Datasheet

Appendix H Form of Bonding Pads
Rev. 6.00 Aug 04, 2006 page 676 of 680
REJ09B0145-0400
The form of the bonding pads for the HCD64F38347, HCD64F38447, H8/38347 Group (Mask
ROM version), and H8/38447 Group (Mask ROM version) is shown in figure H.3.
Bonding area
Metal Layer
65 µm
65 µm
5 µm
5 µm
Figure H.3 Bonding Pad Form