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R01DS0009EJ0100 Rev 1.00 Page 1 of 52

Aug. 24, 2010

R8C/32C Group

RENESAS MCU

Datasheet

1. Overview

1.1 Features

The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions

for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of

system components.

The R8C/32C Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.

1.1.1 Applications

Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.

R01DS0009EJ0100

Rev 1.00

Aug. 24, 2010

Summary of content (55 pages)

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Datasheet R8C/32C Group RENESAS MCU 1. R01DS0009EJ0100 Rev 1.00 Aug. 24, 2010 Overview 1.1 Features The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control.
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R8C/32C Group 1.1.2 1. Overview Specifications Tables 1.1 and 1.2 outline the Specifications for R8C/32C Group. Table 1.1 Item CPU Specifications for R8C/32C Group (1) Function Central processing unit Memory ROM, RAM, Data flash Power Supply Voltage detection Voltage circuit Detection I/O Ports Programmable I/O ports Clock Clock generation circuits Interrupts Watchdog Timer DTC (Data Transfer Controller) Timer Timer RA Timer RB Timer RC Timer RE R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group Table 1.2 Item Serial Interface 1.
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R8C/32C Group 1.2 1. Overview Product List Table 1.3 lists Product List for R8C/32C Group, and Figure 1.1 shows a Part Number, Memory Size, and Package of R8C/32C Group. Table 1.3 Product List for R8C/32C Group Part No. R5F21321CNSP R5F21322CNSP R5F21324CNSP R5F21321CDSP R5F21322CDSP R5F21324CDSP Part No.
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R8C/32C Group 1.3 1. Overview Block Diagram Figure 1.2 shows a Block Diagram.
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R8C/32C Group 1.4 1. Overview Pin Assignment Figure 1.3 shows Pin Assignment (Top View). Table 1.4 outlines the Pin Name Information by Pin Number.
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R8C/32C Group Table 1.4 Pin Number 1 2 3 4 5 6 7 8 1.
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R8C/32C Group 1.5 1. Overview Pin Functions Tables 1.5 and 1.6 list Pin Functions. Table 1.5 Pin Functions (1) Item Pin Name I/O Type Description Power supply input VCC, VSS − Apply 1.8 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin. Analog power supply input AVCC, AVSS − Power supply for the A/D converter. Connect a capacitor between AVCC and AVSS. Reset input RESET I Input “L” on this pin resets the MCU. MODE MODE I Connect this pin to VCC via a resistor.
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R8C/32C Group 1. Overview Table 1.
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R8C/32C Group 2. 2. Central Processing Unit (CPU) Central Processing Unit (CPU) Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a register bank. There are two sets of register bank.
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R8C/32C Group 2.1 2. Central Processing Unit (CPU) Data Registers (R0, R1, R2, and R3) R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is analogous to R2R0. 2.
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R8C/32C Group 2.8.7 2. Central Processing Unit (CPU) Interrupt Enable Flag (I) The I flag enables maskable interrupts. Interrupts are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0 when an interrupt request is acknowledged. 2.8.8 Stack Pointer Select Flag (U) ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.
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R8C/32C Group 3. 3. Memory Memory 3.1 R8C/32C Group Figure 3.1 is a Memory Map of R8C/32C Group. The R8C/32C Group has a 1-Mbyte address space from addresses 00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. The starting address of each interrupt routine is stored here.
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R8C/32C Group 4. 4. Special Function Registers (SFRs) Special Function Registers (SFRs) An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.12 list the special function registers and Table 4.13 lists the ID Code Areas and Option Function Select Area. Table 4.
