Datasheet

Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 28 of 680
REJ09B0145-0600
Table 1.5 Bonding Pad Coordinates of H8/38347 Group (Mask ROM Version)
and H8/38447 Group (Mask ROM Version)
Coordinates*
Pad No. Pad Name X (µm) Y (µm)
1P1
0
/TMOW -1658 1349
2P1
1
/TMOFL -1658 1191
3P1
2
/TMOFH -1658 1104
4P1
3
/TMIG -1658 1006
5P1
4
/IRQ
4
/ADTRG -1658 907
6P1
5
/IRQ
1
/TMIC -1658 751
7P1
6
/IRQ
2
-1658 653
8P1
7
/IRQ
3
/TMIF -1658 555
9X
1
-1658 456
10 X
2
-1658 358
11 V
SS
-1658 232
12 OSC
2
-1658 88
13 OSC
1
-1658 -11
14 TEST -1658 -113
15 RES -1658 -212
16 P2
0
/SCK
1
-1658 -393
17 P2
1
/SI
1
-1658 -491
18 P2
2
/SO
1
-1658 -590
19 P2
3
-1658 -688
20 P2
4
-1658 -786
21 P2
5
-1658 -884
22 P2
6
-1658 -983
23 P2
7
-1658 -1081
24 P3
0
/PWM -1658 -1168
25 P3
1
/UD/EXCL -1658 -1337
26 P3
2
-1629 -1767
27 P3
3
/SCK
31
-1300 -1767
28 P3
4
/RXD
31
-1202 -1767
29 P3
5
/TXD
31
-1103 -1767
30 P3
6
/AEVH -1005 -1767