. Features • Compatible with all ISO/IEC 14443 Type B Compliant Cards, Tags, and Transponders • High Performance 13.
3. Introduction 3.1. Block Diagram Figure 1. Block Diagram Filter RFin C6 Modulator Transmit Receive ANT SRAM Vss_ANT Command and Response Logic ANT Driver Registers PLL CLKO 2 13.56 MHz Xtal1 Xtal2 Serial Interface ResetB ISEL Istat SSB SCK SDI SDO ADDR 13.
13.56 MHz Type B RF Reader 3.2. System Diagram Figure 2. Communications in an RFID System Host Microcontroller 3.3. Serial Interface Reader IC R F Com m unications Card Scope This AT88RF1354 Specification document contains the electrical and mechanical specifications for the AT88RF1354 RF Reader IC. The AT88RF1354 Command Reference Guide document contains detailed command and register specifications for the AT88RF1354 RF Reader.
. Instruction Set Table 1. Instruction Set Sorted by Command Name Command Name Description Code Abort Exit command in progress $0D Clear Exit command in progress, Clear Buffer, Turn RF OFF $0E Poll Continuous Poll Continuously for Type B PICCs $02 Poll Single Poll Once for Type B PICCs $01 Read Buffer Read Data Buffer $08 Read Register Read Configuration Register $07 RF OFF Turn off 13.56 MHz RF Field $0B RF ON Turn on 13.
13.56 MHz Type B RF Reader 4.3. Other Commands The Abort Command can be used to interrupt a Poll Single, Poll Continuous, or TX Data operation that is in progress. If a Poll Continuous Command is sent but there is no card in the field, then an Abort Command is used to interrupt the infinite polling loop. All other commands will timeout if no response is received, so it is usually not necessary to use the Abort Command to interrupt them.
5. Register Summary The AT88RF1354 Command Reference Guide document contains all of the detailed information required by a software developer or embedded systems programmer to use the AT88RF1354 Register Set. See www.atmel.com for the AT88RF1354 Command Reference Guide (doc 5150x). Table 2. Register set sorted by address.
13.56 MHz Type B RF Reader The Register Memory Map in Table 3. shows the field names for each register bit. Read-only registers are colored yellow. Read/Write registers are colored green. Any bit identified as RFU or Reserved for Future Use is reserved for future definition by Atmel; these bits must always remain 0 b. Table 3.
5.2. Status Registers AT88RF1354 contains three read-only registers that provide status information. The operational status of the IC is contained in the SREG Register; by reading this register it can be determined if the RF Field is on and if the analog circuits are fully powered up. The RF communication errors flags are stored in EREG; these flags are also returned in the response of RF communication commands.
13.56 MHz Type B RF Reader 6.
6.1. Power and Ground Pin Descriptions 6.1.1. VCC [24] Supply Voltage for I/O buffers, digital, and analog circuits. VCC voltage must match the microcontroller I/O voltage since all digital I/O levels are referenced to VCC Two VCC bypass capacitors must be connected between the VCC pin and VSS. A 15 nF capacitor with SRF of 32 MHz must be placed within 3 mm of the package. A 2.2 uF capacitor should also be placed within 3 cm of the package.
13.56 MHz Type B RF Reader 6.2. Digital Pin Descriptions 6.2.1. ADDR [20] TWI device address select input pin. Selects between two TWI device addresses as shown in Table 4. In SPI communication mode this pin should be connected to Vss. Table 4. TWI Device Address TWI Device Address ADDR Pin Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TWI_R TWI_W VSS 0 1 0 1 0 0 0 $51 $50 VCC 1 1 0 1 0 1 0 $D5 $D4 All other values are NOT supported 6.2.2. CLK0 [8] Clock Out pin.
6.2.7. SDI [15] Serial Data In pin. In SPI communication mode this pin functions as the serial data input. In TWI communication mode this pin functions as the serial data I/O. 6.2.8. SDO [19] Serial Data Out pin. In SPI communication mode this pin functions as the serial data output. In TWI communication mode this pin is not used. 6.2.9. SSB [13] SPI Slave Select Bar input pin. In SPI communication mode this pin functions as the slave select input.
.56 MHz Type B RF Reader 6.4.5. C5 [6] C5 bypass capacitor pin. Bypass capacitance of 0.33 uF for the digital circuits must be connected between the C5 pin and VSS. This capacitor must be placed within 3 mm of the package. Any 0.33 uF ceramic capacitor with X5R or X7R dielectric and a working voltage of 10 volts minimum may be used. 6.4.6. C7 [29] C7 bypass capacitor pin. Bypass capacitance of 47 nF for the analog circuits must be connected between the C7 pin and VSSA.