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R8C/32C Group Table 4.2 4.
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R8C/32C Group Table 4.3 Address 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h 0088h 0089h 008Ah 008Bh 008Ch 008Dh 008Eh 008Fh 0090h 0091h 0092h 0093h 0094h 0095h 0096h 0097h 0098h 0099h 009Ah 009Bh 009Ch 009Dh 009Eh 009Fh 00A0h 00A1h 00A2h 00A3h 00A4h 00A5h 00A6h 00A7h 00A8h 00A9h 00AAh 00ABh 00ACh 00ADh 00AEh 00AFh 00B0h 00B1h 00B2h 00B3h 00B4h 00B5h 00B6h 00B7h 00B8h 00B9h 00BAh 00BBh 00BCh 00BDh 00BEh 00BFh 4.
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R8C/32C Group Table 4.4 4.
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R8C/32C Group Table 4.5 Address 0100h 0101h 0102h 0103h 0104h 0105h 0106h 0107h 0108h 0109h 010Ah 010Bh 010Ch 010Dh 010Eh 010Fh 0110h 0111h 0112h 0113h 0114h 0115h 0116h 0117h 0118h 0119h 011Ah 011Bh 011Ch 011Dh 011Eh 011Fh 0120h 0121h 0122h 0123h 0124h 0125h 0126h 0127h 0128h 0129h 012Ah 012Bh 012Ch 012Dh 012Eh 012Fh 0130h 0131h 0132h 0133h 0134h 0135h 0136h 0137h 0138h 0139h 013Ah 013Bh 013Ch 013Dh 013Eh 013Fh Note: 1. 4.
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R8C/32C Group Table 4.6 4. Special Function Registers (SFRs) SFR Information (6) (1) Address Register 0140h 0141h 0142h 0143h 0144h 0145h 0146h 0147h 0148h 0149h 014Ah 014Bh 014Ch 014Dh 014Eh 014Fh 0150h 0151h 0152h 0153h 0154h 0155h 0156h 0157h 0158h 0159h 015Ah 015Bh 015Ch 015Dh 015Eh 015Fh 0160h 0161h 0162h 0163h 0164h 0165h 0166h 0167h 0168h 0169h 016Ah 016Bh 016Ch 016Dh 016Eh 016Fh 0170h 0171h 0172h 0173h 0174h 0175h 0176h 0177h 0178h 0179h 017Ah 017Bh 017Ch 017Dh 017Eh 017Fh X: Undefined Note: 1.
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R8C/32C Group Table 4.7 4.
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R8C/32C Group Table 4.8 4.
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R8C/32C Group Table 4.9 4.
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R8C/32C Group Table 4.10 4.
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R8C/32C Group Table 4.11 4.
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R8C/32C Group 4. Special Function Registers (SFRs) SFR Information (12) (1) Table 4.12 Address Register 2CF0h DTC Control Data 22 2CF1h 2CF2h 2CF3h 2CF4h 2CF5h 2CF6h 2CF7h 2CF8h DTC Control Data 23 2CF9h 2CFAh 2CFBh 2CFCh 2CFDh 2CFEh 2CFFh 2D00h : 2FFFh X: Undefined Note: 1. The blank areas are reserved and cannot be accessed by users. Table 4.13 ID Code Areas and Option Function Select Area Address : FFDBh : FFDFh : FFE3h : FFEBh : FFEFh : FFF3h : FFF7h : FFFBh : FFFFh Area Name Notes: 1. 2.
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R8C/32C Group 5. 5. Electrical Characteristics Electrical Characteristics Table 5.1 Absolute Maximum Ratings Symbol Parameter Rated Value Unit −0.3 to 6.5 V Input voltage −0.3 to VCC + 0.3 V VO Output voltage −0.3 to VCC + 0.3 V Pd Power dissipation 500 mW Topr Operating ambient temperature −20 to 85 (N version) / −40 to 85 (D version) °C Tstg Storage temperature −65 to 150 °C VCC/AVCC Supply voltage VI R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group Table 5.2 5. Electrical Characteristics Recommended Operating Conditions Symbol Parameter Conditions Standard Min. Typ. Max. Unit VCC/AVCC Supply voltage 1.8 − 5.5 VSS/AVSS Supply voltage − 0 − V 0.8 VCC − VCC V VIH Input “H” voltage Other than CMOS input CMOS input Input level Input level selection switching : 0.35 VCC function (I/O port) Input level selection : 0.5 VCC Input level selection : 0.7 VCC 4.0 V ≤ VCC ≤ 5.5 V 0.5 VCC − VCC V 2.7 V ≤ VCC < 4.0 V 0.
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R8C/32C Group 5. Electrical Characteristics P1 P3 P4 Figure 5.1 30pF Ports P1, P3, P4 Timing Measurement Circuit R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group Table 5.3 5. Electrical Characteristics A/D Converter Characteristics Symbol Parameter − Resolution − Absolute accuracy Min. A/D conversion clock − Tolerance level impedance tCONV Conversion time Typ. Max. Unit − − 10 Bit Vref = AVCC = 5.0 V AN8 to AN11 input − − ±3 LSB Vref = AVCC = 3.3 V AN8 to AN11 input − − ±5 LSB Vref = AVCC = 3.0 V AN8 to AN11 input − − ±5 LSB Vref = AVCC = 2.2 V AN8 to AN11 input − − ±5 LSB Vref = AVCC = 5.
