Manual

989
6264A–CAP–21-May-07
AT91CAP9S500A/AT91CAP9S250A
48.2 Package Drawing
Figure 48-1. 400-ball LFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 48-2. Soldering Information
Ball Land 0.4 mm +/- 0.05
Soldering Mask Opening 0.275 mm +/- 0.03
Table 48-3. Device and 400-ball LFBGA Package Maximum Weight
TBD mg
Table 48-4. 400-ball LFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 48-5. Package Reference
JEDEC Drawing Reference MO-210
JESD97 Classification e1