7. Typical Application 7.1. Operating Principle Contactless RF smart cards operating at 13.56 Mhz are powered by and communicate with the reader via inductive coupling of the reader antenna to the card antenna. The two loop antennas effectively form a transformer. An alternating magnetic field is produced by sinusoidal current flowing thru the reader antenna loop. When the card enters the alternating magnetic field, an alternating current (AC) is induced in the card loop antenna.
13.56 MHz Type B RF Reader 7.2. Application In a typical application the AT88RF1354 reader circuitry and the loop antenna are integrated on a single four layer printed circuit board. The host microcontroller and power supply may reside on the same PCB, or on a separate PCB depending on the application requirements. The passive components required for the reader IC to function are placed in a small area immediately surrounding the QFN package for optimum RF circuit performance.
8. Electrical Characteristics 8.1. Absolute Maximum Ratings* Absolute Maximum Rating Operating Temperature (case temp) -40° C to +85° C Storage Temperature (case temp) -65° C to +150° C Power Dissipation 2 Watts Maximum Operating Voltage (VCC) 6.0 Volts Maximum Operating Voltage (VCC _ANT) 6.
13.56 MHz Type B RF Reader Digital I/O Characteristics (1) Tc = -40° to +85° C (unless otherwise noted) VCC = 3.0 to 3.6 V Symbol Parameter Condition Min Typical VCC = 4.5 to 5.5 V Typ ical Max Units Max Min -0.5 0.3VCC -0.5 0.3VCC V 0.7VCC VCC +0.5 0.7VCC VCC +0.
TWI Mode Timing Tc = -40° to +85° C (unless otherwise noted)(1) Symbol Parameter Condition 100 kHz Operation Min Typical Max 1 MHz Operation Min Typical Max Unit s tHIGH SCK High pulse width 4.0 0.4 uS tLOW SCK Low pulse width 4.7 0.5 uS tSU;DAT Setup time, Data 250 25 nS tHD;DAT Hold time, Data 300 30 nS tSU;STA Setup time, Start condition 4.7 0.5 uS tHD;STA Hold time, Start condition 4.0 0.4 uS tSU;STO Setup time, Stop Condition 4.0 0.
13.56 MHz Type B RF Reader Figure 5. SPI Interface timing requirements Standby Mode Timing (1) Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter VCC = 3.0 to 3.6 V Condition Min tOSC tSDBY Typical Units Max uS uS Exit Standby Mode Time CLKO start-up time Note: 1. 2. 3. 4. 5. 6. VCC = 4.5 to 5.
CLKO Output Timing (1) Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter Condition VCC = 3.0 to 3.6 V Min fCLKO CLKO Output Frequency (2) Typical Max VCC = 4.5 to 5.5 V Min Typical Units Max PLL Reg RS1 = 0 b RS2 = 0 b 1.978 1.978 MHz PLL Reg RS1 = 0 b RS2 = 1 b 3.955 3.955 MHz PLL Reg RS1 = 1 b RS2 = 0 b 7.910 7.910 MHz PLL Reg RS1 = 1 b RS2 = 1 b 15.820 15.820 MHz 50.0 50.0 % CLKO Duty Cycle tR_CLKO Rise Time nS tF_CLKO Fall Time nS Note: 1.
13.56 MHz Type B RF Reader 9. Typical Characteristics The performance of AT88RF1354 is dependent on the reader circuit, the loop antenna design, the board layout, the specifications of the passive components, the quality of the supply voltages, the quality of the ground, the electrical noise in the system, and how the reader circuit is connected to the other system components.
9.2. Standby Current (1) Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter VCC and VCC_ANT = 3.0 to 3.6 V Condition Min Typical VCC and VCC_ANT = 4.5 to 5.
13.56 MHz Type B RF Reader Receiver Characteristics (1) Tc = -40° to +85° C (unless otherwise noted) Symbol ETU Parameter Condition Elementary Time Unit RF Enabled, Receiving Data EGT Extra Guard Time RF Enabled, Receiving Data BW Receiver Bandwidth Min Typical Max 9.4346 9.4395 9.4444 0.0 19.0 1.0 Units ISO / IEC Standard uS 14443-2 9.1.1 uS 14443-3 7.1.2 MHz Note: 1. Typical values at Tc = 35° C. Values are characterized values and not test limits in production. 2.
10. Mechanical 10.1. Thermal Characteristics The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad. ψJB is 12.1 °C/W and θJA is 30.9 °C/W for this package. Since ψJB measures the heat transfer between the QFN package and the PC board, it is more relevant than θJA. θJA measures heat transfer between the QFN and stagnant air. 10.2.
