Specifications

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SPECIFICATIONS

IEEE 802.11b/g/n AC 1T1R WLAN with Integrated Bluetooth 2.1/4.2

Controller w/PCI Express / USB2.0 Mixed Interfaces

RL-EM02G-8821CE-V1.1（亿道专用）

Version: V1.1

Summary of content (17 pages)

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SPECIFICATIONS IEEE 802.11b/g/n AC 1T1R WLAN with Integrated Bluetooth 2.1/4.2 Controller w/PCI Express / USB2.0 Mixed Interfaces RL-EM02G-8821CE-V1.1（亿道专用） Version: V1.1 http://www.rf-link.
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Contents 1. Change History of Revision..........................................................................................................................................3 2. General Description........................................................................................................................................................4 3. Features..................................................................................................................................................
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Change History of Revision Revisio Date V1.1 2018-04-03 First release of product specifications. 2018-04-03 V1.1 2019-06-18 Modify the module picture and size thickness 2019-06-18 V1.1 2019-07-29 Modify RF parameters according to customer needs 2019-07-29 http://www.rf-link.
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1. General Description The Realtek RTL8821CE is a highly integrated single-chip that support 1-stream 802.11ac solutions with Wireless LAN (WLAN) PCI Express network interface controller with integrated Bluetooth 2.1/4.2 USB interface controller. It combines a WLAN MAC, a 1T1R capable WLAN baseband, and RF in s single chip. The RTL8821CE provides a complete solution for a highperformance integrated wireless and Bluetooth device.
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2.Features General Information n CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11a/b/g/n/ac compatible WLAN n Support 802.11ac 1x1,Wave-2 compliant with STA mode n Complete 802.11n solution for 2.4GHz and 5Ghz band Host Interface n Complies with PCI Express Specification Revision 2.1 n Complies with USB2.0 FS-mode Specification for Bluetooth Base Standards Supported n IEEE 802.11a/b/g/n/ac compatible WLAN n IEEE 802.11e QoS Enhancement (WMM) n IEEE 802.11i (WPA, WPA2).
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n n Packet and Wake-up frame Transmit Beamforming Support S3/S4 AES/TKIP group key update Peripheral Interfaces n Up to 15 General Purpose Input/Output pins n Three configurable LED pins (mux with GPIO pins) PHY Features n IEEE 802.11ac OFDM n IEEE 802.11n OFDM n One Transmit and One Receive path n 5MHz / 10MHz / 20MHz / 40MHz / 80MHz bandwidth transmission n Support 2.4GHz and 5GHz band channels n Short Guard Interval (400ns) n Sounding packet.
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3.General Specification Model RL-EM02G-8821CE-V1.1 PCB Version RL-EM02G-8821CE-V1.0 Product Name 802.11a/b/g/n/ac PCIE module Major Chipset Realtek RTL8821CE-VL-CG Standard WIFI: 802.11a/b/g/n/ac/e/i/h BT : V2.1+ EDR and V4.2, For BR/EDR,V4.0BLE Bus Interface WiFi：PCIE Modulation Method DSSS,DBPSK, DQPSK, CCK and OFDM (BPSK, QPSK, 16QAM, 64QAM and 256-QAM) Frequency Band 2.4GHz ~ 2.472GHz Operating Channel WiFi 2.4GHz: 11: (Ch. 1-11) – United States http://www.rf-link.com/ BT: USB2.0 5.
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13: (Ch. 1-13) – Europe BT 2.4GHz: Ch. 0 ~78 OS Support Linux/Android/Windows32,64 Security WMM, WPA, WPA2 Operating Temperature 0 ~ +60° C ambient temperature Storage Temperature -20 ~ 70°C ambient temperature Humidity 5 to 90 % maximum (non-condensing) Dimension 16.0x 12,.0 x 1.75mm (LxWxH) ±0.2MM 4.DC Characteristics 1） Power Supply Characteristics Symbol Parameter VDD33 3.3V I/O Supply Voltage VD10 1.05V Core Supply Voltage Minimum Typical Maximum Units 3.0 3.3 3.6 V 0.945 1.
