User's Manual
Table Of Contents
- Cover
- Notice
- General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products
- How to Use This Manual
- Contents
- Features
- 1. Overview
- 2. CPU
- 2.1 Features
- 2.2 Register Set of the CPU
- 2.2.1 General-Purpose Registers (R0 to R15)
- 2.2.2 Control Registers
- 2.2.2.1 Interrupt Stack Pointer (ISP)/User Stack Pointer (USP)
- 2.2.2.2 Exception Table Register (EXTB)
- 2.2.2.3 Interrupt Table Register (INTB)
- 2.2.2.4 Program Counter (PC)
- 2.2.2.5 Processor Status Word (PSW)
- 2.2.2.6 Backup PC (BPC)
- 2.2.2.7 Backup PSW (BPSW)
- 2.2.2.8 Fast Interrupt Vector Register (FINTV)
- 2.2.2.9 Floating-Point Status Word (FPSW)
- 2.2.3 Accumulator
- 2.3 Processor Mode
- 2.4 Data Types
- 2.5 Endian
- 2.6 Vector Table
- 2.7 Operation of Instructions
- 2.8 Number of Cycles
- 3. Operating Modes
- 4. Address Space
- 5. I/O Registers
- 6. Resets
- 7. Option-Setting Memory (OFSM)
- 8. Voltage Detection Circuit (LVDAb)
- 9. Clock Generation Circuit
- 9.1 Overview
- 9.2 Register Descriptions
- 9.2.1 System Clock Control Register (SCKCR)
- 9.2.2 System Clock Control Register 3 (SCKCR3)
- 9.2.3 PLL Control Register (PLLCR)
- 9.2.4 PLL Control Register 2 (PLLCR2)
- 9.2.5 USB-dedicated PLL Control Register (UPLLCR)
- 9.2.6 USB-dedicated PLL Control Register 2 (UPLLCR2)
- 9.2.7 Main Clock Oscillator Control Register (MOSCCR)
- 9.2.8 Sub-Clock Oscillator Control Register (SOSCCR)
- 9.2.9 Low-Speed On-Chip Oscillator Control Register (LOCOCR)
- 9.2.10 IWDT-Dedicated On-Chip Oscillator Control Register (ILOCOCR)
- 9.2.11 High-Speed On-Chip Oscillator Control Register (HOCOCR)
- 9.2.12 High-Speed On-Chip Oscillator Control Register 2 (HOCOCR2)
- 9.2.13 Oscillation Stabilization Flag Register (OSCOVFSR)
- 9.2.14 Oscillation Stop Detection Control Register (OSTDCR)
- 9.2.15 Oscillation Stop Detection Status Register (OSTDSR)
- 9.2.16 Main Clock Oscillator Wait Control Register (MOSCWTCR)
- 9.2.17 CLKOUT Output Control Register (CKOCR)
- 9.2.18 Main Clock Oscillator Forced Oscillation Control Register (MOFCR)
- 9.2.19 Memory Wait Cycle Setting Register (MEMWAIT)
- 9.2.20 Low-Speed On-Chip Oscillator Trimming Register (LOCOTRR)
- 9.2.21 IWDT-Dedicated On-Chip Oscillator Trimming Register (ILOCOTRR)
- 9.2.22 High-Speed On-Chip Oscillator Trimming Register n (HOCOTRRn) (n = 0, 3)
- 9.3 Main Clock Oscillator
- 9.4 Sub-Clock Oscillator
- 9.5 Dedicated Clock Oscillator for Bluetooth
- 9.6 Oscillation Stop Detection Function
- 9.7 PLL Circuit
- 9.8 Internal Clock
- 9.9 Usage Notes
- 10. Clock Frequency Accuracy Measurement Circuit (CAC)
- 10.1 Overview
- 10.2 Register Descriptions
- 10.2.1 CAC Control Register 0 (CACR0)
- 10.2.2 CAC Control Register 1 (CACR1)
- 10.2.3 CAC Control Register 2 (CACR2)
- 10.2.4 CAC Interrupt Request Enable Register (CAICR)
- 10.2.5 CAC Status Register (CASTR)
- 10.2.6 CAC Upper-Limit Value Setting Register (CAULVR)
- 10.2.7 CAC Lower-Limit Value Setting Register (CALLVR)
- 10.2.8 CAC Counter Buffer Register (CACNTBR)
- 10.3 Operation
- 10.4 Interrupt Requests
- 10.5 Usage Notes
- 11. Low Power Consumption
- 11.1 Overview
- 11.2 Register Descriptions
- 11.2.1 Standby Control Register (SBYCR)
- 11.2.2 Module Stop Control Register A (MSTPCRA)
- 11.2.3 Module Stop Control Register B (MSTPCRB)
- 11.2.4 Module Stop Control Register C (MSTPCRC)
- 11.2.5 Module Stop Control Register D (MSTPCRD)
- 11.2.6 Operating Power Control Register (OPCCR)
- 11.2.7 Sub Operating Power Control Register (SOPCCR)
- 11.2.8 Sleep Mode Return Clock Source Switching Register (RSTCKCR)
- 11.3 Reducing Power Consumption by Switching Clock Signals
- 11.4 Module Stop Function
- 11.5 Function for Lower Operating Power Consumption
- 11.6 Low Power Consumption Modes
- 11.7 Usage Notes
- 12. Battery Backup Function
- 13. Register Write Protection Function
- 14. Exception Handling
- 15. Interrupt Controller (ICUb)
- 15.1 Overview
- 15.2 Register Descriptions
- 15.2.1 Interrupt Request Register n (IRn) (n = interrupt vector number)
- 15.2.2 Interrupt Request Enable Register m (IERm) (m = 02h to 1Fh)
- 15.2.3 Interrupt Source Priority Register n (IPRn) (n = interrupt vector number)
- 15.2.4 Fast Interrupt Set Register (FIR)
