Datasheet

Appendix H Form of Bonding Pads
Rev. 8.00 Mar. 09, 2010 Page 645 of 658
REJ09B0042-0800
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Bonding area
Metal layer
5 mm72 mm
5 mm
72 mm
Figure H.1 Bonding Pad Form