Datasheet

R01DS0041EJ0150 Rev.1.50 Page 211 of 221
Oct 18, 2013
RX210 Group Appendix 1. Package Dimensions
Figure E 69-Pin WLBGA (SWBG0069LA-A)
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JEITA Package㻌 code RENESAS㻌 Code Previous㻌 Code
MASS(TYP.)[g]
S-WFBGA69-3.91x4.26-0.40 SWBG0069LA-A
䠉
0.02
Specification
Reference
Symbol
Min Nom Max
D
E
eE
A
A1
A2
b
v
(A3)
n
3.86 3.91 3.96
4.21 4.26 4.31
䠉 䠉
0.70
0.15 0.19 0.23
0.36 0.40 0.44
䠉 䠉
0.22 0.27
0.4
0.4
69
䠉
0.32
(BSC)
(BSC)
0.05
eD
Tolerance of package lateral profile
Number of terminals
Terminal pitch in length
Terminal diameter
Wafer thickness
Stand-off height
Profile height
Package length
Package width
ZD
ZE
0.305
0.48
0.355
0.53
0.405
0.58
Overhang dimension in length
Overhang dimension in width
Terminal pitch in width
Term
x 0.05
Positional tolerance of terminals
y 0.08 Coplanarity
SE
䠉
䠉
(BSC)
(BSC)
SD Center terminal position in D-direction
E1
3.2
3.2
(BSC)
(BSC)
D1 Edge ball center to center in D-direction
Center terminal position in E-direction
Edge ball center to center in D-direction
Note:
1. Ball pitch dimension is specified with the center of balls.
2. Datum A and B are axes defined by the ball grid array,
not by the PKG outline.
Dimensions in millimeters
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1. ➃Ꮚ䢇䢛䡫䡽䛿➃Ꮚ୰ኸ㒊䛾఩⨨䛷つᐃ䛩䜛䚹
2. 䡿䢚䡬䡼䢍Aཬ䜃B䛿䚸䢊䢚䡬䢕䡴䢚䢔䡫䢀䢚䡺䢙䡼䜢⛠䛩䚹
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