User Manual

INTEGRATED CIRCUITS INC.-APR9600
http://www.aplusinc.com.tw Page / 17 Ver2 .1
15
5. Bonding Pad Diagram and Bonding Pad Coordinates :
Figure 6 APR9600 Die Bonding Pad Diagram
Notes:
Die Dimensions X-Axis: 212 +/- 1 mils (X-Axis: 5450 um)
Y-Axis: 176 +/- 1 mils (Y-Axis: 4550 um)
Die Thickness 13.8 +/- 1.0 mils (350 +/- 25 um)
Pad Opening 4.3 mils (110 um)
Table 7 Bonding Pad Coordinates For The APR9600 Device.
Pad No. Pad Name X Axis Y Axis Pad No. Pad Name X Axis Y Axis
1 /M1_MESSAGE -1075 2007 17 VCCA 844 -1909
2 /M2_NEXT -1393 2007 18 VCCA 1066 -1951
3 /M3 -1833 2007 19 MicIn 1708 -1969
4 /M4 -2151 2007 20 MicRef 2064 -1969
5 /M5 -2513 1397 21 AGC 2491 -1865
6 /M6 -2513 1079 22 ANA_IN 2491 -1513
7 OscR -2513 617 23 ANA_OUT 2491 -1013
8 /M7_END -2485 -865 24 /STROBE 2514 696
9 /M8_OPTION -2485 -1193 25 /CE 2514 1182
10 /BUSY -2435 -1987 26 MSEL1 2514 1532
11 BE -1953 -1987 27 MSEL2 2121 2007
12 VSSD -1728 -2003 28 ExtClk 1592 2007
13 VSSA -1532 -1976 29 /RE 1088 2007
14 VSSA -1337 -1952 30 VCCD -577 2007
15 SP+ -840 -1838 31 VCCD -757 2007
16 SP- 347 -1838
Note: All coordinates are with respect to the center of the die (um)