Datasheet

Appendix H Form of Bonding Pads
Rev. 6.00 Aug 04, 2006 page 674 of 680
REJ09B0145-0400
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD6433847R, HCD6433846R, HCD6433845R,
HCD6433844R, HCD6433843R, and HCD6433842R is shown in figure H.1.
Bonding area
Metal Layer
90 µm
90 µm
5 to 8 µm
5 to 8 µm
Figure H.1 Bonding Pad Form