Datasheet RX111 Group Renesas MCUs 32 MHz 32-bit RX MCUs, 50 DMIPS, up to 128 Kbytes of flash memory, USB 2.
RX111 Group 1. Overview 1. Overview 1.1 Outline of Specifications Table 1.1 lists the specifications, and Table 1.2 gives a comparison of the functions of the products in different packages. Table 1.1 is for products with the greatest number of functions, so the number of peripheral modules and channels will differ in accordance with the package type. For details, see Table 1.2, Comparison of Functions for Different Packages. Table 1.
RX111 Group Table 1.1 1.
RX111 Group Table 1.1 1. Overview Outline of Specifications (3/3) Classification Module/Function Description Communication USB 2.0 host/function module (USBc) function USB Device Controller (UDC) and transceiver for USB 2.0 are incorporated. Host (32-Kbyte or more ROM)/function module: 1 port Compliant with USB version 2.0 Transfer speed: Full-speed (12 Mbps), low-speed (1.5 Mbps) OTG (ON-The-Go) is supported. Isochronous transfer is supported. BC (Battery Charger) is supported.
RX111 Group Table 1.2 1.
RX111 Group 1.2 1. Overview List of Products Table 1.3 is a list of products, and Figure 1.1 shows how to read the product part no., memory capacity, and package type. Table 1.3 Group RX111 List of Products (1/2) Part No. Orderable Part No.
RX111 Group Table 1.3 Group RX111 1. Overview List of Products (2/2) Part No. Orderable Part No.
RX111 Group 1. Overview R 5 F 5 1 1 1 5 A D F M #3 0 Production identification code Packing, Terminal material (Pb-free) #3: Tray/Sn (Tin) only #V: Tray/Sn (Tin) only #U: Tray/SnCu and others ROM, RAM, and E2 DataFlash capacity FM: LFQFP/64/0.50 FK: LQFP/64/0.80 LF: WFLGA/64/0.50 FL: LFQFP/48/0.50 NE: HWQFN/48/0.50 NF: HWQFN/40/0.50 LM: WFLGA/36/0.
RX111 Group 1.3 1. Overview Block Diagram Figure 1.2 shows a block diagram.
RX111 Group 1.4 1. Overview Pin Functions Table 1.4 lists the pin functions. Table 1.4 Pin Functions (1/3) Classifications Pin Name I/O Description Power supply VCC Input Power supply pin. Connect it to the system power supply. VCL — Connect this pin to the VSS pin via the 4.7 μF smoothing capacitor used to stabilize the internal power supply. Place the capacitor close to the pin. Ground pin. Connect it to the system power supply (0 V).
RX111 Group Table 1.4 1. Overview Pin Functions (2/3) Classifications Pin Name I/O Description Serial communications interface (SCIe) Simple SSCL1, SSCL5 I/O Input/output pins for the I2C clock. SSDA1, SSDA5 I/O Input/output pins for the I2C data. I2C mode Simple SPI mode Serial communications interface (SCIf) SCK1, SCK5 I/O Input/output pins for the clock. SMISO1, SMISO5 I/O Input/output pins for slave transmit data.
RX111 Group Table 1.4 1. Overview Pin Functions (3/3) Classifications Pin Name I/O Description 12-bit A/D converter AN000 to AN004, AN006, AN008 to AN015 Input Input pins for the analog signals to be processed by the A/D converter. ADTRG0# Input Input pin for the external trigger signals that start the A/D conversion. D/A converter DA0, DA1 Output Output pins for the analog signals to be processed by the D/A converter.
RX111 Group 1.5 1. Overview Pin Assignments VSS PB0 VCC PB1 PB3 PB5 PB6/PC0 PB7/PC1 39 38 37 36 35 34 33 PA3 43 40 PA1 44 PA4 PA0 45 PA6 PE5 46 41 PE4 47 42 PE3 48 Figure 1.3 to Figure 1.7 show the pin assignments. Table 1.5 to Table 1.6 show the lists of pins and pin functions.
RX111 Group 1.
PA4 VSS PB0/PC0 VCC PB1/PC1 PB3/PC2 PB5/PC3 30 29 28 27 26 25 PA3 PA6 PA1 33 31 PE4 34 32 PE3 35 1.
PA4 VSS PB0 VCC PB3 24 23 22 21 PA3 PA6 PA1 27 25 PE4 28 26 PE3 29 1. Overview 30 RX111 Group PE2 31 20 PC4 PE1 32 19 VSS_USB PE0 33 18 USB0_DP RX111 Group PWQN0040KC-A (40-pin HWQFN) (Top view) P46 34 P42 35 P41 36 PJ7/VREFL0 37 PJ6/VREFH0 38 17 USB0_DM 16 VCC_USB 15 P14 14 P15 13 P16 2 3 4 5 6 7 8 9 MD RES# P35/NMI XTAL EXTAL VCL VSS VCC 10 1 11 P32 P26 12 P17 AVCC0 40 P27 AVSS0 39 Note: • This figure indicates the power supply pins and I/O port pins.