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R8C/32C Group Table 5.5 5. Electrical Characteristics Flash Memory (Program ROM) Electrical Characteristics Symbol Parameter Conditions Standard Min. Typ. Max. Unit 1,000 (3) − − times Byte program time − 80 500 µs − Block erase time − 0.
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R8C/32C Group Table 5.6 5. Electrical Characteristics Flash Memory (Data flash Block A to Block D) Electrical Characteristics Symbol Parameter Standard Conditions Min. Typ. Max. Unit 10,000 (3) − − times Byte program time (program/erase endurance ≤ 1,000 times) − 160 1,500 µs − Byte program time (program/erase endurance > 1,000 times) − 300 1,500 µs − Block erase time (program/erase endurance ≤ 1,000 times) − 0.
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R8C/32C Group Table 5.7 5. Electrical Characteristics Voltage Detection 0 Circuit Electrical Characteristics Symbol Vdet0 Parameter Condition Standard Unit Min. Typ. Max. Voltage detection level Vdet0_0 (2) 1.80 1.90 2.05 V Voltage detection level Vdet0_1 (2) 2.15 2.35 2.50 V Voltage detection level Vdet0_2 (2) 2.70 2.85 3.05 V Voltage detection level Vdet0_3 (2) 3.55 3.80 4.05 V − 6 150 µs − 1.
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R8C/32C Group Table 5.9 5. Electrical Characteristics Voltage Detection 2 Circuit Electrical Characteristics Symbol Parameter Standard Condition Vdet2 Voltage detection level Vdet2_0 − Hysteresis width at the rising of Vcc in voltage detection 2 circuit At the falling of VCC − Voltage detection 2 circuit response time (2) At the falling of Vcc from 5 V to (Vdet2_0 − 0.1) V − Voltage detection circuit self power consumption VCA27 = 1, VCC = 5.
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R8C/32C Group Table 5.11 5.
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R8C/32C Group Table 5.14 Symbol 5. Electrical Characteristics Timing Requirements of Synchronous Serial Communication Unit (SSU) (1) Parameter Conditions Standard Min. Typ. Max. Unit tSUCYC SSCK clock cycle time 4 − − tCYC (2) tHI SSCK clock “H” width 0.4 − 0.6 tSUCYC tLO SSCK clock “L” width 0.4 − 0.
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R8C/32C Group 5.
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R8C/32C Group 5.
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R8C/32C Group 5. Electrical Characteristics tHI VIH or VOH SSCK VIL or VOL tLO tSUCYC SSO (output) tOD SSI (input) tSU Figure 5.6 tH I/O Timing of Synchronous Serial Communication Unit (SSU) (Clock Synchronous Communication Mode) R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group Table 5.15 5. Electrical Characteristics Timing Requirements of I2C bus Interface (1) Symbol Parameter Condition tSCL SCL input cycle time tSCLH SCL input “H” width tSCLL SCL input “L” width tsf tSP SCL, SDA input fall time SCL, SDA input spike pulse rejection time tBUF Standard Typ. (2) − 12tCYC + 600 (2) − 3tCYC + 300 Min. Max.
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R8C/32C Group Table 5.16 5. Electrical Characteristics Electrical Characteristics (1) [4.2 V ≤ Vcc ≤ 5.
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R8C/32C Group Table 5.17 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (2) [3.3 V ≤ Vcc ≤ 5.5 V] (Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.) Parameter Condition Power supply High-speed current clock mode (VCC = 3.3 to 5.5 V) Single-chip mode, output pins are open, other pins are VSS High-speed on-chip oscillator mode Low-speed on-chip oscillator mode Low-speed clock mode Wait mode Stop mode R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group 5. Electrical Characteristics Timing Requirements (Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) Table 5.18 External Clock Input (XOUT, XCIN) Symbol tc(XOUT) tWH(XOUT) tWL(XOUT) tc(XCIN) tWH(XCIN) tWL(XCIN) Standard Min. Max.
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R8C/32C Group Table 5.20 5. Electrical Characteristics Serial Interface Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) Standard Min. Max. 200 − 100 − 100 − − 50 0 − 50 − 90 − Parameter CLKi input cycle time CLKi input “H” width CLKi input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Unit ns ns ns ns ns ns ns i = 0, 2 VCC = 5 V tC(CK) tW(CKH) CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0, 2 Figure 5.10 Table 5.
