User guide
Table Of Contents
- Features
- 1. Description
- 2. Pin Configurations and Pinouts
- 3. Block Diagram
- 4. Memory Array
- 5. Device Operation
- 6. Read Commands
- 7. Program and Erase Commands
- 8. Sector Protection
- 9. Hardware Controlled Protection
- 10. Security Features
- 11. Additional Commands
- 12. Deep Power-down
- 13. “Power of 2” Binary Page Size Option
- 14. Manufacturer and Device ID Read
- 15. Command Tables
- 16. Power-on/Reset State
- 17. System Considerations
- 18. Electrical Specifications
- 19. Input Test Waveforms and Measurement Levels
- 20. Output Test Load
- 21. AC Waveforms
- 21.1 Waveform 1 – SPI Mode 0 Compatible (for Frequencies up to 66MHz)
- 21.2 Waveform 2 – SPI Mode 3 Compatible (for Frequencies up to 66MHz)
- 21.3 Waveform 3 – RapidS Mode 0 (FMAX = 66MHz)
- 21.4 Waveform 4 – RapidS Mode 3 (FMAX = 66MHz)
- 21.5 Utilizing the RapidS Function
- 21.6 Reset Timing
- 21.7 Command Sequence for Read/Write Operations for Page Size 256-Bytes (Except Status Register Read, Manufacturer and Device ID Read)
- 21.8 Command Sequence for Read/Write Operations for Page Size 264-Bytes (Except Status Register Read, Manufacturer and Device ID Read)
- 22. Write Operations
- 23. Read Operations
- 24. Detailed Bit-level Read Waveform – RapidS Serial Interface Mode 0/Mode 3
- 24.1 Continuous Array Read (Legacy Opcode E8H)
- 24.2 Continuous Array Read (Opcode 0BH)
- 24.3 Continuous Array Read (Low Frequency: Opcode 03H)
- 24.4 Main Memory Page Read (Opcode: D2H)
- 24.5 Buffer Read (Opcode D4H or D6H)
- 24.6 Buffer Read (Low Frequency: Opcode D1H or D3H)
- 24.7 Read Sector Protection Register (Opcode 32H)
- 24.8 Read Sector Lockdown Register (Opcode 35H)
- 24.9 Read Security Register (Opcode 77H)
- 24.10 Status Register Read (Opcode D7H)
- 24.11 Manufacturer and Device Read (Opcode 9FH)
- 25. Auto Page Rewrite Flowchart
- 26. Ordering Information
- 27. Packaging Information
- 28. Revision History
- 29. Errata
50
3596N–DFLASH–11/2012
AT45DB081D
27.3 8S2 – EIAJ SOIC
DRAWING NO. REV. TITLE GPC
1
1
N
N
E
E
q
q
C
C
E1
E1
L
L
A
A
b
b
A1
A1
e
e
D
D
Package Drawing Contact:
contact@adestotech.com
Notes: 1. This drawing is for general information only; refer to
EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs
are not included.
3. Determines the true geometric position.
4. Values b,C apply to plated terminal. The standard
thickness of the plating layer shall measure between
0.007 to .021mm.
8S2 F
4/15/08
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
STN
End View
Top View
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
1.70
0.05
0.35
0.15
5.13
5.18
7.70
0.51
0˚
A
A1
b
C
D
E1
E
L
q
e 1.27 BSC
2.16
0.25
0.48
0.35
5.35
5.40
8.26
0.85
8˚
4
4
2
3