Data Sheet

Compute Module 3+ Datasheet
Copyright Raspberry Pi (Trading) Ltd. 2019
4 Mechanical Specification
The CM3+ modules conform to JEDEC MO-224 mechanical specification for 200 pin DDR2 (1.8V)
SODIMM modules and therefore should work with the many DDR2 SODIMM sockets available on the
market. (Please note that the pinout of the Compute Module is not the same as a DDR2 SODIMM
module; they are not electrically compatible.)
The SODIMM form factor was chosen as a way to provide the 200 pin connections using a standard,
readily available and low cost connector compatible with low cost PCB manufacture.
The maximum component height on the underside of the Compute Module is 1.2mm.
The maximum component height on the top side of the Compute Module is 2.5mm.
The Compute Module PCB thickness is 1.0mm +/- 0.1mm.
Note that the location and arrangement of components on the Compute Module may change slightly
over time due to revisions for cost and manufacturing considerations; however, maximum component
heights and PCB thickness will be kept as specified.
Figure 2 gives the CM3+ mechanical dimensions.
Figure 2: CM3+ Mechanical Dimensions
8 Release 2