Datasheet
Table Of Contents
- Cover
- Notes regarding these materials
- General Precautions on Handling of Product
- Configuration of This Manual
- Preface
- Contents
- Figures
- Tables
- Section 1 Overview
- Section 2 CPU
- Section 3 Exception Handling
- Section 4 Interrupt Controller
- 4.1 Features
- 4.2 Input/Output Pins
- 4.3 Register Descriptions
- 4.3.1 Interrupt Edge Select Register (IEGR)
- 4.3.2 Wakeup Edge Select Register (WEGR)
- 4.3.3 Interrupt Enable Register 1 (IENR1)
- 4.3.4 Interrupt Enable Register 2 (IENR2)
- 4.3.5 Interrupt Request Register 1 (IRR1)
- 4.3.6 Interrupt Request Register 2 (IRR2)
- 4.3.7 Wakeup Interrupt Request Register (IWPR)
- 4.3.8 Interrupt Priority Registers A to F (IPRA to IPRF)
- 4.3.9 Interrupt Mask Register (INTM)
- 4.4 Interrupt Sources
- 4.5 Interrupt Exception Handling Vector Table
- 4.6 Operation
- 4.7 Usage Notes
- Section 5 Clock Pulse Generator
- 5.1 Register Description
- 5.2 System Clock Generator
- 5.3 Subclock Generator
- 5.4 Prescalers
- 5.5 Usage Notes
- 5.5.1 Note on Resonators and Resonator Circuits
- 5.5.2 Notes on Board Design
- 5.5.3 Definition of Oscillation Stabilization Wait Time
- 5.5.4 Note on Subclock Stop State
- 5.5.5 Note on the Oscillation Stabilization of Resonators
- 5.5.6 Note on Using On-Chip Power-On Reset
- 5.5.7 Note on Using the On-Chip Emulator
- Section 6 Power-Down Modes
- 6.1 Register Descriptions
- 6.2 Mode Transitions and States of LSI
- 6.3 Direct Transition
- 6.3.1 Direct Transition from Active (High-Speed) Mode to Active (Medium-Speed) Mode
- 6.3.2 Direct Transition from Active (High-Speed) Mode to Subactive Mode
- 6.3.3 Direct Transition from Active (Medium-Speed) Mode to Active (High-Speed) Mode
- 6.3.4 Direct Transition from Active (Medium-Speed) Mode to Subactive Mode
- 6.3.5 Direct Transition from Subactive Mode to Active (High-Speed) Mode
- 6.3.6 Direct Transition from Subactive Mode to Active (Medium-Speed) Mode
- 6.3.7 Notes on External Input Signal Changes before/after Direct Transition
- 6.4 Module Standby Function
- 6.5 Usage Notes
- Section 7 ROM
- Section 8 RAM
- Section 9 I/O Ports
- Section 10 Realtime Clock (RTC)
- 10.1 Features
- 10.2 Input/Output Pin
- 10.3 Register Descriptions
- 10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR)
- 10.3.2 Minute Data Register (RMINDR)
- 10.3.3 Hour Data Register (RHRDR)
- 10.3.4 Day-of-Week Data Register (RWKDR)
- 10.3.5 RTC Control Register 1 (RTCCR1)
- 10.3.6 RTC Control Register 2 (RTCCR2)
- 10.3.7 Clock Source Select Register (RTCCSR)
- 10.3.8 RTC Interrupt Flag Register (RTCFLG)
- 10.4 Operation
- 10.5 Interrupt Sources
- 10.6 Usage Notes
- Section 11 Timer C
- Section 12 Timer F
- Section 13 Timer G
- Section 14 16-Bit Timer Pulse Unit (TPU)
- 14.1 Features
- 14.2 Input/Output Pins
- 14.3 Register Descriptions
- 14.3.1 Timer Control Register (TCR)
- 14.3.2 Timer Mode Register (TMDR)
- 14.3.3 Timer I/O Control Register (TIOR)
- 14.3.4 Timer Interrupt Enable Register (TIER)
- 14.3.5 Timer Status Register (TSR)
- 14.3.6 Timer Counter (TCNT)
- 14.3.7 Timer General Register (TGR)
- 14.3.8 Timer Start Register (TSTR)
- 14.3.9 Timer Synchro Register (TSYR)
- 14.4 Interface to CPU
- 14.5 Operation
- 14.6 Interrupt Sources
- 14.7 Operation Timing
- 14.8 Usage Notes
- 14.8.1 Module Standby Function Setting
- 14.8.2 Input Clock Restrictions
- 14.8.3 Caution on Period Setting
- 14.8.4 Contention between TCNT Write and Clear Operation
- 14.8.5 Contention between TCNT Write and Increment Operation
- 14.8.6 Contention between TGR Write and Compare Match
- 14.8.7 Contention between TGR Read and Input Capture
- 14.8.8 Contention between TGR Write and Input Capture
- 14.8.9 Contention between Overflow and Counter Clearing
- 14.8.10 Contention between TCNT Write and Overflow
- 14.8.11 Multiplexing of I/O Pins
- 14.8.12 Interrupts when Module Standby Function is Used
- 14.8.13 Output Conditions for 0% Duty and 100% Duty
- Section 15 Asynchronous Event Counter (AEC)
- Section 16 Watchdog Timer
- Section 17 Serial Communications Interface 3 (SCI3, IrDA)
- 17.1 Features
- 17.2 Input/Output Pins
- 17.3 Register Descriptions
- 17.3.1 Receive Shift Register (RSR)
- 17.3.2 Receive Data Register (RDR)
- 17.3.3 Transmit Shift Register (TSR)
- 17.3.4 Transmit Data Register (TDR)
- 17.3.5 Serial Mode Register (SMR)
