Manual

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PRELIMINARY

Publication Release Date: January 23, 2007

Revision 1.3-S2

ISD1700

Series

Multi-Message

Single-Chip

Voice Record & Playback Devices

Summary of content (24 pages)

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PRELIMINARY ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices Publication Release Date: January 23, 2007 Revision 1.
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ISD1700 SERIES TABLE OF CONTENTS 1 GENERAL DESCRIPTION ..............................................................................................................3 2 FEATURES......................................................................................................................................4 3 BLOCK DIAGRAM...........................................................................................................................5 4 PINOUT CONFIGURATION..............................
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ISD1700 SERIES 1 GENERAL DESCRIPTION The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multimessage voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device.
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ISD1700 SERIES 2 FEATURES y Integrated message management systems for single-chip, push-button applications o REC : level-trigger for recording o PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially o ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages o FWD : edge-trigger to advance to the next message or fast message scan during the playback o VOL : 8 levels output volume control o RDY INT : ready or busy status indicati
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ISD1700 SERIES y Temperature options: o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units) o Industrial: -40°C to +85°C (packaged units) y Packaging types: available in die, PDIP, SOIC and TSOP y Package option: Lead-free packaged units 3 BLOCK DIAGRAM Internal Clock ROSC MIC+ MICAGC Sampling Clock AnaIn Amp Amp MUX AnaIn Timing AntiAliasing Filter Nonvolatile Multi-Level Storage Array Smoothing Filter Volume Control AUD / AUX SP+ Amp SP- AGC Amp Automatic Gain Control Power Con
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ISD1700 SERIES 4 PINOUT CONFIGURATION Refer to Design Guide for details before performing any design or PCB layout.
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ISD1700 SERIES 5 PIN DESCRIPTION Refer to Design Guide for details before performing any design or PCB layout. PIN NAME VCCD LED RESET FUNCTIONS Digital Power Supply: Power supply for digital circuitry. LED: An LED output. RESET: When active, the device enters into a known state. MISO Master In Slave Out: Data is shifted out on the falling edge of SCLK. When the SPI is inactive ( SS = high), it’s tri-state. MOSI Master Out Slave In: Data input of the SPI interface when ISD1700 is a slave.
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ISD1700 SERIES 6 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6.1 STANDALONE (PUSH-BUTTON) MODE One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state. 6.2 SPI MODE In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands.
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ISD1700 SERIES > TDeb Tr Tf TDeb PLAY TDeb TRDTSet1 RDY TSc1 TSc2 TRU TLH TCyc LED Sp+, Sp- Figure 12.2: Start and Stop Playback Operation > TDeb Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TE TLS2 TSc2 LED Figure 12.3: Single Erase Operation with No Sound Effect -9- Publication Release Date: January 23, 2007 Revision 1.
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ISD1700 SERIES > T Deb Tr Tf FWD TDeb TRD RDY TSc1 TSc2 TLS1 or T LS2 LED Figure 12.4: Forward Operation with No Sound Effect Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TGE1 or (TE + TLS2 or TSE2) 3x(T LS1 or TSE1) TGE2 LED Sp+, SpNote: If SEs are recorded, then Sp+/- will have output. Figure 12.
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ISD1700 SERIES Tr Tf RESET TReset TSet2 Device returns to Power Down state RDY LED Figure 12.6: Reset Operation > T Deb Tr Tf PLAY TDeb TRD RDY TSc1 TSc2 TRU TLH TCyc LED TRU TRD AUD Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output - 11 - Publication Release Date: January 23, 2007 Revision 1.
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ISD1700 SERIES 7.2 SPI OPERATION TSSmin T SSH SS T SCKlow TSSS TSCKhi SCLK TDIS TDIH LSB MOSI MSB T PD (TRISTATE) MISO TDF LSB MSB Figure 12.
