Datasheet

Section 1 Overview
Rev. 8.00 Mar. 09, 2010 Page 14 of 658
REJ09B0042-0800
Table 1.2 Bonding Pad Coordinates of HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020
Coordinates Coordinates
Pad No. Pad Name X (μm) Y (μm) Pad No. Pad Name X (μm) Y (μm)
1 AV
CC
–1870 1546 42 P84/SEG29 1870 –1571
2 P13/TMIG –1870 1274 43 P85/SEG30 1870 –1395
3 P14/IRQ4/ADTRG –1870 1058 44 P86/SEG31 1870 –1251
4 P16 –1870 909 45 P87/SEG32 1870 –1111
5 P17/IRQ3/TMIF –1870 759 46 PA3/COM4 1870 –970
6 X1 –1870 608 47 PA2/COM3 1870 –831
7 X2 –1870 475 48 PA1/COM2 1870 –691
8 AV
SS
–1870 304 49 PA0/COM1 1870 –550
9 V
SS
–1870 173 50 V3 1870 –410
10 OSC2 –1870 –10 51 V2 1870 –270
11 OSC1 –1870 –150 52 V1 1870 –131
12 TEST –1870 –290 53 V
CC
1870 10
13 RES –1870 –425 54 V
SS
1870 150
14 P50/WKP0/SEG1 –1870 –560 55 P90/PWM1 1870 293
15 P51/WKP1/SEG2 –1870 –695 56 P91/PWM2 1870 489
16 P52/WKP2/SEG3 –1870 –831 57 P92 1870 685
17 P53/WKP3/SEG4 –1870 –966 58 P93 1870 880
18 P54/WKP4/SEG5 –1870 –1101 59 P94 1870 1076
19 P55/WKP5/SEG6 –1870 –1236 60 P95 1870 1274
20 P56/WKP6/SEG7 –1870 –1379 61 IRQAEC 1870 1546
21 P57/WKP7/SEG8 –1870 –1561 62 P30/UD 1782 1872
22 P60/SEG9 –1780 –1872 63 P31/TMOFL 1621 1872
23 P61/SEG10 –1621 –1872 64 P32/TMOFH 1084 1872
24 P62/SEG11 –1037 –1872 65 P33 948 1872
25 P63/SEG12 –896 –1872 66 P34 810 1872
26 P64/SEG13 –765 –1872 67 P35 673 1872
27 P65/SEG14 –635 –1872 68 P36/AEVH 536 1872
28 P66/SEG15 –502 –1872 69 P37/AEVL 311 1872
29 P67/SEG16 –371 –1872 70 P40/SCK32 176 1872
30 P70/SEG17 –239 –1872 71 P41/RXD32 38 1872
31 P71/SEG18 –108 –1872 72 P42/TXD32 –99 1872
32 P72/SEG19 23 –1872 73 P43/IRQ0 –234 1872
33 P73/SEG20 156 –1872 74 PB0/AN0 –482 1872
34 P74/SEG21 287 –1872 75 PB1/AN1 –614 1872
35 P75/SEG22 419 –1872 76 PB2/AN2 –745 1872
36 P76/SEG23 550 –1872 77 PB3/AN3/IRQ1/TMIC –878 1872
37 P77/SEG24 682 –1872 78 PB4/AN4 –1008 1872
38 P80/SEG25 833 –1872 79 PB5/AN5 –1148 1872
39 P81/SEG26 1040 –1872 80 PB6/AN6 –1621 1872
40 P82/SEG27 1621 –1872 81 PB7/AN7 –1782 1872
41 P83/SEG28 1782 –1872
Note: V
SS
Pads (No. 8 and 9) should be connected to power supply lines.
TEST Pad (No. 12) should be connected to V
SS
.
If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the
coordinates of the centers of pads. The accuracy is ±5 μm. The home-point position is the chip’s center and the center
is located at half the distance between the upper and lower pads and left and right pads.