Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 12 of 680
REJ09B0145-0600
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
2726 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
99100 9897 9695 9493 92 91 90 89 88 87 86 8584 83 82 81 80 79 78 77 76
X
Y
(0, 0)
Type code
: NC Pad
Chip size : 6.10mm × 6.23mm
Volta
g
e level on the back of the chi
p
: GND
Figure 1.4 Bonding Pad Location Diagram of H8/3847R Group (Mask ROM Version)
(Top View)