RX111 Group 1. Overview RX111 Group PWLG0036KA-A (36-pin WFLGA) (Upper perspective view) 6 PE2 PA3 VSS PB0 VCC VSS_USB 5 P41 PE1 PA4 PB3 PC4 USB0_DP 4 P42 PE0 PE4 PA6 P15 USB0_DM 3 PJ6/ VREFH0 PJ7/ VREFL0 PE3 P14 P16 VCC_USB 2 AVCC0 P27 MD P35 P17 VCC 1 AVSS0 RES# XTAL EXTAL VCL VSS A B C D E F Note: • This figure indicates the power supply pins and I/O port pins. For the pin configuration, see the table “List of Pins and Pin Functions (36-Pin WFLGA)”.
RX111 Group Table 1.5 Pin No. 1.
RX111 Group Table 1.5 Pin No. 1.
RX111 Group Table 1.6 Pin No. 1.
RX111 Group Table 1.6 1. Overview List of Pins and Pin Functions (64-Pin WFLGA) (2/2) Power Supply, Clock, System Control I/O Port Timers (MTU, POE, RTC) P32 MTIOC0C/RTCOUT F3 UPSEL P35 F4 UB# P14 Pin No.
RX111 Group Table 1.7 Pin No. 1.
RX111 Group Table 1.7 Pin No. 1. Overview List of Pins and Pin Functions (48-Pin LQFP/HWQFN) (2/2) I/O Port Timers (MTU, POE, RTC) Communication (SCIe, SCIf, RSPI, RIIC, USB) Others 39 PE0 MTIOC2A/POE3# SCK12 IRQ0/AN008 40 PE7 IRQ7/AN015 41 P46 AN006 42 P42 AN002 43 P41 AN001 44 Power Supply, Clock, System Control VREFL0 PJ7 VREFH0 PJ6 45 46 P40 47 AVSS0 48 AVCC0 AN000 Note 1. Not 5 V tolerant. R01DS0190EJ0100 Rev.1.
RX111 Group Table 1.8 Pin No. 1.
RX111 Group Table 1.8 1. Overview List of Pins and Pin Functions (40-Pin HWQFN) (2/2) Pin No. Power Supply, Clock, System Control 40 AVCC0 I/O Port Timers (MTU, POE, RTC) Communication (SCIe, SCIf, RSPI, RIIC, USB) Others Note 1. Not 5 V tolerant. R01DS0190EJ0100 Rev.1.
RX111 Group Table 1.9 Pin No. 1.
RX111 Group 2. 2. CPU CPU Figure 2.1 shows the register set of the CPU. General-purpose registers b31 b0 R0 (SP) *1 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 Control registers b31 b0 ISP (Interrupt stack pointer) USP (User stack pointer) INTB (Interrupt table register) PC (Program counter) PSW (Processor status word) BPC (Backup PC) BPSW (Backup PSW) FINTV (Fast interrupt vector register) DSP instruction register b63 b0 ACC (Accumulator) Note 1.
RX111 Group 2.1 2. CPU General-Purpose Registers (R0 to R15) This CPU has 16 general-purpose registers (R0 to R15). R0 to R15 can be used as data registers or address registers. R0, a general-purpose register, also functions as the stack pointer (SP). The stack pointer is switched to operate as the interrupt stack pointer (ISP) or user stack pointer (USP) by the value of the stack pointer select bit (U) in the processor status word (PSW). 2.
RX111 Group 3. Address Space 3.1 Address Space 3. Address Space This MCU has a 4-Gbyte address space, consisting of the range of addresses from 0000 0000h to FFFF FFFFh. That is, linear access to an address space of up to 4 Gbytes is possible, and this contains both program and data areas. Figure 3.1 shows the memory map. R01DS0190EJ0100 Rev.1.
RX111 Group 3. Address Space Single-chip mode*1 0000 0000h RAM*2 0000 4000h Reserved area*3 0008 0000h Peripheral I/O registers 0010 0000h On-chip ROM (E2 DataFlash) (8 KB) 0010 2000h Reserved area*3 007F C000h 007F C500h Peripheral I/O registers Reserved area*3 007F FC00h 0080 0000h Peripheral I/O registers Reserved area*3 FFFE 0000h On-chip ROM (program ROM)*2 FFFF FFFFh Note 1. The address space in boot mode is the same as the address space in single-chip mode. Note 2.
RX111 Group 4. 4. I/O Registers I/O Registers This section provides information on the on-chip I/O register addresses and bit configuration. The information is given as shown below. Notes on writing to I/O registers are also given below. (1) I/O register addresses (address order) Registers are listed from the lower allocation addresses. Registers are classified according to module symbols. Numbers of cycles for access indicate numbers of cycles of the given base clock.
RX111 Group 4. I/O Registers Longword-size I/O registers MOV.L #SFR_ADDR, R1 MOV.L #SFR_DATA, [R1] CMP [R1].L, R1 ;; Next process When executing an instruction after writing to multiple registers, only read the last I/O register written to and execute the instruction using that value; it is not necessary to execute the instruction using the values written to all the registers. (3) Number of cycles necessary for accessing I/O registers See Table 4.
