GSM Specification V1.1

Quectel M66-DS
Ultra-small
Dual SIM Dual Standby
Quad-band GSM/GPRS Module
Build a Smarter World
M66-DS is an ultra-small Dual SIM Dual Standby quad-band GSM/GRPS module using LCC castellaon package. Based on the
latest 2G chipset, it has the opmal performance in SMS & data transmission and audio service even in harsh environment.
The Dual SIM Dual Standby funcon allows customers to use two (U)SIM cards in one device simultaneously. The ultra-
compact 15.8mm × 17.7mm × 2.3mm prole makes M66-DS a perfect plaorm for size sensive applicaons.
M66-DS adopts surface mount technology, making it an ideal soluon for durable and rugged designs. The low prole and
small size of LCC package ensures M66-DS can be easily embedded into low-volume applicaons and provides reliable
connecvity for the applicaons. This kind of package is ideally suited for large-scale manufacturing which has strict require-
ments for cost and eciency.
The compact form factor, low power consumpon and two (U)SIM card interfaces make M66-DS the best choice for applica-
ons such as wearable device, automove, industrial PDA, personal tracking, wireless POS, smart metering, telemacs and
other M2M applicaons.
Key
Benefits
Ultra compact form factor with Dual SIM Dual Standby (DSDS)
feature
Easier soldering process with LCC package
Power consumpon as low as 1.3mA
Support Voice, Bluetooth and QuecFOTA
TM
Embedded powerful Internet service protocols, mulple Sockets &
IP addresses
Quad-band
GPRS Mul-slot
Class 12
Highly Compact Size
LCC Package
Embedded Internet
Services Protocols
DSDS Digital Audio
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Extended Temperature
Range: -40°C ~ +85°C
Bluetooth 3.0
Quectel
Confidential