Datasheet

Rev.7.00 Mar. 18, 2009 page xli of lxvi
REJ09B0109-0700
26.2.3 AC Characteristics .............................................................................................. 1039
26.2.4 A/D Conversion Characteristics.......................................................................... 1048
26.2.5 D/A Conversion Characteristics.......................................................................... 1048
26.2.6 Flash Memory Characteristics ............................................................................ 1049
26.3 Electrical Characteristics for H8S/2374, H8S/2372, H8S/2371, H8S/2370,
H8S/2378R, H8S/2374R, H8S/2372R, H8S/2371R, H8S/2370R.................................... 1050
26.3.1 Absolute Maximum Ratings ............................................................................... 1050
26.3.2 DC Characteristics .............................................................................................. 1051
26.3.3 AC Characteristics .............................................................................................. 1054
26.3.4 A/D Conversion Characteristics.......................................................................... 1063
26.3.5 D/A Conversion Characteristics.......................................................................... 1063
26.3.6 Flash Memory Characteristics ............................................................................ 1064
26.4 Timing Charts .................................................................................................................. 1067
26.4.1 Clock Timing ...................................................................................................... 1067
26.4.2 Control Signal Timing ........................................................................................ 1069
26.4.3 Bus Timing ......................................................................................................... 1070
26.4.4 DMAC and EXDMAC Timing........................................................................... 1088
26.4.5 Timing of On-Chip Peripheral Modules ............................................................. 1091
Appendix ........................................................................................................1095
A. I/O Port States in Each Pin State...................................................................................... 1095
B. Product Lineup................................................................................................................. 1105
C. Package Dimensions ........................................................................................................ 1106
D. Bus State during Execution of Instructions...................................................................... 1108
Index ........................................................................................................1131