RX111 Group 4.1 I/O Register Addresses (Address Order) Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 4.
RX111 Group Table 4.1 4.
RX111 Group Table 4.1 Address 4.
RX111 Group Table 4.1 4.
RX111 Group Table 4.1 4.
RX111 Group 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings Table 5.1 Conditions: Absolute Maximum Ratings VSS = AVSS0 = VREFL0 = VSS_USB = 0 V Item Power supply voltage Input voltage (except for ports for 5 V tolerant*1) Input voltage (ports for 5 V tolerant*1) Reference power supply voltage Analog power supply voltage Symbol Value Unit VCC, VCC_USB –0.3 to +4.6 V Vin –0.3 to VCC +0.3 V Vin –0.3 to +6.5 V VREFH0 –0.3 to AVCC +0.
RX111 Group 5.2 5. Electrical Characteristics DC Characteristics Table 5.3 DC Characteristics (1) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Schmitt trigger input voltage Symbol Min. Typ. Max. Unit VIH VCC × 0.7 — 5.8 V Ports 16, 17, port A6, port B0 (5 V tolerant) VCC × 0.8 — 5.
RX111 Group Table 5.5 5. Electrical Characteristics DC Characteristics (3) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Input leakage current RES#, MD, port 35 ports H6, H7 Three-state leakage current (off-state) Ports for 5 V tolerant Input capacitance All input pins (except for port 35, port 16, USB0_DM, USB0_DP) Symbol Min. Typ. Max. Unit Iin — — 1.0 µA Vin = 0 V, VCC ITSI — — 1.0 µA Vin = 0 V, 5.
RX111 Group Table 5.7 Conditions: 5. Electrical Characteristics DC Characteristics (5) VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Supply current*1 High-speed operating mode Normal operating mode No peripheral operation*2 mA 2.2 — — ICLK = 16 MHz 6.1 — ICLK = 8 MHz 3.7 — All peripheral operation: Max.*3 ICLK = 32 MHz — 24 No peripheral operation*2 ICLK = 32 MHz 1.8 — ICLK = 16 MHz 1.4 — ICLK = 8 MHz 1.1 — ICLK = 32 MHz 6.
RX111 Group 5. Electrical Characteristics Item Supply current*1 Low-speed operating mode Normal operating mode Sleep mode Deep sleep mode Symbol Typ *4 Max Unit ICC 4.0 — μA No peripheral operation*8 ICLK = 32.768 kHz All peripheral operation: Normal*9, *10 ICLK = 32.768 kHz 11.5 — All peripheral operation: Max.*9, *10 ICLK = 32.768 kHz — 40 No peripheral operation*8 ICLK = 32.768 kHz 2.2 — All peripheral operation: Normal*9 ICLK = 32.768 kHz 7.
RX111 Group 5. Electrical Characteristics 9 8 Ta = 85/105°C, ICLK = 12 MHz*2 7 ICC (mA) 6 Ta = 85/105°C, ICLK = 8 MHz*2 5 Ta = 25°C, ICLK = 12 MHz*1 4 Ta = 25°C, ICLK = 8 MHz*1 3 Ta = 85/105°C, ICLK = 1 MHz*2 2 1 Ta = 25°C, ICLK = 1 MHz*1 0 1.5 2 2.5 3 3.5 4 VCC (V) Note 1. All peripheral operation is normal. This does not include BGO operation. Average value of the tested middle samples during product evaluation. Note 2. All peripheral operation is maximum.
RX111 Group Table 5.8 5. Electrical Characteristics DC Characteristics (6) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Supply current*1 Software standby mode*2 Ta = 25°C Typ.*3 Max. Unit ICC μA 0.35 0.53 Ta = 55°C 0.58 1.45 Ta = 85°C 1.60 7.30 Ta = 105°C 3.30 16.50 0.31 — Increment for RTC operation*4 Note 1. Note 2. Note 3. Note 4. Symbol Test Conditions RCR3.
RX111 Group 5. Electrical Characteristics 100 *1 Icc (µA) 10 *2 1 0.1 -40 -20 0 20 40 60 80 100 120 Ta (°C) Note1. Average value of the tested upper-limit samples during product evaluation. Note2. Average value of the tested middle samples during product evaluation. Figure 5.5 Table 5.9 Temperature Dependency in Software Standby Mode (Reference Data) DC Characteristics (7) Conditions: Products with operating temperature (Ta) –40 to +105°C VCC = AVCC0 = VCC_USB = 1.8 to 3.
RX111 Group Table 5.11 5. Electrical Characteristics DC Characteristics (9) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Analog power supply current During A/D conversion During D/A conversion (per Symbol Min. Typ. Max. Unit IAVCC — 0.7 1.2 mA channel)*1 — — 1.5 Temperature sensor — 75 — Waiting for A/D, D/A conversion (all units) — — 0.3 — 25 52 μA — — 60 nA IUSBH*2 — 4.3 (VCC) 0.
