Instruction Manual
Maxim/Dallas Semiconductor Confidential Product Preview: DS3161,2,3,4
Rev 1.6 12 of 12 022604
5 PACKAGE MECHANICAL DIMENSIONS
The target package is a 27x27 mm 400-lead TE
1
-CSBGA with ball pitch of 1.27mm for all port density
configuration.
6 POWER ESTIMATE
Current typical power estimate is 2 Watts at 3.3V (pending mode of operation).
1
TE-CSBGA = Thermally Enhanced Chip Scale Ball Grid Array