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Specification IEEE802.11g Mode OFDM 54 Mbps 2412 ~ 2472 MHz (Ch. 1-11) – United States,13: (Ch. 1-13) – Europe) Channel frequency RX (per≤70 dBm@10%) -70 dBm TX Characteristics Min. Typ. Max. Unit Power Level (±2 dBm) 14 dBm EVM (≤-25) -25 dB 3) RF Characteristics for IEEE802.11n (BW20_MCS7) Items Contents Specification IEEE802.11n (BW20_MCS7) Mode OFDM 65 Mbps 2412 ~ 2472 MHz (Ch. 1-11) – United States,13: (Ch. 1-13) – Europe Channel frequency RX (per≤65 dBm@10%) -65 dBm TX Characteristics Min. Typ. Max.
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EVM (≤-28) -28 7) RF Characteristics for IEEE802.11n (BW40_MCS7) Items Contents Specification IEEE802.11n (BW40_MCS7) Channel frequency 5.15GHz ~ 5.25GHz 5.725GHz~5.85GHz RX (per≤63 dBm@10%) -63dBm Freq.Error(±10ppm) ±10ppm TX Characteristics Min. Typ. Max. Power Level (±2 dBm) 12 EVM (≤-28) -28 8) RF Characteristics for IEEE802.11ac (BW80_MCS9) Items Contents Specification IEEE802.11ac (BW80_MCS9) Channel frequency 5.15GHz ~ 5.25GHz 5.725GHz~5.85GHz RX (per≤56dBm@10%) -57 dBm Freq.
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(3Mbps) GFSK (1Mbps):-20dBm π/4-DQPSK (2Mbps) :-20dBm Maximum Input Level 8DPSK (3Mbps) :-20dBm 7. Pin Definition Pin Definition Description G1 GND Ground 1 NC NC 2~3 NC NC 4 VDD33 3.3V 5 VDD33 3.3V http://www.rf-link.
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6 GND Ground 7 NFC_RF_DIS NC 8 NFC_INT NC 9 NFC_CLK NC 10 NFC_DATA NC 11 COEX_RXD GPIO6 12 COEX_TXD GPIO12 13 COEX3 GPIO7 NC NC GND Ground NC NC GND Ground NC NC 23 GND Ground 24 HST_WAKE_DEV GPIO13 25 NC NC 26 GND GND 27 SUSCLK Shared with EECS. External 32K or RTC clock input 28 WL_DIS_N GPIO9 G2 GND Ground 29 WAKE_N GPIO 30 CLKREQ GPIO 14~16 17 18~19 20 21~22 PCI Express Reset Signal: active low.
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36 HSON PCI Express Transmit Differential Pair 37 HSOP PCI Express Transmit Differential Pair 38 GND Ground 39 HSIN PCI Express Receive Differential Pair 40 HSIP PCI Express Receive Differential Pair 41 GND Ground NC NC GND Ground NC NC 57 GND Ground 58 PCM_SYNC GPIO2 59 PCM_IN GPIO0 60 PCM_OUT GPIO1 61 PCM_CLK GPIO3 62 GND Ground 63 BT_DIS GPIO11 64 BT_LED LED1 65 WL_LED LED2 66 NC NC 67 HOST_WAKE_BT GPIO13 68 GND Ground 69 HSDM High-Speed USB D
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PIN1 The picture of top The picture of bottom 8. Size reference Dimensions (mm) Length Width Height 16.0 12.0 1.75 (Tolerance:±0.2mm) (Tolerance:±0.2mm) (Tolerance:±0.2mm) The PCB tolerances within + / -0.2 or so http://www.rf-link.
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9.Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times ENVIRONMENTAL Operating Operating Temperature: 0°C to +60 °C Relative Humidity: 5-90% (non-condensing) Storage Temperature: -20°C to +70°C (non-operating) Relevant Humidity: 5-95% (non-condensing) 10. RoHS compliance. This product is RoHS compliance. http://www.rf-link.
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12.Wifi 模块贴片装机前注意事项： 12.Wireless module before the SMT note: 1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再 0.12 mm. 向外扩大 0.7mm 比例开钢网，厚度按 0.12mm. 2.Can't get the wifi module bare hands when needs,must we wear the gloves and 2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以及静电 static ring. 环. 3.The furnace temperature according to the size of the customer the 3.
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FCC warning： 1. This device should be installed and operated with minimum distance 20cm between the radiator&your body. 2. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. 3.