RX111 Group Table 5.14 5. Electrical Characteristics DC Characteristics (12) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C The ripple voltage must meet the allowable ripple frequency fr(VCC) within the range between the VCC upper limit (3.6 V) and lower limit (1.8 V). When VCC change exceeds VCC ±10%, the allowable voltage change rising/falling gradient dt/dVCC must be met.
RX111 Group Table 5.16 5. Electrical Characteristics Permissible Output Currents Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Symbol Max. Unit IOL 0.4 mA Permissible output low current (average value per pin) Ports 40 to 44, 46, ports J6, J7 Ports other than above 8.0 Permissible output low current (maximum value per pin) Ports 40 to 44, 46, ports J6, J7 0.4 Ports other than above 8.
RX111 Group 5. Electrical Characteristics 5.2.1 Standard I/O Pin Output Characteristics (1) Figure 5.7 to Figure 5.10 show the characteristics of general ports (except for the RIIC output pin, port 4, and port J). IOH/IOL vs VOH/VOL 40 VCC = 3.3 V 30 VCC = 2.7 V IOH/IOL [mA] 20 VCC = 1.8 V 10 0 0 0.5 1 1.5 2 2.5 3 3.5 VCC = 1.8 V -10 VCC = 2.7 V -20 VCC = 3.3 V -30 VOH/VOL [V] Figure 5.
RX111 Group 5. Electrical Characteristics IOH/IOL vs VOH/VOL 30 Ta = –40°C 25 Ta = 25°C 20 Ta = 105°C IOH/IOL [mA] 15 10 5 0 0 0.5 1 1.5 2 2.5 3 -5 Ta = 105°C -10 Ta = 25°C -15 Ta = –40°C -20 VOH/VOL [V] Figure 5.9 VOH/VOL and IOH/IOL Temperature Characteristics of General Ports (Except for RIIC Output Pin, Port 4, and Port J) at VCC = 2.7 V (Reference Data) IOH/IOL vs VOH/VOL 50 Ta = –40°C 40 Ta = 25°C IOH/IOL [mA] 30 Ta = 105°C 20 10 0 0 -10 -20 0.5 1 1.5 2 2.5 3 3.
RX111 Group 5. Electrical Characteristics 5.2.2 Standard I/O Pin Output Characteristics (2) Figure 5.11 to Figure 5.13 show the characteristics of the RIIC output pin. IOL vs VOL 40 VCC = 3.3 V 35 30 VCC = 2.7 V IOL [mA] 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 VOH/VOL [V] Figure 5.11 VOL and IOL Voltage Characteristics of RIIC Output Pin at Ta = 25°C (Reference Data) IOL vs VOL 30 Ta = –40°C 25 Ta = 25°C Ta = 105°C IOL [mA] 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 VOL [V] Figure 5.
RX111 Group 5. Electrical Characteristics IOL vs VOL 50 45 Ta = –40°C 40 Ta = 25°C 35 Ta = 105°C IOL [mA] 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 VOL [V] Figure 5.13 VOL and IOL Temperature Characteristics of RIIC Output Pin at VCC = 3.3 V (Reference Data) R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics 5.2.3 Standard I/O Pin Output Characteristics (3) Figure 5.14 to Figure 5.17 show the characteristics of port 4 and port J. IOH/IOL vs VOH/VOL 14 VCC = 3.3 V 12 IOH/IOL [mA] 10 VCC = 2.7 V 8 6 4 VCC = 1.8 V 2 0 0 VCC = 1.8 V 0.5 -2 1 1.5 2 2.5 3 3.5 VCC = 2.7 V VCC = 3.3 V -4 VOH/VOL [V] Figure 5.
RX111 Group 5. Electrical Characteristics IOH/IOL vs VOH/VOL 10 Ta = –40°C 8 Ta = 25°C Ta = 105°C IOH/IOL [mA] 6 4 2 0 0 Ta = 105°C -2 0.5 1 1.5 2 2.5 3 Ta = 25°C Ta = –40°C -4 VOH/VOL [V] Figure 5.16 VOH/VOL and IOH/IOL Temperature Characteristics of Port 4 and Port J at VCC = 2.7 V (Reference Data) IOH/IOL vs VOH/VOL 16 14 Ta = –40°C 12 Ta = 25°C Ta = 105°C IOH/IOL [mA] 10 8 6 4 2 0 -2 0 Ta = 105°C0.5 Ta = 25°C -4 1 1.5 2 2.5 3 3.5 4 Ta = –40°C VOH/VOL [V] Figure 5.
RX111 Group 5.3 5. Electrical Characteristics AC Characteristics 5.3.1 Table 5.19 Conditions: Clock Timing Operation Frequency Value (High-Speed Operating Mode) VCC = AVCC0 = VCC_USB = 1.8 to 3.
RX111 Group Table 5.22 5. Electrical Characteristics Clock Timing Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Symbol XTAL external clock input cycle time Min. Typ. Max. Unit Test Conditions Figure 5.