13.56 MHz Type B RF Reader 10.4.
11. Ordering Information AT88RF1354 is available in the 6 mm by 6 mm 36 pin QFN package only. Standard delivery format is bulk, in trays. Tape & reel is also available. Ordering Code 26 Package Temperature Range AT88RF1354-ZU 36 pin QFN thermal package, 6 x 6 mm, Green, in Trays Industrial (-40° C to 85° C) AT88RF1354-ZU-T 36 pin QFN thermal package, 6 x 6 mm, Green, Tape & Reel Industrial (-40° C to 85° C) 13.
13.56 MHz Type B RF Reader Appendix A. A.1. The ISO/IEC 14443 Type B RF Signal Interface RF Signal Interface The AT88RF1354 RF communications interface is compliant with the ISO/IEC 14443 part 2 and part 3 Type B signaling requirements when used exactly as described in the AT88RF1354 reference design application notes. Type B signaling utilizes a 10 % amplitude modulation of the RF field for communication from the reader to the card with NRZ encoded data.
A.3. Frame Format Data transmitted by the PCD or PICC is sent as frames. The frame consists of the start of frame (SOF), several bytes of information, and the end of frame (EOF). The SOF and EOF requirements are shown in Figure A-2. Figure A-2. Start of Frame (SOF) and End of Frame (EOF) format requirement 2 to 3 ETUs "1"s 10 to 11 ETUs of "0"s Start of Frame Start b1 First Byte Total start of frame length is 12 to 14 ETUs. 10 to 11 ETUs of "0"s End of Frame Last Byte A.4.
13.56 MHz Type B RF Reader A.5. Card Data Transmission The PICC waits silently for a command from the PCD after being activated by the RF field. After receiving a valid command from the PCD, the PICC is allowed to turn on the subcarrier only if it intends to transmit a complete response frame. The PICC response consists of TR1, SOF, several bytes of data followed by a 2 byte CRC_B, and the EOF. The subcarrier is turned off no later than 2 ETUs after the EOF. Figure A-4. show the PICC frame format.
A.7. CRC Error Detection A 2 byte CRC_B is required in each frame transmitted by the PICC or PCD to permit transmission error detection. The CRC_B is calculated on all of the command and data bytes in the frame. The SOF, EOF, start bits, stop bits, and EGT are not included in the CRC_B calculation. The two byte CRC_B follows the data bytes in the frame. Figure A-6. Location of the two CRC_B bytes within a frame.
13.56 MHz Type B RF Reader A.9. Magnetic Field Strength ISO/IEC 14443 part 2 defines the minimum and maximum operating magnetic field strength as Hmin and Hmax. A credit card sized (ID-1) PICC is required to operate at all magnetic field strengths between Hmin = 1.5 A/m rms and Hmax = 7.5 A/m rms. The PCD is not allowed to generate magnetic fields in excess of Hmax = 7.5 A/m rms. The PICC is not required to function outside the operating envelope defined by Hmin and Hmax.
Appendix B. The SPI Serial Interface The SPI Interface mode is selected by shorting the ISEL pin to VCC. Six microcontroller pins are required to operate AT88RF1354 in SPI mode. The ISTAT signal is used for handshaking between the microcontroller and RF reader. B.1. SPI Interface The AT88RF1354 SPI interface operates as a slave device in SPI mode 0. In SPI mode 0 the polarity and phase of the serial clock in relation to the data is as follows: SCK is low when IDLE.
13.56 MHz Type B RF Reader Appendix C. The TWI Serial Interface The TWI Interface mode is selected by shorting the ISEL pin to VSS. Four microcontroller pins are required to operate AT88RF1354 in TWI mode. TWI ACK polling is not supported; the ISTAT signal is used for handshaking between the microcontroller and RF reader. C.1. TWI Interface The AT88RF1354 2-wire serial interface (TWI) operates as a slave device.
C.2. TWI Device Address The TWI device address is selected with the ADDR address select pin of the AT88RF1354. Figure C-2. ADDR Pin TWI Device Address TWI Device Address TWI_R TWI_W 0 $51 $50 0 $D5 $D4 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 VSS 0 1 0 1 0 0 VCC 1 1 0 1 0 1 All other values are NOT supported The AT88RF1354 device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation.
13.56 MHz Type B RF Reader Appendix D. D.1. QFN Package Mounting Guidelines Introduction This Appendix provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame ® package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate.
D.3. PCB Design Guidelines As shown in Figure D-1. the lands on the package bottom side are rectangular in shape with rounded edges on the inside. Since the package does not have any solder balls, the electrical connection between the package and the board is made by printing the solder paste on the board and reflowing it after the component placement. In order to form reliable solder joints, special attention is needed in designing the board pad pattern and the solder paste printing. D.3.1.
