Datasheet

RL78/G13 2. ELECTRICAL SPECIFICATIONS (A, D: T
A = -40 to +85°C)
Page 68 of 194R01DS0131EJ0310 Rev.3.10
Nov 15, 2013
Notes 1. Total current flowing into VDD, EVDD0, and EVDD1, including the input leakage current flowing when the
level of the input pin is fixed to V
DD, EVDD0, and EVDD1, or VSS, EVSS0, and EVSS1. The values below the
MAX. column include the peripheral operation current. However, not including the current flowing into the
A/D converter, LVD circuit, I/O port, and on-chip pull-up/pull-down resistors and the current flowing during
data flash rewrite.
2. When high-speed on-chip oscillator and subsystem clock are stopped.
3. When high-speed system clock and subsystem clock are stopped.
4. When high-speed on-chip oscillator and high-speed system clock are stopped. When AMPHS1 = 1
(Ultra-low power consumption oscillation). However, not including the current flowing into the 12-bit
interval timer and watchdog timer.
5. Relationship between operation voltage width, operation frequency of CPU and operation mode is as
below.
HS (high-speed main) mode: 2.7 V ≤ V
DD ≤ 5.5 V@1 MHz to 32 MHz
2.4 V ≤ VDD ≤ 5.5 V@1 MHz to 16 MHz
LS (low-speed main) mode: 1.8 V ≤ VDD ≤ 5.5 V@1 MHz to 8 MHz
LV (low-voltage main) mode: 1.6 V ≤ V
DD ≤ 5.5 V@1 MHz to 4 MHz
Remarks 1. f
MX: High-speed system clock frequency (X1 clock oscillation frequency or external main system
clock frequency)
2. f
IH: High-speed on-chip oscillator clock frequency
3. fSUB: Subsystem clock frequency (XT1 clock oscillation frequency)
4. Except subsystem clock operation, temperature condition of the TYP. value is T
A = 25°C