Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 23 of 680
REJ09B0145-0600
Table 1.4 Bonding Pad Coordinates of HCD64F38347 and HCD64F38447
Coordinates*
Pad No. Pad Name X (µm) Y (µm)
1P1
0
/TMOW -2056 1570
2P1
1
/TMOFL -2056 1360
3P1
2
/TMOFH -2056 1259
4P1
3
/TMIG -2056 1158
5P1
4
/IRQ
4
/ADTRG -2056 941
6P1
5
/IRQ
1
/TMIC -2056 839
7P1
6
/IRQ
2
-2056 737
8P1
7
/IRQ
3
/TMIF -2056 635
9X
1
-2056 533
10 X
2
-2056 431
11 V
SS
-2056 329
12 V
SS
-2056 193
13 OSC
2
-2056 106
14 OSC
1
-2056 20
15 TEST -2056 -66
16 RES -2056 -244
17 P2
0
/SCK
1
-2056 -402
18 P2
1
/SI
1
-2056 -574
19 P2
2
/SO
1
-2056 -747
20 P2
3
-2056 -919
21 P2
4
-2056 -1091
22 P2
5
-2056 -1263
23 P2
6
-2056 -1349
24 P2
7
-2056 -1521
25 P3
0
/PWM -2056 -1607
26 P3
1
/UD/EXCL -2056 -1779
27 P3
2
-1777 -2295
28 P3
3
/SCK
31
-1530 -2295
29 P3
4
/RXD
31
-1382 -2295
30 P3
5
/TXD
31
-1280 -2295
31 P3
6
/AEVH -1178 -2295