RX111 Group 5. Electrical Characteristics ILOCOCR.ILCSTP tILOCO IWDT-dedicated clock oscillator output Figure 5.19 IWDT-Dedicated Clock Oscillation Start Timing MOSCCR.MOSTP tMAINOSC Main clock oscillator output Figure 5.20 Main Clock Oscillation Start Timing LOCOCR.LCSTP tLOCO LOCO clock oscillator output Figure 5.21 LOCO Clock Oscillation Start Timing RES# Internal reset tRESWT OFS1.HOCOEN HOCO clock Figure 5.22 HOCO Clock Oscillation Start Timing (After Reset is Canceled by Setting OFS1.
RX111 Group 5. Electrical Characteristics HOCOCR.HCSTP tHOCO HOCO clock Figure 5.23 HOCO Clock Oscillation Start Timing (Oscillation is Started by Setting HOCOCR.HCSTP Bit) MOSCCR.MOSTP tMAINOSC Main clock oscillator output PLLCR2.PLLEN tPLL PLL clock Figure 5.24 PLL Clock Oscillation Start Timing (PLL is Operated after Main Clock Oscillation Has Settled) SOSCCR.SOSTP tSUBOSC Sub-clock oscillator output Figure 5.25 Sub-Clock Oscillation Start Timing R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics 5.3.2 Reset Timing Table 5.23 Reset Timing Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Symbol Min. Typ. Max. Unit At power-on tRESWP 3 — — ms Figure 5.26 Other than above tRESW 30 — — μs Figure 5.27 At normal startup*1 tRESWT — 8.5 — ms Figure 5.26 tRESWT — 560 — μs Wait time after RES# cancellation (during powered-on state) tRESWT — 114 — μs Figure 5.
RX111 Group 5. Electrical Characteristics tRESWIW, tRESWSW Independent watchdog timer reset Software reset Internal reset tRESWT2 Figure 5.28 Reset Input Timing (2) R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics 5.3.3 Timing of Recovery from Low Power Consumption Modes Table 5.24 Timing of Recovery from Low Power Consumption Modes (1) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Recovery time from software standby mode*1 High-speed mode Symbol Min. Typ. Max.
RX111 Group Table 5.26 5. Electrical Characteristics Timing of Recovery from Low Power Consumption Modes (3) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Recovery time from software standby mode*1 Low-speed mode Sub-clock oscillator operating Symbol Min. Typ. Max. Unit tSBYSC — 600 750 μs Test Conditions Figure 5.29 Note 1. The sub-clock continues oscillating in software standby mode during low-speed mode.
RX111 Group Table 5.27 5. Electrical Characteristics Timing of Recovery from Low Power Consumption Modes (4) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Recovery time from deep sleep mode*1 Symbol Min. Typ. Max. Unit High-speed mode*2 tDSLP — 2 3.5 μs Middle-speed mode*3 tDSLP — 3 4 μs tDSLP — 400 500 μs Low-speed Note 1. Note 2. Note 3. Note 4.
RX111 Group 5. Electrical Characteristics 5.3.4 Control Signal Timing Table 5.29 Control Signal Timing Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item NMI pulse width IRQ pulse width Note: • Note 1. Note 2. Note 3. Symbol Min. Typ. Max. Unit tNMIW 200 — — ns tPcyc × 2*1 — — 200 — — tNMICK × 3.5*2 — — 200 — — tIRQW tPcyc × 2*1 — — 200 — — tIRQCK × 3.
RX111 Group 5. Electrical Characteristics 5.3.5 Timing of On-Chip Peripheral Modules Table 5.30 Timing of On-Chip Peripheral Modules (1) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item I/O ports Input data pulse width MTU2 Input capture input pulse width Single-edge setting Min. Max. Unit*1 tPRW 1.5 — tPcyc Figure 5.33 1.5 — tPcyc Figure 5.34 2.5 — tPcyc Figure 5.
RX111 Group Table 5.31 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (2) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.
RX111 Group Table 5.32 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (3) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Simple SPI SCK clock cycle output (master) Symbol Min. Max. Unit*1 tSPcyc 4 65536 tPcyc 6 65536 tSPCKWH 0.4 0.6 tSPcyc tSPCKWL 0.4 0.
RX111 Group Table 5.33 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (4) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, fPCLKB ≤ 32 MHz, Ta = –40 to +105°C Item RIIC (Standard mode, SMBus) SCL0 cycle time Min.*1,*2 Max.
RX111 Group Table 5.34 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (5) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, fPCLKB ≤ 32 MHz, Ta = –40 to +105°C Symbol Min.*1 Max.
