX = 2（USB disconnected） 3.60 mA DCS1800 @ DRX = 5（USB disconnected） 2.77 mA DCS1800 @ DRX = 5（USB suspend） 2.
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LTE Standard Module Series EC200T Series Hardware Design LTE-FDD @ PF = 256（USB disconnected） 2.34 mA LTE-TDD @ PF = 32（USB disconnected） 5.76 mA LTE-TDD @ PF = 64（USB disconnected） 3.72 mA LTE-TDD @ PF = 64（USB suspend） 3.92 mA LTE-TDD @ PF = 128（USB disconnected） 2.76 mA LTE-TDD @ PF = 256（USB disconnected） 2.72 mA EGSM900 @ DRX = 5（USB disconnected） 30.12 mA EGSM900 @ DRX = 5（USB connected） 49.22 mA WCDMA @ PF = 64（USB disconnected） 31.07 mA WCDMA @ PF = 64（USB connected） 50.
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LTE Standard Module Series EC200T Series Hardware Design EDGE data transfer WCDMA data PCS1900 4DL/1UL @ 30.10 dBm 212.5 mA PCS1900 3DL/2UL @ 30.10 dBm 355.6 mA PCS1900 2DL/3UL @ 28.65 dBm 425.4 mA PCS1900 1DL/4UL @ 26.72 dBm 450.9 mA EGSM850 4DL/1UL @ 33.01 dBm 265.2 mA EGSM850 3DL/2UL @ 32.97 dBm 459.4 mA EGSM850 2DL/3UL @ 31.48 dBm 554.3 mA EGSM850 1DL/4UL @ 29.37 dBm 580.2 mA EGSM900 4DL/1UL @ 28.69 dBm 215.2 mA EGSM900 3DL/2UL @ 28.49 dBm 366.1 mA EGSM900 2DL/3UL @ 25.
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LTE Standard Module Series EC200T Series Hardware Design transfer LTE data transfer GSM voice call WCDMA B1 HSUPA @ 23.10 dBm 729.1 mA WCDMA B2 HSDPA @ 23.73 dBm 835.1 mA WCDMA B2 HSUPA @ 22.24 dBm 761.2 mA WCDMA B4 HSDPA @ 24.29 dBm 767.6 mA WCDMA B4 HSUPA @ 22.59 dBm 689.6 mA WCDMA B5 HSDPA @23.65dBm 643.5 mA WCDMA B5 HSUPA @ 22.79 dBm 631.4 mA WCDMA B8 HSDPA @ 23.94 dBm 677.2 mA WCDMA B8 HSUPA @ 23.22 dBm 653.1 mA LTE-FDD B1 @ 22.89 dBm 737.4 mA LTE-FDD B2 @ 22.
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LTE Standard Module Series EC200T Series Hardware Design WCDMA voice call PCS1900 PCL = 0 @ 30.16 dBm 220.2 mA PCS1900 PCL = 7 @ 16.78 dBm 117.3 mA PCS1900 PCL = 15 @ 1.63 dBm 97.5 mA EGSM850 PCL = 5 @ 32.97 dBm 276.1 mA EGSM850 PCL = 12 @ 19.79 dBm 128.5 mA EGSM850 PCL = 19 @ 6.73 dBm 100.0 mA WCDMA B1 @ 23.42 dBm 718.3 mA WCDMA B2 @ 23.44 dBm 818.6 mA WCDMA B4 @ 24.02 dBm 752.1 mA WCDMA B5 @ 23.38 dBm 625.6 mA WCDMA B8 @ 23.57 dBm 658.3 mA 备注 “*” means under development.
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LTE Standard Module Series EC200T Series Hardware Design WCDMA B1/B5/B8 24 dBm +1/-3 dB < -49 dBm LTE-FDD B1/B3/B5/B8 23 dBm ±2 dB < -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm ±2 dB < -39 dBm Table 38: EC200T-EU RF Output Power Frequency Max. Min.
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LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B1/B2/B3/B4/B5/B7/B8/B28 23 dBm ±2 dB < -39 dBm LTE-TDD B40 23 dBm ±2 dB < -39 dBm NOTES 1. 2. In GPRS 4 slots Tx mode, the maximum output power is reduced by 2.5 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. “*” means under development. 5.6. RF Receiving Sensitivity The following table shows conducted RF receiving sensitivity of EC200T-CN module.
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LTE Standard Module Series EC200T Series Hardware Design LTE-TDD B39 (10 MHz) -97 dBm -97.5 dBm -100 dBm -96.3 dBm LTE-TDD B40 (10 MHz) -97 dBm -97 dBm -100 dBm -96.3 dBm LTE-TDD B41 (10 MHz) -96 dBm -97 dBm -99 dBm -94.3 dBm Table 41: EC200T-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO EGSM900 TBD NA NA -102 dBm DCS1800 TBD NA NA -102 dBm WCDMA B1 TBD NA NA -106.7 dBm WCDMA B8 TBD NA NA -103.
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LTE Standard Module Series EC200T Series Hardware Design DCS1800 TBD NA NA -102 dBm DCS1900 TBD NA NA -102 dBm WCDMA B1 TBD NA NA -106.7 dBm WCDMA B2 TBD NA NA -104.7 dBm WCDMA B4 TBD NA NA -106.7 dBm WCDMA B5 TBD NA NA -104.7 dBm WCDMA B8 TBD NA NA -103.7 dBm LTE-FDD B1 (10 MHz) TBD TBD TBD -96.3 dBm LTE-FDD B2 (10 MHz) TBD TBD TBD -94.3 dBm LTE-FDD B3 (10 MHz) TBD TBD TBD -93.3 dBm LTE-FDD B4 (10 MHz) TBD TBD TBD -96.
