Datasheet

Section 1 Overview
Rev. 8.00 Mar. 09, 2010 Page 15 of 658
REJ09B0042-0800
63
61
59
57
55
53
51
49
47
45
43
62
60
58
56
54
52
50
48
46
44
42
81 79 77 75 73 71 69 67 65
80 78 76 74 72 70 68 66 64
1
3
5
7
9
11
13
15
17
19
21
23
2
4
6
8
10
12
14
16
18
20
22
24 26
25
28 30 32 34 36 38 40
27 29 31 33 35 37 39 41
Y
X
(0, 0)
Type code
Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
: NC pad
Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)