13.56 MHz Type B RF Reader Figure D-2. Solder mask definition for perimeter lands. Solder Mask 0.5 mm and Higher Pitch Parts 0.4 mm Pitch Parts For the cases where the thermal land dimensions are close to the theoretical maximum discussed above, it is recommended that the thermal pad area should be solder mask defined in order to avoid any solder bridging between the thermal pad and the perimeter pads. The mask opening should be 100 microns smaller than the thermal land size on all four sides.
D.4.2. Stencil Design for Thermal Pad In order to effectively remove the heat from the package and to enhance the electrical performance, the die paddle needs to be soldered to the PCB thermal pad, preferably with minimum voids. However, eliminating voids may not be possible because of the presence of thermal vias and the large size of the thermal pad for larger size packages.
13.56 MHz Type B RF Reader Figure D-4. Solder Mask Options for Thermal Vias Via Tenting from Top Via Tenting from Bottom Via Plugging from Bottom Via Encroached from Bottom All of these options have pros and cons when mounting the QFN package on the board. While via tenting from the top side may result in smaller voids, the presence of the solder mask on the top side of the board may hinder proper paste printing.
D.4.4. Stencil Thickness and Solder Paste A stencil thickness of 0.125 mm is recommended for 0.4 and 0.5 mm pitch parts. A laser-cut, stainless steel stencil is recommended with electro-polished trapezoidal walls to improve the paste release. Since not enough space is available underneath the part after reflow, it is recommended that the “No Clean”, Type 3 paste be used for mounting QFN packages. Nitrogen purge is also recommended during the reflow. D.4.5.
13.56 MHz Type B RF Reader The fillet formation is also a function of the PCB land size, the printed solder volume, and the package standoff height. Since there is only limited solder available, higher standoff (controlled by the paste coverage on the thermal pad) may not leave enough solder for fillet formation. Conversely, if the standoff is too low, large convex shape fillets may form. This is shown in Figure D-7.
D.4.6. Reflow Profile The reflow profile and the peak temperature have a strong influence on void formation. Amkor has conducted experiments with the different reflow profiles (ramp-to-peak vs. ramp-hold-ramp), the peak reflow temperatures, and the times above liquidus using Alpha Metal’s UP78 solder paste. Some of the representative profiles are shown in Figure D-8.
13.56 MHz Type B RF Reader Figure D-9. Typical PCB mounting process flow. Solder Paste Printing REFLOW Post Print Inspection Post Reflow Inspection (Visual/X-ray) Component Placement Rework & Touch Up Pre Reflow Inspection D.6. Rework Guidelines Since solder joints are not fully exposed in the case of QFNs, any retouch is limited to the side fillet. For defects underneath the package, the whole package has to be removed. Rework of the QFN packages can be a challenge due to their small size.
D.6.2. Site Redress After the component has been removed, the site needs to be cleaned properly. It is best to use a combination of a blade-style conductive tool and a desoldering braid. The width of the blade should be matched to the maximum width of the footprint and the blade temperature should be low enough not to cause any damage to the circuit board. Once the residual solder has been removed, the lands should be cleaned with a solvent.
13.56 MHz Type B RF Reader Appendix E. Terms and Abbreviations A ..................Unmodulated PCD field amplitude. Used in modulation index calculation. A/m ..............Amperes per Meter. Units of magnetic field strength. AC................Alternating Current. ACK .............Acknowledge response, indicates success of the requested operation. AFI ...............Application Family Identifier. Used during Type B anticollision. APP..............Application bytes. Data field in ATQB polling response.
N.C...............No Connect. NRZ-L ..........Non-Return to Zero (L for Level) data encoding. PICC data transmission coding. nS ................NanoSecond. NSMD ..........No Solder Mask Defined. PARAM ........A byte containing option codes or variables. PCB .............Printed Circuit Board. PCD .............Proximity Coupling Device. The RF reader/writer and antenna. PICC ............Proximity Integrated Circuit Card. The card/tag containing the IC and antenna. PUPI ............
13.56 MHz Type B RF Reader Appendix F. Standards and Reference Documents International Standards AT88RF1354 is designed to comply with the applicable requirements of the following ISO/IEC standards for Type B PCDs operating at the standard 106 kbps data rate.
Appendix G. G.1. Errata ATD88RF1354 with IDR Hardware Revision Register: $10 Pre-production version, not fully qualified. Does not meet the 2000 V minimum HBM ESD requirement. G.2. AT88RF1354 with IDR Hardware Revision Register: $11 No errata. 48 13.
13.56 MHz Type B RF Reader 12. Revision History Table 6. Revision History Doc. Rev. Date 8547A 10/2008 Comments Initial document release.
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