Datasheet

Section 1 Overview
Rev. 2.00 Sep. 28, 2009 Page 6 of 994
REJ09B0452-0200
Classification
Module/
Function
Description
FSI
interface
(FSI)
• One channel
• Supports communications between this LCI and SPI flash
memory
• Capable of operating as a master
• Supports LPC reset and LPC shut-down
High-
performance
communication
CIR
interface
(CIR)
• One channel
• Selectable from four sampling clocks:
Three internal clocks and subclock
• 18-byte FIFO incorporated
I/O ports
• Input-only pins: 13 pins
• Input/output pins: 112 pins (TFP-144V and TLP-145V)
128 pins (BP-176V)
• 76 pull-up resistors for TFP-144V and TLP-145V, and 84 pull-
up resistors for BP-176V
• 40 pins with LED drive capability
• 24 on-chip noise cancellers
Package
• 144-pin thin QFP package (PTQP0144LC-A)
(old code: TFP-144V, package dimensions: 16 × 16 mm, pin
pitch: 0.40 mm)
• 176-pin BGA package (PLBG0176GA-A)
(old code: BP-176V, package dimensions: 13 × 13 mm, pin
pitch: 0.80 mm)
• 145-pin TLP package (PTLG0145JB-A)
(package dimensions: 9 × 9 mm, pin pitch: 0.65 mm)
• Lead- (Pb-) free version
Operating frequency/
Power supply voltage
• Operating frequency: 8 to 20 MHz
• Power supply voltage: Vcc = 3.0 to 3.6 V, AVcc = 3.0 to 3.6 V
• Supply current:
25 mA (typ.) (Vcc = 3.3 V, AVcc = 3.3 V, φ = 20 MHz)
Operating peripheral
temperature (°C)
• −20 to +75°C (regular specifications)