User Manual

W29C040
- 20 -
VERSION HISTORY
VERSION DATE PAGE DESCRIPTION
A1 Apr. 1997 - Initial Issued
A2 Nov. 1997 4, 8 Correct the address from 3FFF2 to 7FFF2
9 Correct the boot block from 8K to 16K
15 Modify page write cycle timing diagram waveform
1, 18 Delete cycling 100K item
6 Add. pause 10 mS
7 Add. pause 50 mS
8
Correct the time from 10 mS to 10 µS
A3 June 1998 4 Correct power-on delay from 5 mS to 10 mS
11 Correct TPU.WRITE (Typ.) from 5 mS to 10 mS
A4 Oct. 1998 20 Correct 40-pin TSOP package drawing by 32-pin TSOP
9 Correct the address from 3FFFF to 7FFFF
A5 May 1999 1, 12, 18 Modify TACC:
90/120/150 nS à 90/120 nS binning
1, 2, 18, 19 Modify package:
PDIP/SOP/PLCC/TSOP à PLCC/TSOP
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.