Appendix H Form of Bonding Pads
Rev. 6.00 Aug 04, 2006 page 675 of 680
REJ09B0145-0600
The form of the bonding pads for the HCD6433847S, HCD6433846S, HCD6433845S, and
HCD6433844S is shown in figure H.2.
Bonding area
Metal Layer
75 µm
75 µm
2.5 µm
2.5 µm
Figure H.2 Bonding Pad Form