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ISD1700 SERIES 8 ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS (DIE) [1] CONDITIONS VALUES 0 Junction temperature Storage temperature range Voltage Applied to any pads Power supply voltage to ground potential 150 C -650C to +1500C (VSS - 0.3V) to (VCC + 0.3V) -0.3V to +7.
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ISD1700 SERIES 9 ELECTRICAL CHARACTERISTICS 9.1 DC PARAMETERS SYMBOL VDD VIL VIH VOL VOH IDD_Record IDD_Playback IDD_Erase ISB IILPD1 IILPD2 RMIC+,RMICRAnaIn VIN1 VIN2 AMSP Speaker Output Load AUX Output Load Speaker Output Power RSPK RAux Pout Speaker Output Voltage VOUT1 AUX Output Swing AUX Output DC Level AUD Volume Output VOUT2 VOUT3 IAUD AVol 1.2 -3.0 0 to -28 V V mA dB Total Harmonic Distortion THD 1 % Notes: [1] [2] [3] [4] [5] MIN 2.4 VSS-0.3 0.7xVDD VSS-0.3 0.
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ISD1700 SERIES 9.
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ISD1700 SERIES 10 TYPICAL APPLICATION CIRCUITS The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc.
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ISD1700 SERIES Example #2: Recording using AnaIn input via push-button controls 24 23 25 26 19 22 RESET 0.1μ F FWD LED 2 VOL FT VCCD 1 VSSD 28 7 6 5 4 10 11 0.1μ F Rosc *** 9 20 18 4.7 μ F VCCA 21 VSSA 8 SS SCLK MOSI Reset 3 REC PLAY ERASE ISD1700 ** VCCA VCCD VCCP VCCD 0.1 μF * Vcc Gnd ** VCCA 0.1μ F * VCCP VCCP 14 VSSP1 16 0.1μF MISO vAlert D1 1 KΩ * * 0.
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ISD1700 SERIES Example #3: Connecting the SPI Interface to a microcontroller 24 23 25 26 19 22 7 6 To uC SPI 5 4 10 11 0.1μ F Rosc *** 9 20 18 4.7 μ F Reset 3 REC PLAY ERASE RESET LED FWD VOL FT 2 0.1 μF VSSD 28 ISD1700 MOSI 0.1μ F VSSP2 12 MIC+ SP+ SP- 13 15 MIC - AUD/AUX ROSC INT/RDY AGC Gnd ** * VCCP VCCP 14 VSSP1 16 0.1μF MISO AnaIn * Vcc VCCA VCCA 21 VSSA 8 SCLK ** VCCA VCCD VCCP VCCD VCCD 1 SS 0.1μ F vAlert D1 1 KΩ * * 0.
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ISD1700 SERIES 11 PACKAGING 11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC HD D c e E b θ A1 A2 A L L1 Y Dimension in Inches Dimension in mm Symbol Min. Nom. Max. A A1 A2 b c D E HD e L L1 Y θ Min. Nom. Max. 0.047 0.002 1.20 0.006 0.05 0.15 0.035 0.040 0.041 0.95 1.00 1.05 0.007 0.008 0.011 0.17 0.20 0.27 0.004 0.006 0.008 0.10 0.15 0.21 0.461 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.
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ISD1700 SERIES 11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 2 3 4 5 1 6 7 8 9 10 11 12 13 14 A G C B D E H F Plastic Small Outline Integrated Circuit (SOIC) Dimensions INCHES MILLIMETERS Min Nom Max Min Nom Max A 0.701 0.706 0.711 17.81 17.93 18.06 B 0.097 0.101 0.104 2.46 2.56 2.64 C 0.292 0.296 0.299 7.42 7.52 7.59 D 0.005 0.009 0.0115 0.127 0.22 0.29 E 0.014 0.016 0.019 0.35 0.41 0.
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ISD1700 SERIES 11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP) Plastic Dual Inline Package (PDIP) (P) Dimensions INCHES A B1 B2 C1 C2 D D1 E F G H J S 0 Min 1.445 0.065 0.600 0.530 0.015 0.125 0.015 0.055 0.008 0.070 0° Nom 1.450 0.150 0.070 0.540 0.018 0.060 0.100 0.010 0.075 MILLIMETERS Max 1.455 Min 36.70 0.075 0.625 0.550 0.19 1.65 15.24 13.46 0.135 0.022 0.065 0.38 3.18 0.38 1.40 0.012 0.080 15° 0.20 1.78 0° Nom 36.83 3.81 1.78 13.72 0.46 1.52 2.54 0.25 1.91 Max 36.96 1.91 15.
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ISD1700 SERIES 12 ORDERING INFORMATION Product Number Descriptor Key I17xxxxxxxxx Product Name: Special Features Field: I = ISD Blank = None = vAlert 01 Product Series: Tape & Reel: 17 = 1700 Blank = None R Duration: 30 : 20 – 60 secs 40 : 26 – 80 secs 50 : 33 – 100 secs 60 : 40 – 120 secs 90 : 60 – 180 secs 120 : 80 – 240 secs 150 : 100 – 300 secs 180 : 120 – 360 secs 210 : 140 – 420 secs = Tape & Reel Temperature: I = Industrial (-40°C to +85°C) Blank = Commercial • Die (0°C to +50°C)
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ISD1700 SERIES 13 VERSION HISTORY VERSION DATE DESCRIPTION 1.3-S Sep 2006 Initial version 1.3-S1 Nov 2006 Revise Pinout Configuration & Pin Description sections 1.3-S2 Jan 2007 Revise Rosc resistor value Revise Selectable Message Duration section Update standby current, sampling frequency & duration parameters - 23 - Publication Release Date: January 23, 2007 Revision 1.
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ISD1700 SERIES Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life.