RX111 Group 5. Electrical Characteristics PCLK MTCLKA to MTCLKH tTCKWL Figure 5.35 tTCKWH MTU2 Clock Input Timing PCLK POEn# input tPOEW Figure 5.36 POE# Input Timing tSCKW tSCKr tSCKf SCKn (n = 0, 1, 5, 6, 8, 9) tScyc Figure 5.37 SCK Clock Input Timing R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics SCKn tTXD TXDn tRXS tRXH RXDn n = 0, 1, 5, 6, 8, 9 Figure 5.38 SCI Input/Output Timing: Clock Synchronous Mode PCLK ADTRG0# tTRGW Figure 5.39 A/D Converter External Trigger Input Timing tCcyc tCH tCf CLKOUT pin output tCL tCr Test conditions: VOH = VCC × 0.7, VOL = VCC × 0.3, IOH = -1.0 mA, IOL = 1.0 mA, C = 30 pF Figure 5.40 CLKOUT Output Timing R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics tSPCKr tSPCKWH RSPI Simple SPI RSPCKA Master select output SCKn Master select output VOH VOH VOL tSPCKf VOH VOH VOL tSPCKWL VOL tSPcyc tSPCKr tSPCKWH VIH RSPCKA Slave select input VIH SCKn Slave select input VIL (n = 0, 1, 5, 6, 8, 9, 12) tSPCKf VIH VIH VIL tSPCKWL VIL tSPcyc VOH = 0.7 × VCC, VOL = 0.3 × VCC, VIH = 0.7 × VCC, VIL = 0.3 × VCC Figure 5.
RX111 Group RSPI 5. Electrical Characteristics Simple SPI SSLA0 to SSLA3 output tTD tLEAD RSPCKA CPOL = 0 output SCKn CKPOL = 1 output RSPCKA CPOL = 1 output SCKn CKPOL = 0 output tLAG tSSLr, tSSLf tSU MISOA input SMISOn input tH MSB IN tOH MOSIA output DATA LSB IN tOD SMOSIn output MSB OUT MSB IN tDr, tDf DATA LSB OUT IDLE MSB OUT (n = 0, 1, 5, 6, 8, 9, 12) Figure 5.
RX111 Group 5. Electrical Characteristics RSPI Simple SPI SSLA0 input SSn# input tTD tLEAD RSPCKA CPOL = 0 input SCKn CKPOL = 1 input RSPCKA CPOL = 1 input SCKn CKPOL = 0 input MISOA output SMISOn output tSA tLAG tOH tOD LSB OUT (Last data) MSB OUT tSU MOSIA input SMOSIn input tREL DATA tH MSB OUT LSB OUT tDr, tDf MSB IN DATA LSB IN MSB IN (n = 0, 1, 5, 6, 8, 9, 12) Figure 5.
RX111 Group 5.4 5. Electrical Characteristics USB Characteristics Table 5.35 USB Characteristics (DP and DM Pin Characteristics) Conditions: VCC = AVCC0 = VCC_USB = 3.0 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Input characteristics Output characteristics Symbol Min. Max. Unit Input high level voltage VIH 2.0 — V Input low level voltage VIL — 0.8 V Differential input sensitivity VDI 0.2 — V Differential common mode range VCM 0.8 2.
RX111 Group 5. Electrical Characteristics Observation point Observation point DP DP 200 pF to 3.6 V 600 pF 50 pF 1.5 kΩ DM DM 200 pF to 600 pF 50 pF Full-speed (FS) Figure 5.48 Low-speed (LS) Observation point Test Circuit R01DS0190EJ0100 Rev.1.
RX111 Group 5.5 5. Electrical Characteristics A/D Conversion Characteristics Table 5.36 A/D Conversion Characteristics (1) Conditions: VCC = AVCC0 = VREFH0 = 2.7 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, PCLKD = 4 to 32 MHz, Ta = –40 to +105°C Item Min. Typ. Max. Unit — — 12 Bit 1.031 (0.313)*2 — — µs 1.375 (0.641)*2 — — Offset error — ±0.5 ±4.5 Full-scale error — ±0.75 Resolution Conversion time*1 (Operation at PCLKD = 32 MHz) Permissible signal source impedance (Max.
RX111 Group Table 5.37 5. Electrical Characteristics A/D Conversion Characteristics (2) Conditions: VCC = AVCC0 = VREFH0 = 2.4 to 2.7 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, PCLKD = 4 to 16 MHz, Ta = –40 to +105°C Item Resolution time*1 Conversion (Operation at fPCLKD = 16 MHz) Permissible signal source impedance (Max.) = 1.0 kΩ Min. Typ. Max. Unit — — 12 Bit 2.062 (0.625)*2 — — µs High-precision channel ADCSR.ADHSC bit = 1 ADSSTRn.SST[7:0] bits = 09h 2.750 (1.
RX111 Group Table 5.39 5. Electrical Characteristics A/D Converter Channel Classification Classification Channel Conditions High-precision channel AN000 to AN004, AN006 Normal-precision channel AN008 to AN015 Internal reference voltage input channel Internal reference voltage AVCC0 = 2.0 to 3.6 V Temperature sensor input channel Temperature sensor output AVCC0 = 2.0 to 3.6 V Table 5.40 Remarks AVCC0 = 1.8 to 3.