- 17.3.6 Serial Control Register (SCR)
- 17.3.7 Serial Status Register (SSR)
- 17.3.8 Bit Rate Register (BRR)
- 17.3.9 Serial Port Control Register (SPCR)
- 17.3.10 Serial Port Control Register 2 (SPCR2)
- 17.3.11 IrDA Control Register (IrCR)
- 17.3.12 Serial Extended Mode Register (SEMR)
- 17.4 Operation in Asynchronous Mode
- 17.5 Operation in Clock Synchronous Mode
- 17.6 Multiprocessor Communication Function
- 17.7 IrDA Operation
- 17.8 Interrupt Requests
- 17.9 Usage Notes
- 17.9.1 Break Detection and Processing
- 17.9.2 Mark State and Break Sending
- 17.9.3 Receive Error Flags and Transmit Operations (Clock Synchronous Mode Only)
- 17.9.4 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
- 17.9.5 Note on Switching SCK3 Pin Function
- 17.9.6 Relation between Writing to TDR and Bit TDRE
- 17.9.7 Relation between RDR Reading and bit RDRF
- 17.9.8 Transmit and Receive Operations when Making State Transition
- 17.9.9 Setting in Subactive or Subsleep Mode
- 17.9.10 Oscillator when Serial Communications Interface 3 is Used
- Section 18 Serial Communication Interface 4 (SCI4)
- Section 19 14-Bit PWM
- Section 20 A/D Converter
- Section 21 LCD Controller/Driver
- Section 22 I2C Bus Interface 2 (IIC2)
- 22.1 Features
- 22.2 Input/Output Pins
- 22.3 Register Descriptions
- 22.3.1 I2C Bus Control Register 1 (ICCR1)
- 22.3.2 I2C Bus Control Register 2 (ICCR2)
- 22.3.3 I2C Bus Mode Register (ICMR)
- 22.3.4 I2C Bus Interrupt Enable Register (ICIER)
- 22.3.5 I2C Bus Status Register (ICSR)
- 22.3.6 Slave Address Register (SAR)
- 22.3.7 I2C Bus Transmit Data Register (ICDRT)
- 22.3.8 I2C Bus Receive Data Register (ICDRR)
- 22.3.9 I2C Bus Shift Register (ICDRS)
- 22.4 Operation
- 22.5 Interrupt Request
- 22.6 Bit Synchronous Circuit
- 22.7 Usage Notes
- 22.7.1 Note on Issuing Stop Condition and Start (Re-Transmit) Condition
- 22.7.2 Note on Setting WAIT Bit in I2C Bus Mode Register (ICMR)
- 22.7.3 Restriction on Transfer Rate Setting in Multimaster Operation
- 22.7.4 Restriction on the Use of Bit Manipulation Instructions for MST and TRS Setting in Multimaster Operation
- 22.7.5 Usage Note on Master Receive Mode
- Section 23 Power-On Reset Circuit
- Section 24 Address Break
- Section 25 List of Registers
- Section 26 Electrical Characteristics
- Appendix
- Main Revisions and Additions in this Edition
- Index
- Colophon
- Address List
- Back Cover
Section 26 Electrical Characteristics
Rev. 2.00 Jul. 04, 2007 Page 575 of 692
REJ09B0309-0200
5. Set the maximum programming count (N) according to the actual set values of z1, z2,
and z3, so that it does not exceed the programming time maximum value (t
P
(max.)).
The wait time after setting P bit (z1, z2) should be changed as follows according to the
value of the programming count (n).
Programming count (n)
1 ≤ n ≤ 6 z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erasing time maximum value (t
E
(max.)) = wait time after setting E bit (z) × maximum
erasing count (N)
7. Set the maximum erasing count (N) according to the actual set value of (z), so that it
does not exceed the erasing time maximum value (t
E
(max.)).
8. The minimum number of times in which all characteristics are guaranteed following
reprogramming. (The guarantee covers the range from 1 to the minimum value.)
9. Reference value at 25°C. (Guideline showing programming count over which
functioning will be retained under normal circumstances.)
10. Data retention characteristics within the range indicated in the specifications, including
the minimum programming count.
11. Applies to an operating voltage range when reading data of 2.7 to 3.6 V.
12. Applies to an operating voltage range when reading data of 1.8 to 3.6 V.
26.3 Absolute Maximum Ratings for Masked ROM Version
Table 26.11 lists the absolute maximum ratings.
Table 26.11 Absolute Maximum Ratings
Item Symbol Value Unit Note
Power supply voltage V
CC
–0.3 to +4.3 V
Analog power supply voltage AV
CC
–0.3 to +4.3 V
Other than port B V
in
–0.3 to V
CC
+0.3 V Input voltage
Port B AV
in
–0.3 to AV
CC
+0.3 V
–20 to +75
(regular specifications)
Operating temperature T
opr
–40 to +85
(wide-range specifications)
°C
*
Storage temperature T
stg
–55 to +125 °C
Note: * Permanent damage may occur to the chip if absolute maximum ratings are exceeded.
Normal operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.