- 15.2.5 Software Interrupt Generation Register (SWINTR)
- 15.2.6 DTC Transfer Request Enable Register n (DTCERn) (n = interrupt vector number)
- 15.2.7 DMAC Trigger Select Register m (DMRSRm) (m = DMAC channel number)
- 15.2.8 IRQ Control Register i (IRQCRi) (i = 0, 1, and 4 to 7)
- 15.2.9 IRQ Pin Digital Filter Enable Register 0 (IRQFLTE0)
- 15.2.10 IRQ Pin Digital Filter Setting Register 0 (IRQFLTC0)
- 15.2.11 Non-Maskable Interrupt Status Register (NMISR)
- 15.2.12 Non-Maskable Interrupt Enable Register (NMIER)
- 15.2.13 Non-Maskable Interrupt Status Clear Register (NMICLR)
- 15.2.14 NMI Pin Interrupt Control Register (NMICR)
- 15.2.15 NMI Pin Digital Filter Enable Register (NMIFLTE)
- 15.2.16 NMI Pin Digital Filter Setting Register (NMIFLTC)
- 15.3 Vector Table
- 15.4 Interrupt Operation
- 15.5 Non-maskable Interrupt Operation
- 15.6 Return from Power-Down States
- 15.7 Usage Note
- 16. Buses
- 17. Memory-Protection Unit (MPU)
- 17.1 Overview
- 17.2 Register Descriptions
- 17.2.1 Region-n Start Page Number Register (RSPAGEn) (n = 0 to 7)
- 17.2.2 Region-n End Page Number Register (REPAGEn) (n = 0 to 7)
- 17.2.3 Memory-Protection Enable Register (MPEN)
- 17.2.4 Background Access Control Register (MPBAC)
- 17.2.5 Memory-Protection Error Status-Clearing Register (MPECLR)
- 17.2.6 Memory-Protection Error Status Register (MPESTS)
- 17.2.7 Data Memory-Protection Error Address Register (MPDEA)
- 17.2.8 Region Search Address Register (MPSA)
- 17.2.9 Region Search Operation Register (MPOPS)
- 17.2.10 Region Invalidation Operation Register (MPOPI)
- 17.2.11 Instruction-Hit Region Register (MHITI)
- 17.2.12 Data-Hit Region Register (MHITD)
- 17.3 Functions
- 17.4 Procedures for Using Memory Protection
- 18. DMA Controller (DMACA)
- 18.1 Overview
- 18.2 Register Descriptions
- 18.2.1 DMA Source Address Register (DMSAR)
- 18.2.2 DMA Destination Address Register (DMDAR)
- 18.2.3 DMA Transfer Count Register (DMCRA)
- 18.2.4 DMA Block Transfer Count Register (DMCRB)
- 18.2.5 DMA Transfer Mode Register (DMTMD)
- 18.2.6 DMA Interrupt Setting Register (DMINT)
- 18.2.7 DMA Address Mode Register (DMAMD)
- 18.2.8 DMA Offset Register (DMOFR)
- 18.2.9 DMA Transfer Enable Register (DMCNT)
- 18.2.10 DMA Software Start Register (DMREQ)
- 18.2.11 DMA Status Register (DMSTS)
- 18.2.12 DMA Activation Source Flag Control Register (DMCSL)
- 18.2.13 DMA Module Activation Register (DMAST)
- 18.3 Operation
- 18.4 Ending DMA Transfer
- 18.5 Interrupts
- 18.6 Event Link Function
- 18.7 Low Power Consumption Function
- 18.8 Usage Notes
- 18.8.1 DMA Transfer to Peripheral Modules
- 18.8.2 Access to the Registers during DMA Transfer
- 18.8.3 DMA Transfer to Reserved Areas
- 18.8.4 Interrupt Request by the DMA Activation Source Flag Control Register (DMCSL) at the End of each Transfer
- 18.8.5 Setting of DMAC Activation Source Select Register of the Interrupt Controller (ICU.DMRSRm)
- 18.8.6 Suspending or Restarting DMA Activation
- 19. Data Transfer Controller (DTCa)
- 19.1 Overview
- 19.2 Register Descriptions
- 19.2.1 DTC Mode Register A (MRA)
- 19.2.2 DTC Mode Register B (MRB)
- 19.2.3 DTC Transfer Source Register (SAR)
- 19.2.4 DTC Transfer Destination Register (DAR)
- 19.2.5 DTC Transfer Count Register A (CRA)
- 19.2.6 DTC Transfer Count Register B (CRB)
- 19.2.7 DTC Control Register (DTCCR)
- 19.2.8 DTC Vector Base Register (DTCVBR)
- 19.2.9 DTC Address Mode Register (DTCADMOD)
- 19.2.10 DTC Module Start Register (DTCST)
- 19.2.11 DTC Status Register (DTCSTS)
- 19.3 Request Sources
- 19.4 Operation
General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor
devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the
level at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal
elements. Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal
produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
IL
(Max.) and V
IH
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the
input level is fixed, and also in the transition period when the input level passes through the area between V
IL
(Max.) and V
IH
(Min.).
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms
of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-
evaluation test for the given product.