User guide

33
3674E–DFLASH–8/08
AT25DF081
14. Ordering Information
14.1 Ordering Code Detail – Standard Package Offerings
Notes: 1. The shipping carrier option code is not marked on the devices.
2. Please contact Adesto for 11-ball dBGA package outline drawing.
14.2 Green Package Options (Pb/Halide-free/RoHS Compliant)
Ordering Code Package Lead Finish Operating Voltage f
SCK
(MHz) Operation Range
AT25DF081-SSHN-B
AT25DF081-SSHN-T
8S1
NiPdAu
1.65V to 1.95V 66
Industrial
(-40°C to +85°C)
AT25DF081-MHN-Y
AT25DF081-MHN-T
8MA1
AT25DF081-UUN-T 11U1
(2)
SnAgCu
AT2 5D 0 8 SSH B1 ದ N ದF
Designator
Product Family
Device Density
08 = 8-megabit
Interface
1 = Serial
Package Option
SS = 8-lead, 0.150" wide SOIC
M = 8-contact, 5mm x 6mm UDFN
U = 11-ball dBGA (WLCSP)
Device Grade
H = Green, NiPdAu lead finish, industrial
temperature range (–40°C to +85°C)
U = Green, Matte Sn or Sn alloy, industrial
temperature range (–40°C to +85°C)
Shipping Carrier Option
B = Bulk (tubes)
Y = Trays
T = Tape and reel
Operating Voltage
N = 1.65V minimum (1.65V to 1.95V)
Package Type
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8MA1 8-contact, 5 mm x 6 mm Thermally Enhanced Ultra Thin Dual Flat No Lead Package (UDFN)
11U1 11-ball die Ball Grid Arrray (dBGA)