Datasheet

Rev.2.10 Sep 26, 2008 Page 1 of 69
REJ03B0168-0210
R8C/26 Group, R8C/27 Group
SINGLE-CHIP 16-BIT CMOS MCU
1. Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and
are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction
efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.
Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash.
Their peripheral functions are the same.
1.1 Applications
Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.
REJ03B0168-0210
Rev.2.10
Sep 26, 2008