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R8C/32C Group Table 5.22 5. Electrical Characteristics Electrical Characteristics (3) [2.7 V ≤ Vcc < 4.
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R8C/32C Group Table 5.23 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (4) [2.7 V ≤ Vcc < 3.3 V] (Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.) Parameter Condition Power supply current High-speed (VCC = 2.7 to 3.3 V) clock mode Single-chip mode, output pins are open, other pins are VSS R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group 5. Electrical Characteristics Timing requirements (Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) Table 5.24 External Clock Input (XOUT, XCIN) Symbol tc(XOUT) tWH(XOUT) tWL(XOUT) tc(XCIN) tWH(XCIN) tWL(XCIN) Standard Min. Max.
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R8C/32C Group Table 5.26 5. Electrical Characteristics Serial Interface Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) Standard Parameter Min. 300 150 150 − 0 70 90 CLKi input cycle time CLKi input “H” width CLKi Input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Max. − − − 80 − − − Unit ns ns ns ns ns ns ns i = 0, 2 VCC = 3 V tC(CK) tW(CKH) CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0, 2 Figure 5.14 Table 5.
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R8C/32C Group Table 5.28 5. Electrical Characteristics Electrical Characteristics (5) [1.8 V ≤ Vcc < 2.7 V] Symbol Parameter Condition 0.05 0.20 − V − − µA XIN − 70 − − 140 0.3 4.0 −4.0 300 − µA kΩ MΩ XCIN − 8 − MΩ 1.
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R8C/32C Group Table 5.29 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (6) [1.8 V ≤ Vcc < 2.7 V] (Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.) Parameter Condition Power supply current High-speed (VCC = 1.8 to 2.7 V) clock mode Single-chip mode, output pins are open, other pins are VSS R01DS0009EJ0100 Rev 1.00 Aug.
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R8C/32C Group 5. Electrical Characteristics Timing requirements (Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C) Table 5.30 External Clock Input (XOUT, XCIN) Symbol tc(XOUT) tWH(XOUT) tWL(XOUT) tc(XCIN) tWH(XCIN) tWL(XCIN) Standard Parameter Min. 200 90 90 14 7 7 XOUT input cycle time XOUT input “H” width XOUT input “L” width XCIN input cycle time XCIN input “H” width XCIN input “L” width tC(XOUT), tC(XCIN) tWH(XOUT), tWH(XCIN) Max. − − − − − − Unit ns ns ns µs µs µs VCC = 2.
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R8C/32C Group Table 5.32 5. Electrical Characteristics Serial Interface Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) Standard Parameter Min. 800 400 400 − 0 150 90 CLKi input cycle time CLKi input “H” width CLKi input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Max. − − − 200 − − − Unit ns ns ns ns ns ns ns i = 0, 2 VCC = 2.2 V tC(CK) tW(CKH) CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0, 2 Figure 5.
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R8C/32C Group Package Dimensions Package Dimensions Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of the Renesas Electronics website. JEITA Package Code P-LSSOP20-4.4x6.5-0.65 RENESAS Code PLSP0020JB-A MASS[Typ.] 0.1g 11 *1 E 20 HE Previous Code 20P2F-A NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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REVISION HISTORY REVISION HISTORY R8C/32C Group Datasheet R8C/32C Group Datasheet Description Rev. Date 0.10 Sep. 01, 2009 − First Edition issued 1.00 Aug. 24, 2010 All “Preliminary” and “Under development” deleted 4 Table1.3 revised Page Summary 26 to 51 “5. Electrical Characteristics” added All trademarks and registered trademarks are the property of their respective owners.
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General Precautions in the Handling of MPU/MCU Products The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description in the body of the manual takes precedence. 1.
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Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.