User Manual

MAX13171E/MAX13173E/MAX13175E
Multiprotocol, Pin-Selectable
Data Interface Chipset
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
38
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Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
38 TQFN-EP T3857-1
21-0172
Pin Configurations (continued)
MAX13175E
31 30 29 28 27 26 25 24 23 22 21 20
1 2 3 4 5 6 7 8 9 10 11 12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
GND
R3C
V
L
V
EE
V
DD
GND
V
CC
R1B
R1C
M0
M1
M2
LATCH
DCE/DTE
R2B
R2B
R2A
R2A
R1A
R1A
R1B
R3B
R3B
R3A
R3A
R2C
R5B
R5A
R5A
R6A
R6A
R6B
R6B
R4B
R4B
R4A
R4A
R5B
TQFN
*CONNECT EXPOSED PAD TO V
EE
+
*EP
TOP VIEW
Chip Information
PROCESS: BiCMOS