Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 18 of 680
REJ09B0145-0600
Table 1.3 Bonding Pad Coordinates of H8/3847S Group (Mask ROM Version)
Coordinates*
Pad No. Pad Name X (µm) Y (µm)
1P1
0
/TMOW -1655 1260
2P1
1
/TMOFL -1655 999
3P1
2
/TMOFH -1655 799
4P1
3
/TMIG -1655 629
5P1
4
/IRQ
4
/ADTRG -1655 451
6P1
5
/IRQ
1
/TMIC -1655 334
7P1
6
/IRQ
2
-1655 226
8P1
7
/IRQ
3
/TMIF -1655 122
9X
1
-1655 37
10 X
2
-1655 -48
11 V
SS
-1655 -138
12 OSC
2
-1655 -223
13 OSC
1
-1655 -308
14 TEST -1655 -393
15 RES -1655 -478
16 P2
0
/SCK
1
-1655 -563
17 P2
1
/SI
1
-1655 -648
18 P2
2
/SO
1
-1655 -733
19 P2
3
-1655 -818
20 P2
4
-1655 -903
21 P2
5
-1655 -988
22 P2
6
-1655 -1073
23 P2
7
-1655 -1158
24 P3
0
/PWM -1655 -1243
25 P3
1
/UD -1655 -1480
26 P3
2
/RESO -1580 -1605
27 P3
3
/SCK
31
-1357 -1605
28 P3
4
/RXD
31
-1178 -1605
29 P3
5
/TXD
31
-1093 -1605
30 P3
6
/AEVH -992 -1605