RF-BM-ND06 Bluetooth 5.0 Module Version 1.0 Shenzhen RF-star Technology Co., Ltd. Dec.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 1 Device Overview 1.1 Description RF-BM-ND06an RF module based on Nordic Bluetooth 5.0 BLE SoC nRF52840-QIAA-R with best-in-class 32-bit ® ® ARM Cortex -M4 processor. It integrates a 32.768 kHz and a 32 MHz crystal, a power filter, an antenna matching, and a meander line inverted-F PCB antenna. It features high-performance digital interfaces, robust connection distance, and rigid reliability. It supports BLE stack v5.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 • Up to 4xSPI master/3x SPI slave with from System OFF mode • Temperature sensor EasyDMA • 4x 4-channel pulse width modulator (PWM) • Up to 2x I C compatible 2-wire master/slave 2 • 2xUART (CTS/RTS) with EasyDMA unit with EasyDMA • Quadrature decoder (QDEC) • Audio peripherals: I S, digital microphone 2 • 3xreal-time counter (RTC) interface (PDM) • 5x 32-bit timer with counter mode 1.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Integral antenna with antenna gain 0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 (2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Table of Contents 1 Device Overview ..................................................................................................................................... 1 1.1 Description.................................................................................................................................... 1 1.2 Key Features .............................................................................................................................
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 7 Contact Us............................................................................................................................................. 20 Table of Figures Figure 1. Functional Block Diagram of RF-BM-ND06 ..................................................................... 2 Figure 2. Part Number Conventions of RF-BM-ND06 .................................................................... 2 Figure 3. Pin Diagram of RF-BM-ND06 .............
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 2 Module Configuration and Functions 2.1 Module Parameters Table 1. Parameters of RF-BM-ND06 Chipset nRF52840QIAA-R Supply Power Voltage 1.8 V ~ 5.5 V, recommended to 3.3 V Frequency 2402 MHz ~ 2480 MHz Maximum Transmit Power -20.0 dBm ~ +8.0 dBm Receiving Sensitivity -96 dBm GPIO 48 Crystal 32 MHz, 32.768 kHz RAM 256 KB Flash 1 MB Package LGAPackaging Frequency Error ±20 kHz Dimension 24.0 mm x 20.5 mm x (2.20 ± 0.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 2.2 Module Pin Diagram Figure 2. Pin Diagram of RF-BM-ND06 2.3 Pin Functions Table 2. Pin Functions of RF-BM-ND06 Pin Name Chip Pin Pin Type 1 P0.12 SIO_12 - - 2 VCC Power 1.7V ~ 3.6V - 1.7V ~ 3.6V 3 VDD_HV Power 2.5V ~ 5.5V - 2.5V ~ 5.5V 4 VDD_USB 4.35V ~ 5.5V - 4.35V ~ 5.5V 5 D- D- Data- USB- 6 D+ D+ Data+ USB+ 7 P0.13 GPIO_13 - LED 8 P0.14 GPIO_14 - LED 9 P0.15 GPIO_15 - LED 10 P0.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 12 P0.18 nRESET - System reset (active low) 13 P0.19 GPIO_19 QSPI_CLK - 14 P0.20 GPIO_20 QSPI_DIO0 - 15 P0.21 GPIO_21 QSPI_DIO1 - 16 P0.22 GPIO_22 QSPI_DIO2 - 17 P0.23 GPIO_23 QSPI_DIO3 - 18 P0.24 GPIO_24 - - 19 P0.25 GPIO_25 - - 20 P1.00 GPIO_1.00 - - 21 SWDIO SWDIO - Connect to j - link 22 SWCLK SWCLK - Connect toj - link 23 NFC1 NFC1/SIO_09 - - 24 NFC2 NFC2/SIO_10 - - 25 P1.01 GPIO_1.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 39 P0.03 GPIO_0.03 - 40 P0.02 GPIO_0.02 - Temperature sensor analog Internal pull low. External pull high to enter into VSP services. 