RX111 Group 5. Electrical Characteristics FFFh Full-scale error Integral nonlinearity error (INL) A/D converter output code Ideal line of actual A/D conversion characteristic Actual A/D conversion characteristic Ideal A/D conversion characteristic Differential nonlinearity error (DNL) 1-LSB width for ideal A/D conversion characteristic Differential nonlinearity error (DNL) 1-LSB width for ideal A/D conversion characteristic Absolute accuracy 000h Offset error 0 Figure 5.
RX111 Group 5. Electrical Characteristics Differential nonlinearity error (DNL) Differential nonlinearity error is the difference between 1-LSB width based on the ideal A/D conversion characteristics and the width of the actually output code. Offset error Offset error is the difference between a transition point of the ideal first output code and the actual first output code.
RX111 Group 5.6 5. Electrical Characteristics D/A Conversion Characteristics Table 5.41 D/A Conversion Characteristics (1) Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, fPCLKB ≤ 32 MHz, Ta = –40 to +105°C Item Resolution Conversion time Absolute accuracy Typ. Max. Unit — — 8 Bit μs VCC = 2.7 to 3.6 V — — 3.0 VCC = 1.6 to 2.7 V — — 6.0 VCC = 2.4 to 3.6 V — — ±3.0 VCC = 1.8 to 2.4 V — — ±3.5 VCC = 2.4 to 3.6 V — — ±2.0 VCC = 1.
RX111 Group 5.8 5. Electrical Characteristics Power-On Reset Circuit and Voltage Detection Circuit Characteristics Table 5.43 Power-On Reset Circuit and Voltage Detection Circuit Characteristics (1) Conditions: VCC = AVCC0 = VCC_USB, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Voltage detection level Symbol Min. Typ. Max. Unit VPOR 1.35 1.50 1.65 V Figure 5.51, Figure 5.52 Vdet1_4 3.00 3.10 3.20 V Figure 5.53 Vdet1_5 2.91 3.00 3.09 Vdet1_6 2.81 2.90 2.
RX111 Group 5. Electrical Characteristics tVOFF VCC VPOR 1.0 V Internal reset signal (active-low) tdet Figure 5.51 tdet tPOR Voltage Detection Reset Timing VPOR VCC 1.0 V tw(POR) Internal reset signal (active-low) *1 tdet tPOR Note 1. tw(por) is the time required for a power-on reset to be enabled while the external power VCC is being held below the valid voltage (1.0 V). When VCC turns on, maintain tw(por) for 1.0 ms or more. Figure 5.52 Power-On Reset Timing R01DS0190EJ0100 Rev.1.
RX111 Group 5. Electrical Characteristics tVOFF VCC VLVH Vdet1 LVD1E Td(E-A) LVD1 Comparator output LVD1CMPE LVD1MON Internal reset signal (active-low) When LVD1RN = L tdet tdet tLVD1 When LVD1RN = H tLVD1 Figure 5.53 Voltage Detection Circuit Timing (Vdet1) tVOFF VCC VLVH Vdet2 LVD2E Td(E-A) LVD2 Comparator output LVD2CMPE LVD2MON Internal reset signal (active-low) When LVD2RN = L tdet tdet tLVD2 When LVD2RN = H tLVD2 Figure 5.
RX111 Group 5.9 5. Electrical Characteristics Oscillation Stop Detection Timing Table 5.45 Oscillation Stop Detection Circuit Characteristics Conditions: VCC = AVCC0 = VCC_USB = 1.8 to 3.6 V, VSS = AVSS0 = VREFL0 = VSS_USB = 0 V, Ta = –40 to +105°C Item Detection time Symbol Min. Typ. Max. Unit tdr — — 1 ms Test Conditions Figure 5.55 Main clock or PLL clock tdr OSTDSR.OSTDF LOCO clock ICLK Figure 5.55 Oscillation Stop Detection Timing R01DS0190EJ0100 Rev.1.
RX111 Group 5.10 5. Electrical Characteristics ROM (Flash Memory for Code Storage) Characteristics Table 5.46 ROM (Flash Memory for Code Storage) Characteristics (1) Item Reprogramming/erasure Data hold time Symbol cycle*1 Min. Typ. Max. Unit NPEC 1000 — — Times tDRP 20*2, *3 — — Year After 1000 times of NPEC Conditions Ta = +85°C Note 1. Definition of reprogram/erase cycle: The reprogram/erase cycle is the number of erasing for each block.
RX111 Group 5.11 5. Electrical Characteristics E2 DataFlash Characteristics Table 5.49 E2 DataFlash Characteristics (1) Item Reprogramming/erasure Data hold time cycle*1 After 10000 times of NDPEC Symbol Min. Typ. NDPEC 100000 tDDRP 20*2, *3 After 100000 times of NDPEC After 1000000 times of NDPEC Max. Unit 1000000 — Times — — Year 5*2, *3 — — Year — 1*2, *3 — Year Conditions Ta = +85°C Ta = +25°C Note 1. The reprogram/erase cycle is the number of erasing for each block.
