Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 22 of 680
REJ09B0145-0600
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
76
75
74
73
72
71
70
69
68
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66
65
64
63
62
61
60
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58
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56
55
54
53
52
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
49 50 51
99100
101 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77
X
Y
(0, 0)
: NC Pad
Chip size : 4.35mm × 4.83mm
Voltage level on the back of the chip : GND
Type code
Figure 1.6 Bonding Pad Location Diagram of HCD64F38347 and HCD64F38447
(Top View)