Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 17 of 680
REJ09B0145-0600
Base type code
Type code
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
27
26
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
99100 98 97 96 95 94 9293 9091 89 88 87 86 85 84 83 82 81 80 79 78 77 76
X
Y
(0, 0)
: NC Pad
Chip size : 3.55mm × 3.45mm
Voltage level on the back of the chip : GND
Figure 1.5 Bonding Pad Location Diagram of H8/3847S Group (Mask ROM Version)
(Top View)