Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 13 of 680
REJ09B0145-0600
Table 1.2 Bonding Pad Coordinates of H8/3847R Group (Mask ROM Version)
Coordinates*
Pad No. Pad Name X (µm) Y (µm)
1P1
0
/TMOW -2866 1939
2P1
1
/TMOFL -2866 1694
3P1
2
/TMOFH -2866 1500
4P1
3
/TMIG -2866 1326
5P1
4
/IRQ
4
/ADTRG -2866 984
6P1
5
/IRQ
1
/TMIC -2866 810
7P1
6
/IRQ
2
-2866 636
8P1
7
/IRQ
3
/TMIF -2866 462
9X
1
-2866 288
10 X
2
-2866 116
11 V
SS
-2866 -56
12 OSC
2
-2866 -228
13 OSC
1
-2866 -402
14 TEST -2866 -576
15 RES -2866 -749
16 P2
0
/SCK
1
-2866 -920
17 P2
1
/SI
1
-2866 -1094
18 P2
2
/SO
1
-2866 -1266
19 P2
3
-2866 -1440
20 P2
4
-2866 -1612
21 P2
5
-2866 -1785
22 P2
6
-2866 -1969
23 P2
7
-2866 -2153
24 P3
0
/PWM -2866 -2327
25 P3
1
/UD -2866 -2503
26 P3
2
/RESO -2866 -2931
27 P3
3
/SCK
31
-2669 -2931
28 P3
4
/RXD
31
-2142 -2931
29 P3
5
/TXD
31
-1971 -2931
30 P3
6
/AEVH -1798 -2931