Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 27 of 680
REJ09B0145-0600
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
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18
19
20
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22
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25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
75
74
73
72
71
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69
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51
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
X
Y
(0, 0)
Chip size : 3.55mm × 3.77mm
Voltage level on the back of the chip : GND
Base type code
Type code
Figure 1.7 Bonding Pad Location Diagram of H8/38347 Group (Mask ROM Version)
and H8/38447 Group (Mask ROM Version) (Top View)