RX111 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions Information on the latest version of the package dimensions or mountings has been displayed in “Packages” on Renesas Electronics Corporation website. JEITA Package Code P-LFQFP64-10x10-0.50 RENESAS Code PLQP0064KB-A Previous Code 64P6Q-A / FP-64K / FP-64KV MASS[Typ.] 0.3g HD *1 D 48 33 49 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
RX111 Group Appendix 1. Package Dimensions JEITA Package Code P-LQFP64-14x14-0.80 RENESAS Code PLQP0064GA-A Previous Code 64P6U-A/ ⎯ MASS[Typ.] 0.7g HD *1 D 33 48 49 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
RX111 Group Appendix 1. Package Dimensions 64-PIN PLASTIC FLGA (5x5) 60x b x M S AB A D w S A ZD e 8 ZE 7 6 B 5 E 4 3.90 3 2 C D INDEX MARK w S B 1 H G F E D C B E A 3.90 y1 A S S y S DETAIL C DETAIL E DETAIL D R0.17o0.015 0.70o0.03 0.55o0.04 R0.125o 0.02 0.75 0.55 R0.17o0.015 0.70o0.03 R0.125o0.02 0.55o0.04 0.75 0.55 b (LAND PAD) 0.34o0.03 (APERTURE OF SOLDER RESIST) 0.55 0.75 0.55o0.04 0.70o0.03 0.55 0.75 0.55o0.04 0.70o0.03 R0.275o0.02 R0.35o0.
RX111 Group Appendix 1. Package Dimensions JEITA Package Code P-LFQFP48-7x7-0.50 RENESAS Code PLQP0048KB-A Previous Code 48P6Q-A MASS[Typ.] 0.2g HD *1 D 36 25 37 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 24 bp c c1 HE *2 E b1 Reference Symbol 48 13 1 ZE Terminal cross section 12 c A F A2 Index mark ZD S A1 L D E A2 HD HE A A1 bp b1 c c1 y S Figure D *3 bp Detail F x Min 6.9 6.9 8.8 8.8 0 0.17 0.
RX111 Group Appendix 1. Package Dimensions JEITA Package Code RENESAS Code Previous Code MASS (TYP.) [g] P-HWQFN48-7x7-0.50 PWQN0048KB-A 48PJN-A P48K8-50-5B4-5 0.13 D DETAIL OF E S A PART A A S y S Referance Symbol D2 A EXPOSED DIE PAD 1 12 Min Nom Max D 6.95 7.00 7.05 E 6.95 7.00 7.05 A 0.70 0.75 0.80 b 0.18 0.25 0.30 e 13 48 Dimension in Millimeters Lp B 0.50 0.30 0.40 0.50 x 0.05 y 0.
RX111 Group Appendix 1. Package Dimensions JEITA Package Code RENESAS Code Previous Code MASS (TYP.) [g] P-HWQFN40-6x6-0.50 PWQN0040KC-A P40K8-50-4B4-4 0.09 D DETAIL OF A PART E S A A S y Referance Symbol S D2 A 1 EXPOSED DIE PAD 10 Min Nom Max D 5.95 6.00 6.05 E 5.95 6.00 6.05 A 0.70 0.75 0.80 b 0.18 0.25 0.30 e Lp 11 40 Dimension in Millimeters 0.50 0.30 0.40 0.50 x 0.05 y 0.05 B E2 ITEM 31 20 21 30 Lp E2 A 4.45 4.50 4.55 4.45 4.50 4.
RX111 Group Appendix 1. Package Dimensions JEITA Package Code RENESAS Code Previous Code MASS (TYP.) [g] P-WFLGA36-4x4-0.50 PWLG0036KA-A P36FC-50-AA4-2 0.023 32x b S AB e ZE w S A M A ZD D x 6 5 B 4 E 3 2.90 2 C INDEX MARK y1 D w S B S 1 F E D C B A E 2.90 A S y S DETAIL C DETAIL E DETAIL D R0.17± 0.05 0.70 ±0.05 0.55 ±0.05 R0.12 ±0.05 0.75 0.55 (UNIT:mm) R0.17 ±0.05 0.70 ±0.05 R0.12 ±0.05 0.55 ±0.05 0.75 0.55 φb (LAND PAD) φ 0.34±0.
REVISION HISTORY RX111 Group REVISION HISTORY Rev. 0.60 0.90 1.00 REVISION HISTORY RX111 Group Datasheet Description Page Summary Apr 15, 2013 — First edition, issued May 15, 2013 Features 1 Changed 1. Overview 2 to 4 Table 1.1 Outline of Specifications changed 10 to 12 Table 1.4 Pin Functions changed 13 Figure 1.3 Pin Assignments of the 64-Pin LQFP changed 14 Figure 1.4 Pin Assignments of the 64-Pin WFLGA changed 15 Figure 1.5 Pin Assignments of the 48-Pin LQFP/HWQFN changed 18, 19 Table 1.
NOTES FOR CMOS DEVICES (1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN).
General Precautions in the Handling of MPU/MCU Products The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products. 1. Handling of Unused Pins Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual.
Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2.