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LTE Standard Module Series EC200T Series Hardware Design The following table shows the module electrostatics discharge characteristics. Table 43: Electrostatics Discharge Characteristics (25 ºC, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±8 ±10 kV All Antenna Interfaces ±8 ±10 kV Other Interfaces ±0.
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LTE Standard Module Series EC200T Series Hardware Design 6 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified. 6.1.
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LTE Standard Module Series EC200T Series Hardware Design 32.0＋/-0.15 3.4 1.30 2.0 5.96 1.1 3.85 1.1 3.5 1.90 Pin 1 1.30 2.0 3.0 0.87 3.0 1.8 1.15 2.15 1.8 2.8 4.82 1.05 4.8 1.6 29.0＋/-0.15 2.0 6.8 1.7 2.49 1.9 3.2 2.4 3.4 3.2 3.4 0.8 3.2 3.5 4.37 1.5 3.45 Figure 37: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
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LTE Standard Module Series EC200T Series Hardware Design 6.2. Recommended Footprint Figure 38: Recommended Footprint (Top View) NOTES 1. 2. The keepout area should not be designed. For easy maintenance of the module, please keep about 3 mm between the module and other components in the host PCB.
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LTE Standard Module Series EC200T Series Hardware Design 6.3. Design Effect Drawings of the Module Figure 39: Top View of the Module Figure 40: Bottom View of the Module NOTE These are renderings of EC200T series module. For authentic appearance, please refer to the module that you receive from Quectel.
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LTE Standard Module Series EC200T Series Hardware Design 7 Storage, Manufacturing and Packaging 7.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35%–60%. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3.
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LTE Standard Module Series EC200T Series Hardware Design NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed.
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LTE Standard Module Series EC200T Series Hardware Design Table 44: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 220°C) 45–70 s Max temperature 238 °C to 246 °C Cooling down slope -1.5 to -3 °C/s Reflow Cycle Max reflow cycle 1 NOTES 1.
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LTE Standard Module Series EC200T Series Hardware Design 7.3. Packaging .1 ±0 0 5 1. 30.3± 0.15 0.35± 0.05 29.3± 0.15 44.00± 0.3 20.20± 0.15 44.00± 0.1 2.00± 0.1 4.00± 0.1 30.3± 0.15 1.75± 0.1 EC200T series is packaged in tape and reel carriers. One reel is 11.88 m long and contains 250 modules. The figure below shows the package details, measured in mm. 4.2± 0.15 3.1± 0.15 32.5± 0.15 33.5± 0.15 32.5± 0.15 33.5± 0.15 Figure 42: Tape Specifications e p a t r e v o C 48.
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LTE Standard Module Series EC200T Series Hardware Design 1083 Carrier tape unfolding Carrier tape packing module Figure 44: Tape and Reel Directions EC200T_Series_Hardware_Design 93 / 90
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LTE Standard Module Series EC200T Series Hardware Design 8 Appendix A References Table 45: Related Documents SN Document Name Remark [1] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide [2] Quectel_EC200T-CN_AT_Commands_Manual EC200T-CN AT Commands Manual [3] Quectel_RF_Layout_Application_Note RF Layout Application Note [4] Quectel_UMTS<E_EVB_User_Guide UMTS<E EVB user guide for UMTS<E modules Table 46: Terms and Abbreviations Abbreviation Description ADC An
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LTE Standard Module Series EC200T Series Hardware Design ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate FTP File Transfer Protocol FTPS FTP over SSL GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSDPA High Speed Downlink Packet Access HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access HTTP Hyper Text Transfer Protocol HTTPS Hyper Text Transfer Protocol over Secure Socket Layer LED Light Emittin
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LTE Standard Module Series EC200T Series Hardware Design PPP Point-to-Point Protocol PSK Phase Shift Keying QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency SIMO Single Input Multiple Output SM Smart Media SMS Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure SSL Secure Sockets Layer TCP Transmission Control Protocol TDD Time Division Duplexing UART Universal Asynchronous Receiver &Transmit
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LTE Standard Module Series EC200T Series Hardware Design VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network EC200T_Series_Hardware_Design 97 / 90
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LTE Standard Module Series EC200T Series Hardware Design 9 Appendix B GPRS Coding Schemes Table 47: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.
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LTE Standard Module Series EC200T Series Hardware Design 10 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
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LTE Standard Module Series EC200T Series Hardware Design 14 4 4 NA 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 EC200T_Series_Hardware_Design 90 100 /
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LTE Standard Module Sires EC200T Hardware Design 11 Appendix D EDGE Modulation and Coding Schemes Table 49: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family Timeslot 1 Timeslot 2 Timeslot 4 MCS-1 GMSK C 8.80 kbps 17.60 kbps 35.20 kbps MCS-2 GMSK B 11.2 kbps 22.4 kbps 44.8 kbps MCS-3 GMSK A 14.8 kbps 29.6 kbps 59.2 kbps MCS-4 GMSK C 17.6 kbps 35.2 kbps 70.4 kbps MCS-5 8-PSK B 22.4 kbps 44.8 kbps 89.6 kbps MCS-6 8-PSK A 29.6 kbps 59.