41 P0.28 GPIO_0.28 - - 42 P0.29 GPIO_0.29 - - 43 P0.30 GPIO_0.30 - - 44 P0.31 GPIO_0.31 - - 45 P0.26 GPIO_0.26 I2C_SDA I2C RTC chip. I2C data line 46 P0.27 GPIO_0.27 I2C_SCL I2C RTC chip. I2C clock line. SPI EEPROM. SPI_Eeprom_MISO, Input. 47 GPIO_0.04 P0.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Notes: (1) The operating temperature is limited to the operating temperature range of crystal. The temperature range can be wider by changing the crystal. (2) To ensure the RF performance, the ripple wave on the source must be less than ±200 mV. 3.2 Handling Ratings Table 4. Handling Ratings of RF-BM-ND06 Items Condition Storage Temperature Tstg Human Body Model HBM Min. Typ. Max.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 (running from LFRC clock) IOFF_RAMOFF_RESET System OFF, no RAM retention, wake on reset 0.40 μA IOFF_RAMOFF_LPCOMP System OFF, no RAM retention, wake on LPCOMP 0.86 μA IOFF_RAMON_RESET System OFF, full 256 kB RAM retention, wake on reset 1.86 μA 1.29 μA 0.95 μA System ON, no RAM retention, wake on any event, 5 V ION_RAMOFF_EVENT_5V supply on VDDH, REG0 output = 3.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 mode, Clock = HFXO, Regulator = DC/DC Radio transmitting @ 0 dBm output power, 1 Mbps BLE IRADIO_TX3 10.80 mA 4.82 mA 6.40 mA 6.26 mA 10.10 mA 6.53 mA 635 μA 1.24 mA 1.05 mA mode, Clock = HFXO Radio transmitting @ -40 dBm output power, 1 Mbps BLE IRADIO_TX4 mode, Clock = HFXO Radio transmitting @ 0 dBm output power, 250 kbit/s IEE IRADIO_TX5 802.15.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Mbps BLE mode, Clock = HFXO, Regulator = DC/DC CPU running CoreMark from flash, Radio transmitting @ 0 IS2 15.4 mA 16.2 mA 11.9 mA 12.7 mA dBm output power, 1 Mbps BLE mode, Clock = HFXO CPU running CoreMark from flash, Radio receiving @ 1 IS3 Mbps BLE mode, Clock = HFXO CPU running CoreMark from flash, Radio transmitting @ 0 dBm output power, 1 Mbps BLE mode, Clock = HFXO, IS4 Regulator = DC/DC, 5 V supply on VDDH, REG0 output = 3.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 4.2 Recommended PCB Footprint Figure 4. Top View of RF-BM-ND06 (mm) 4.3 Schematic Diagram Confidential Figure 5. Schematic Diagram of RF-BM-ND06 4.5 Basic Operation of Hardware Design 1. It is recommended to offerthe module with a DC stabilized power supply, a tiny power supply ripple coefficient and the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital part of module and routed in the Bottom Layer (all copper is well grounded). 5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the spurs and receiving sensitivity of the module to somedegrees; 6.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Figure 6. Recommendation of Antenna Layout 4.6 Trouble Shooting 4.6.1 Unsatisfactory Transmission Distance 1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate.The performances of ground absorption andreflectionof radio waves will be poor, when the module is tested close to the ground. 2.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower the voltage, the smaller the power is. 6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance. 4.6.2 Vulnerable Module 1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Figure 7. Recommended Reflow for Lead Free Solder 4.9 Optional Packaging Figure 8. Optional Packaging Mode Note: Default tray packaging. 5 Certification 5.1 RoHS RoHS Report No.: BLA-C-201811-A05-01 Shenzhen RF-star Technology Co., Ltd.
RF-BM-ND06 www.szrfstar.comVer1.0 - Dec., 2018 Figure 9. RoHS Certificate 6 Revision History Date Version No. Description Author 2018.10.26 V1.0 The initial version is released. Aroo Wang 2018.12.06 V1.0 Update module Parameter. Aroo Wang 7 Contact Us SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Shenzhen HQ: Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China Tel.: 86-755-8632 9687 Chengdu Branch: Add.: No. B4-12, Building No.1, No.
